公开(公告)号：US6059952A

公开(公告)日：2000-05-09

申请号：US111155

申请日：1998-07-07

申请人： Sung Kwon Kang ,  Sampath Purushothaman ,  Rajinder Singh Rai

发明人： Sung Kwon Kang ,  Sampath Purushothaman ,  Rajinder Singh Rai

IPC分类号： C25D17/16 ,  H01L21/60 ,  H05K3/32 ,  C25D5/00 ,  C23C28/02 ,  C25D5/34 ,  C25D5/50 ,  C25D7/00

CPC分类号： H01L24/83 ,  C25D17/16 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29413 ,  H01L2224/29416 ,  H01L2224/29418 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/321

摘要： Methods for forming pastes of powder particles coated with an electrically conductive coating are described. The powder particles, with or without an optional first conductive coating layer applied to their surface, are placed in contact with a cathode surface and immersed in an electroplating solution. An anode covered with a nonconducting but ion-permeable membrane is immersed in the solution in close proximity to the cathode. Agitation to move and gently tumble the powder over the cathode surface is provided. The powder particles are plated with a metal or metal alloy coating by biasing the anode with a positive voltage relative to the cathode. The coated powder is removed, rinsed and dried. The powder is added to a polymer material to form a paste which is heated to fuse the powder coating surfaces to form a network of interconnected particles and is further heated to cure the polymer. When the paste is disposed between adjacent electrically conductive surfaces, the coated particles fuse to the electrically conductive surfaces to form electrical interconnections.

摘要翻译： 描述了形成涂有导电涂层的粉末颗粒糊的方法。 将具有或不具有施加到其表面的任选的第一导电涂层的粉末颗粒放置成与阴极表面接触并浸入电镀溶液中。 用不导电但是离子可渗透的膜覆盖的阳极被浸在靠近阴极的溶液中。 提供了在阴极表面上移动并轻轻地滚动粉末的搅动。 粉末颗粒通过以相对于阴极的正电压偏置阳极而用金属或金属合金涂层镀覆。 去除涂覆的粉末，漂洗并干燥。 将粉末加入到聚合物材料中以形成糊状物，其被加热以熔化粉末涂层表面以形成互连颗粒的网络，并进一步加热以固化聚合物。 当糊料设置在相邻的导电表面之间时，涂覆的颗粒融合到导电表面以形成电互连。

公开(公告)号：US06337522B1

公开(公告)日：2002-01-08

申请号：US09106780

申请日：1998-06-30

申请人： Sung Kwon Kang ,  Sampath Purushothaman

发明人： Sung Kwon Kang ,  Sampath Purushothaman

IPC分类号： H01L23532

CPC分类号： H01L24/83 ,  B23K35/025 ,  H01L24/29 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13109 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/48 ,  H01L2224/05644 ,  H01L2224/05124 ,  H01L2224/05147

摘要： A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection between an active electronic device and its components. The electrically conducting adhesive can be a mixture comprising a polymer resin, a no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating which provides a metallurgical bond between the conducting particles as well as to the substrates. The advantages of using the electrically conducting adhesives include reduction in bonding pressure and/or bonding temperature, control of interfacial reactions, promotion of stable metallurgical bonds, enhanced reliability of the joints, and others.

摘要翻译： 公开了一种用于磁带自动键合（TAB）封装，倒装芯片封装和有源矩阵液晶显示器（AMLCD）面板的新的互连方案，其中使用导电粘合剂来形成有源电子器件和 其组件。 导电粘合剂可以是包含聚合物树脂，免清洗助焊剂，多个具有导电熔融涂层的导电颗粒的混合物，其在导电颗粒之间以及衬底之间提供冶金结合。 使用导电粘合剂的优点包括键合压力和/或粘合温度的降低，界面反应的控制，稳定的冶金键的促进，接头的可靠性提高等。

公开(公告)号：US5958590A

公开(公告)日：1999-09-28

申请号：US414070

申请日：1995-03-31

申请人： Sung Kwon Kang ,  Sampath Purushothaman ,  George Frederick Walker

发明人： Sung Kwon Kang ,  Sampath Purushothaman ,  George Frederick Walker

IPC分类号： H05K1/14 ,  H01B1/00 ,  H01B1/02 ,  H01B1/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  B32B5/16

CPC分类号： H01B1/02 ,  H01B1/026 ,  H01B1/22 ,  H05K3/321 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83886 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H05K2201/0218 ,  H05K2203/0307 ,  H05K2203/0425 ,  H05K3/3457 ,  H05K3/4007 ,  Y10T428/12181 ,  Y10T428/12229 ,  Y10T428/2991

摘要： Pastes of dendrite particles coated with an electrically conductive coating are described. A surface is placed in contact with an electrolytic or electroless plating solution. Dendrites are formed on the surface. The dendrites are exposed to another plating solution to plate a coating on the surface of the dendrites. The coated dendrites are removed from the surface to form a powder of coated dendrites. The powder is added to a polymer material to form a paste. The paste is disposed between electrical contacts on adjacent surfaces. The paste is heated to fuse the dendrite surfaces to form a network of fused dendrites which are also fused to the electrical contacts. The paste is further heated to cure the polymer to form electrical interconnections between the electrical contacts on the adjacent surfaces.

