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公开(公告)号:US20150235920A1
公开(公告)日:2015-08-20
申请号:US14181325
申请日:2014-02-14
IPC分类号: H01L23/467 , H01L23/473
CPC分类号: H01L23/467 , H01L23/473 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/1703 , H01L2224/17181 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/06589 , H01L2225/1035 , H01L2225/1058 , H01L2225/1094 , H01L2924/15311 , H01L2924/00
摘要: Embodiments of flow diversion devices (FDDs) are disclosed herein. An FDD may include a body formed of a body material and a plurality of thermally deformable fins arranged along the body. Individual fins of the plurality of fins may include first and second materials having different coefficients of thermal expansion (CTEs). Other embodiments may be disclosed and/or claimed.
摘要翻译: 流分流装置(FDD)的实施例在此公开。 FDD可以包括由主体材料形成的主体和沿着主体布置的多个可热变形的翅片。 多个翅片中的各个翅片可以包括具有不同热膨胀系数(CTE)的第一和第二材料。 可以公开和/或要求保护其他实施例。
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公开(公告)号:US20150084202A1
公开(公告)日:2015-03-26
申请号:US14038248
申请日:2013-09-26
申请人: Georg Seidemann , Sven Albers , Teodora Ossiander , Michael Skinner , Hans-Joachim Barth , Harald Gossner , Reinhard Mahnkoph , Christian Mueller , Wolfgang Molzer
发明人: Georg Seidemann , Sven Albers , Teodora Ossiander , Michael Skinner , Hans-Joachim Barth , Harald Gossner , Reinhard Mahnkoph , Christian Mueller , Wolfgang Molzer
IPC分类号: H01L23/00 , H01L25/00 , H01L25/065
CPC分类号: H01L24/09 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/80 , H01L24/81 , H01L25/0655 , H01L25/50 , H01L2224/03444 , H01L2224/0346 , H01L2224/03602 , H01L2224/0401 , H01L2224/04042 , H01L2224/05009 , H01L2224/05013 , H01L2224/05014 , H01L2224/05015 , H01L2224/05016 , H01L2224/05553 , H01L2224/05556 , H01L2224/05571 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/06135 , H01L2224/06155 , H01L2224/06183 , H01L2224/08054 , H01L2224/08056 , H01L2224/08057 , H01L2224/08121 , H01L2224/08137 , H01L2224/08225 , H01L2224/09135 , H01L2224/09183 , H01L2224/1134 , H01L2224/131 , H01L2224/16137 , H01L2224/48137 , H01L2224/80201 , H01L2224/80895 , H01L2224/81203 , H01L2224/94 , H01L2924/00014 , H01L2924/1434 , H01L2224/03 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die.
摘要翻译: 一种装置包括第一集成电路(IC)芯片,其包括顶层,底表面,从顶层的顶表面延伸到底表面的侧壁表面,以及至少一个多表面接触垫,第二 IC芯片包括顶层,底面,从顶层的顶表面延伸到底表面的侧壁表面,以及至少一个多表面接触焊盘,其中第二IC管芯被布置为与第一IC 并且包括与第一IC管芯的多表面接触焊盘的顶表面或侧表面中的至少一个与第二IC管芯的多表面接触焊盘的顶表面接触的导电接合 。
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公开(公告)号:US20140264832A1
公开(公告)日:2014-09-18
申请号:US13802848
申请日:2013-03-14
申请人: Thorsten Meyer , Hans-Joachim Barth , Reinhard Mahnkopf , Sven Albers , Andreas Augustin , Christian Mueller
发明人: Thorsten Meyer , Hans-Joachim Barth , Reinhard Mahnkopf , Sven Albers , Andreas Augustin , Christian Mueller
IPC分类号: H01L23/00
CPC分类号: H01L24/17 , H01L23/5256 , H01L23/5382 , H01L25/0657 , H01L2224/02379 , H01L2224/0401 , H01L2224/0557 , H01L2224/131 , H01L2224/16146 , H01L2224/1703 , H01L2224/17107 , H01L2224/17154 , H01L2224/17181 , H01L2224/17517 , H01L2224/81193 , H01L2924/12042 , H01L2924/014 , H01L2924/00
摘要: A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip.