摘要翻译： 描述了涂覆有导电涂层的枝晶颗粒的浆料。 将表面放置成与电解或化学镀溶液接触。 树皮在表面形成。 将树突暴露于另一种电镀溶液以在树枝状表面上铺上涂层。 将涂覆的枝晶从表面除去以形成涂覆的树枝状粉末。 将粉末加入到聚合物材料中以形成糊状物。 糊料设置在相邻表面上的电触点之间。 加热糊状物以使枝晶表面熔合以形成融合的枝晶网络，其也与电触点融合。 进一步加热糊料以固化聚合物以在相邻表面上的电接触之间形成电互连。

公开(公告)号：US06300164B1

公开(公告)日：2001-10-09

申请号：US09559314

申请日：2000-04-27

申请人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

发明人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

IPC分类号： H01L2144

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/321 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/10234 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/256 ,  H01L2924/00

摘要： A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.

摘要翻译： 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。

公开(公告)号：US06555762B2

公开(公告)日：2003-04-29

申请号：US09345428

申请日：1999-07-01

申请人： Bernd K. Appelt ,  Jeffrey D. Gelorme ,  Sung Kwon Kang ,  Voya R. Markovich ,  Kostas Papathomas ,  Sampath Purushothaman

发明人： Bernd K. Appelt ,  Jeffrey D. Gelorme ,  Sung Kwon Kang ,  Voya R. Markovich ,  Kostas Papathomas ,  Sampath Purushothaman

IPC分类号： H05K111

CPC分类号： H01L23/49827 ,  H01B1/02 ,  H01B1/22 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/4069 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998 ,  H01L2924/00

摘要： The present invention provides a unique, high density, electronic package having a conductive composition for filling vias or through holes to make reliable vertical or Z-connects from a dielectric layer to adjacent electrical circuits. The through holes may be plated or non-plated prior to filling. A description for making high density electronic packaging using this feature is also disclosed.

摘要翻译： 本发明提供了一种独特的，高密度的电子封装，其具有用于填充通孔或通孔的导电组合物，以使得从电介质层到相邻电路的可靠的垂直或Z-连接。 通孔可以在填充之前进行镀覆或非电镀。 还公开了使用该特征制造高密度电子封装的描述。

公开(公告)号：US06120885A

公开(公告)日：2000-09-19

申请号：US106779

申请日：1998-06-30

申请人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

发明人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

IPC分类号： H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  B32B7/00 ,  B32B15/16 ,  H01L23/48 ,  H01L29/12

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H05K3/4015 ,  H01L2924/0002 ,  H05K2201/10234 ,  H05K2201/10333 ,  H05K2201/10962 ,  H05K3/321 ,  H05K3/3447 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/256

摘要： A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.

摘要翻译： 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。

公开(公告)号：US06646355B2

公开(公告)日：2003-11-11

申请号：US10036462

申请日：2002-01-07

申请人： Sung Kwon Kang ,  Sampath Purushothaman

发明人： Sung Kwon Kang ,  Sampath Purushothaman

IPC分类号： H01L23532

CPC分类号： H01L24/83 ,  B23K35/025 ,  H01L24/29 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13109 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/48 ,  H01L2224/05644 ,  H01L2224/05124 ,  H01L2224/05147

摘要： A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection between an active electronic device and its components. The electrically conducting adhesive can be a mixture comprising a polymer resin, a no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating which provides a metallurgical bond between the conducting particles as well as to the substrates. The advantages of using the electrically conducting adhesives include reduction in bonding pressure and/or bonding temperature, control of interfacial reactions, promotion of stable metallurgical bonds, enhanced reliability of the joints, and others.

摘要翻译： 公开了一种用于磁带自动键合（TAB）封装，倒装芯片封装和有源矩阵液晶显示器（AMLCD）面板的新的互连方案，其中使用导电粘合剂来形成有源电子器件和 其组件。 导电粘合剂可以是包含聚合物树脂，免清洗助焊剂，多个具有导电熔融涂层的导电颗粒的混合物，其在导电颗粒之间以及衬底之间提供冶金结合。 使用导电粘合剂的优点包括键合压力和/或粘合温度的降低，界面反应的控制，稳定的冶金键的促进，接头的可靠性提高等。

公开(公告)号：US06322685B1

公开(公告)日：2001-11-27

申请号：US09078043

申请日：1998-05-13

申请人： Sung Kwon Kang ,  Sampath Purushothaman

发明人： Sung Kwon Kang ,  Sampath Purushothaman

IPC分类号： C25D1716

CPC分类号： C25D17/18 ,  H05K3/321

摘要： A method using an electrically nonconductive cathode chamber with at least part of its wall area rendered permeable to ions and electrolytic solutions; premixing a predetermined quantity of an electroconductive powder and a first electroplating solution; filling the cathode chamber with the solution/powder mixture and a plurality of electroconductive spheres; disposing an electroconductive cathode ball connection in contact with the spheres and powder particles; securing the cathode chamber to a cap which is part of a rotary assembly that allows the rotation of the cathode chamber about its axis without twisting the aforementioned cathode ball connection positioned within said chamber; placing the cathode chamber within an anode chamber containing a second electroplating solution and an anode; rotating the cathode chamber on its axis using the rotary assembly; biasing the anode with a positive voltage in reference to the cathode ball connection causing the electroplating of a metallic coating on the surface of the said powder while it is tumbled within the rotating cathode chamber; and rinsing, cleaning, and optionally ball milling the mixture of plated powder particles and the spheres to enable easy recovery of the plated powder.

摘要翻译： 一种使用非导电阴极室的方法，其至少部分壁面对离子和电解液是可渗透的; 预混合预定量的导电粉末和第一电镀溶液; 用溶液/粉末混合物填充阴极室和多个导电球体; 设置与球体和粉末颗粒接触的导电阴极球连接; 将阴极室固定到帽子，帽子是旋转组件的一部分，其允许阴极室围绕其轴线旋转，而不会扭转位于所述腔室内的上述阴极球连接件; 将阴极室放置在包含第二电镀溶液和阳极的阳极室内; 使用旋转组件将阴极室旋转在其轴上; 相对于阴极球连接，以正电压偏压阳极，导致在旋转的阴极室内翻滚时所述粉末的表面上的金属涂层的电镀; 以及漂洗，清洁和可选地将电镀粉末颗粒和球体的混合物球磨，以便容易地回收镀覆的粉末。

公开(公告)号：US06297559B1

公开(公告)日：2001-10-02

申请号：US09107998

申请日：1998-06-30

申请人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

发明人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

IPC分类号： H01L2348

CPC分类号： H05K3/3436 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0425 ,  Y02P70/613

摘要： A new interconnection scheme of a ball grid array (BGA) module is disclosed where a solder ball is connected to the BGA module by use of an electrically conducting adhesive The electrically conducting adhesive can be a mixture comprising a polymer resin, no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating and others. The solder balls in a BGA module can also be connected to a printed circuit board by use of another electrically conductive adhesive which can be joined at a lower temperature than the first joining to the BGA module. Additionally, an electrically conducting adhesive can be formed into electrically conducting adhesive bumps which interconnect an integrated circuit device to the BGA module.

摘要翻译： 公开了一种球栅阵列（BGA）模块的新的互连方案，其中焊球通过使用导电粘合剂连接到BGA模块。导电粘合剂可以是包含聚合物树脂，不干净焊剂 ，多个具有导电性可熔涂层的导电颗粒。 BGA模块中的焊球也可以通过使用可以在比第一次接合到BGA模块的温度低的温度下接合的另一种导电粘合剂连接到印刷电路板。 此外，导电粘合剂可以形成为将集成电路器件与BGA模块互连的导电粘合剂凸块。

公开(公告)号：US06238599B1

公开(公告)日：2001-05-29

申请号：US08877991

申请日：1997-06-18

申请人： Jeffrey Donald Gelorme ,  Sung Kwon Kang ,  Sampath Purushothaman

发明人： Jeffrey Donald Gelorme ,  Sung Kwon Kang ,  Sampath Purushothaman

IPC分类号： H01B102

CPC分类号： H01L24/29 ,  H01B1/22 ,  H01L24/16 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29413 ,  H01L2224/81193 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/8388 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K1/095 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00014

摘要： A structure and method of fabrication are described. The structure is a combination of a polymeric material and particles, e.g. Cu, having an electrically conductive coating, e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material is a thermoplastic phenoxy polymer or a styrene allyl alcohol resin. The structure is disposed between two electrically conductive surfaces, e.g. chip and substrate pads, to provide electrical interconnection and adhesion between their pads.

摘要翻译： 描述了一种结构和制造方法。 该结构是聚合材料和颗粒的组合，例如。 Cu，具有导电涂层，例如 锡 施加热量以熔化相邻颗粒的涂层。 聚合物材料是热塑性苯氧基聚合物或苯乙烯烯丙醇树脂。 该结构设置在两个导电表面之间，例如， 芯片和衬底焊盘，以提供它们焊盘之间的电互连和粘合。