摘要翻译: 芯片布置可以包括:第一芯片,其包括第一触点,第二触点和将第一触点电耦合到第二触点的再分配结构; 包括触点的第二芯片; 以及电耦合到第一芯片的第二触点的多个互连,其中多个互连件中的至少一个互连将第一芯片的第二触点电耦合到第二芯片的触点。
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公开(公告)号:US20140252632A1
公开(公告)日:2014-09-11
申请号:US13786538
申请日:2013-03-06
申请人: Hans-Joachim Barth , Reinhard Mahnkopf , Thorsten Meyer , Sven Albers , Andreas Augustin , Christian Mueller
发明人: Hans-Joachim Barth , Reinhard Mahnkopf , Thorsten Meyer , Sven Albers , Andreas Augustin , Christian Mueller
IPC分类号: H01L23/538
CPC分类号: H01L23/5384 , H01L23/49816 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/19 , H01L25/0657 , H01L25/18 , H01L2224/02375 , H01L2224/0239 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/05569 , H01L2224/05624 , H01L2224/05647 , H01L2224/12105 , H01L2224/13025 , H01L2224/131 , H01L2224/13147 , H01L2224/16146 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/2518 , H01L2224/32225 , H01L2224/73204 , H01L2224/73259 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06548 , H01L2924/00014 , H01L2924/1421 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2224/16225 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要: A semiconductor device includes: a semiconductor chip; an extension layer extending laterally from a boundary of the semiconductor chip; a redistribution layer disposed over at least one side of the extension layer and the semiconductor chip, wherein the redistribution layer electrically couples at least one contact of the semiconductor chip to at least one contact of an interface, wherein at least a part of the interface extends laterally beyond the boundary of the semiconductor chip.
摘要翻译: 半导体器件包括:半导体芯片; 延伸层,其从半导体芯片的边界横向延伸; 重新分配层,其设置在所述延伸层和所述半导体芯片的至少一侧上,其中所述再分配层将所述半导体芯片的至少一个触点电耦合到界面的至少一个触点,其中所述界面的至少一部分延伸 横向超出半导体芯片的边界。
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公开(公告)号:US20150282367A1
公开(公告)日:2015-10-01
申请号:US14227977
申请日:2014-03-27
CPC分类号: H05K7/02 , H01L23/3128 , H01L24/19 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/24145 , H01L2224/32145 , H01L2224/73267 , H01L2224/92244 , H01L2225/06517 , H01L2225/06524 , H01L2225/06558 , H01L2924/15311 , H05K3/36 , H05K7/023 , H05K13/00 , H05K2203/06 , Y10T156/10
摘要: An electronic assembly that includes a first electronic component that includes a first substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the first substrate, a second electronic component that includes a second substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the second substrate, and wherein the back side of the first substrate is directly attached to the back side of the second substrate.
摘要翻译: 一种电子组件,其包括第一电子部件,所述第一电子部件包括具有前侧和后侧的第一基板和安装在所述第一基板的前侧上的至少一个电子组件,所述第二电子部件包括具有前部的第二基板 侧面和背面以及安装在第二基板的前侧上的至少一个电子组件,并且其中第一基板的背面直接附接到第二基板的背面。
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公开(公告)号:US20150084165A1
公开(公告)日:2015-03-26
申请号:US14034854
申请日:2013-09-24
申请人: Reinhard Mahnkopf , Wolfgang Molzer , Bernd Memmler , Edmund Goetz , Hans-Joachim Barth , Sven Albers , Thorsten Meyer
发明人: Reinhard Mahnkopf , Wolfgang Molzer , Bernd Memmler , Edmund Goetz , Hans-Joachim Barth , Sven Albers , Thorsten Meyer
IPC分类号: H01L23/538 , H01L21/768 , H01L23/00 , H01L25/00 , H01L21/56 , H01L23/522 , H01L25/07
CPC分类号: H01L23/5389 , H01L21/56 , H01L21/563 , H01L21/76898 , H01L23/3121 , H01L23/5226 , H01L23/5384 , H01L23/562 , H01L24/03 , H01L24/81 , H01L25/0657 , H01L25/074 , H01L25/50 , H01L2224/08146 , H01L2224/16148 , H01L2224/73204 , H01L2225/06513 , H01L2225/06541 , H01L2225/06544 , H01L2225/06548 , H01L2225/06568 , H01L2924/181 , H01L2924/00012
摘要: Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.
摘要翻译: 本说明书的实施例包括嵌入在微电子衬底中的堆叠微电子骰子及其制造方法。 在一个实施例中,至少一个第一微电子管芯连接到第二微电子管芯,其中在第二微电子管芯和至少一个第一微电子管芯之间提供底部填充材料。 然后通过将第一微电子管芯和第二微电子管芯层压在衬底材料中来形成微电子衬底。
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公开(公告)号:US08138539B2
公开(公告)日:2012-03-20
申请号:US11947591
申请日:2007-11-29
申请人: Hans-Joachim Barth , Erwin Ruderer , Alexander Von Glasow , Philipp Riess , Erdem Kaltalioglu , Peter Baumgartner , Thomas Benetik , Helmut Horst Tews
发明人: Hans-Joachim Barth , Erwin Ruderer , Alexander Von Glasow , Philipp Riess , Erdem Kaltalioglu , Peter Baumgartner , Thomas Benetik , Helmut Horst Tews
IPC分类号: H01L27/108 , H01L21/20
CPC分类号: H01L27/0805 , H01L23/5223 , H01L2924/0002 , H01L2924/00
摘要: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of the plurality of first parallel conductive members, and a second base member is coupled to an end of the plurality of second parallel conductive members. A connecting member is disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member includes at least one elongated via.
摘要翻译: 公开了半导体器件及其制造方法。 在一个实施例中,电容器板包括多个第一平行导电构件,以及设置在多个第一平行导电构件上的多个第二平行导电构件。 第一基座构件联接到多个第一平行导电构件的端部,并且第二基座构件联接到多个第二平行导电构件的端部。 连接构件设置在多个第一平行导电构件和多个第二平行导电构件之间,其中连接构件包括至少一个细长通孔。
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公开(公告)号:US09793220B2
公开(公告)日:2017-10-17
申请号:US13729145
申请日:2012-12-28
申请人: Hans-Joachim Barth , Horst Baumeister , Peter Baumgartner , Philipp Riess , Jesenka Veledar Krueger
发明人: Hans-Joachim Barth , Horst Baumeister , Peter Baumgartner , Philipp Riess , Jesenka Veledar Krueger
IPC分类号: G01R31/3187 , G01R31/26 , H01L23/544 , H01L27/04 , H01L23/00 , H01L23/64
CPC分类号: H01L23/544 , H01L23/562 , H01L23/642 , H01L27/04 , H01L2224/16225
摘要: A capacitive sensor and measurement circuitry is described that may be able to reproducibly measure miniscule capacitances and variations thereof. The capacitance may vary depending upon local environmental conditions such as mechanical stress (e.g., warpage or shear stress), mechanical pressure, temperature, and/or humidity. It may be desirable to provide a capacitor integrated into a semiconductor chip that is sufficiently small and sensitive to accurately measure conditions expected to be experienced by a semiconductor chip.
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公开(公告)号:US08569820B2
公开(公告)日:2013-10-29
申请号:US13344714
申请日:2012-01-06
申请人: Hans-Joachim Barth , Erwin Ruderer , Alexander Von Glasow , Philipp Riess , Erdem Kaltalioglu , Peter Baumgartner , Thomas Benetik , Helmut Horst Tews
发明人: Hans-Joachim Barth , Erwin Ruderer , Alexander Von Glasow , Philipp Riess , Erdem Kaltalioglu , Peter Baumgartner , Thomas Benetik , Helmut Horst Tews
IPC分类号: H01L27/108
CPC分类号: H01L27/0805 , H01L23/5223 , H01L2924/0002 , H01L2924/00
摘要: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of the plurality of first parallel conductive members, and a second base member is coupled to an end of the plurality of second parallel conductive members. A connecting member is disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member includes at least one elongated via.
摘要翻译: 公开了半导体器件及其制造方法。 在一个实施例中,电容器板包括多个第一平行导电构件,以及设置在多个第一平行导电构件上的多个第二平行导电构件。 第一基座构件联接到多个第一平行导电构件的端部,并且第二基座构件联接到多个第二平行导电构件的端部。 连接构件设置在多个第一平行导电构件和多个第二平行导电构件之间,其中连接构件包括至少一个细长通孔。
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公开(公告)号:US20130240884A1
公开(公告)日:2013-09-19
申请号:US13729145
申请日:2012-12-28
申请人: Hans-Joachim Barth , Horst Baumeister , Peter Baumgartner , Philipp Riess , Jesenka Veledar Krueger
发明人: Hans-Joachim Barth , Horst Baumeister , Peter Baumgartner , Philipp Riess , Jesenka Veledar Krueger
IPC分类号: H01L23/544 , H01L27/04
CPC分类号: H01L23/544 , H01L23/562 , H01L23/642 , H01L27/04 , H01L2224/16225
摘要: A capacitive sensor and measurement circuitry is described that may be able to reproducibly measure miniscule capacitances and variations thereof. The capacitance may vary depending upon local environmental conditions such as mechanical stress (e.g., warpage or shear stress), mechanical pressure, temperature, and/or humidity. It may be desirable to provide a capacitor integrated into a semiconductor chip that is sufficiently small and sensitive to accurately measure conditions expected to be experienced by a semiconductor chip.
摘要翻译: 描述了可以可重复地测量微小电容及其变化的电容传感器和测量电路。 电容可以根据当地的环境条件(例如机械应力(例如翘曲或剪切应力)),机械压力,温度和/或湿度而变化。 可能需要提供集成到半导体芯片中的电容器,该电容器足够小并且敏感以准确地测量半导体芯片预期经历的条件。
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