公开(公告)号：US08389414B2

公开(公告)日：2013-03-05

申请号：US13026651

申请日：2011-02-14

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H01L21/311

CPC分类号： H05K3/205 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/423 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

摘要翻译： 布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。 在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。 第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。 通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装 。

公开(公告)号：US20090315190A1

公开(公告)日：2009-12-24

申请号：US12306987

申请日：2007-06-29

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H01L23/538 ,  H05K1/11 ,  H01L21/60 ,  H01L21/31

CPC分类号： H05K3/205 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/423 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

摘要翻译： 布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。 在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。 第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。 通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装 。

公开(公告)号：US20090283895A1

公开(公告)日：2009-11-19

申请号：US12446899

申请日：2007-10-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/82

摘要： A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.

摘要翻译： 一种半导体器件，包括具有穿透开口的金属框架; 设置在开口内的半导体芯片; 绝缘层，设置在金属框架的上表面上，使得绝缘层覆盖作为半导体芯片的电路形成表面的上表面; 互连层，其仅在金属框架的上表面侧设置，并且绝缘材料的介入并且电连接到半导体芯片的电路; 设置在所述半导体芯片的上表面上的通孔导体，以电连接半导体芯片的电路和互连层; 以及设置在金属框架的下表面上的树脂层。

公开(公告)号：US08536691B2

公开(公告)日：2013-09-17

申请号：US12446899

申请日：2007-10-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

IPC分类号： H01L23/02

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/82

摘要： A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.

摘要翻译： 一种半导体器件，包括具有穿透开口的金属框架; 设置在开口内的半导体芯片; 绝缘层，设置在金属框架的上表面上，使得绝缘层覆盖作为半导体芯片的电路形成表面的上表面; 互连层，其仅在金属框架的上表面侧设置，并且绝缘材料的介入并且电连接到半导体芯片的电路; 设置在所述半导体芯片的上表面上的通孔导体，以电连接半导体芯片的电路和互连层; 以及设置在金属框架的下表面上的树脂层。

公开(公告)号：US07911038B2

公开(公告)日：2011-03-22

申请号：US12306987

申请日：2007-06-29

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H01L23/495

CPC分类号： H05K3/205 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/423 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

摘要翻译： 布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。 在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。 第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。 通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装 。

公开(公告)号：US20100232127A1

公开(公告)日：2010-09-16

申请号：US12439933

申请日：2007-09-04

申请人： Kentaro Mori ,  Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Kentaro Mori ,  Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/00

CPC分类号： H05K3/0097 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K3/007 ,  H05K2201/0355 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/1536 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board composite body includes a supporting substrate, and wiring boards formed on each of the upper and the lower surfaces of the supporting substrate. The supporting substrate includes a supporting body, and a metal body arranged on each of the upper and the lower surfaces of the supporting body. The wiring board comprises at least an insulation layer insulating upper and lower wirings, and a via connecting the upper and the lower wirings. The wiring board mounted on the metal body constitutes a wiring board with the metal body. Thus, the supporting body supporting the metal body is effectively used in a process of forming the wiring board on the metal body, and the wiring board composite body, which has advantageous structural and production characteristics, is provided. A semiconductor device and a method for manufacturing such wiring board composite body and the semiconductor device are also provided.

摘要翻译： 布线板复合体包括支撑基板和形成在支撑基板的上表面和下表面中的每一个上的布线板。 支撑基板包括支撑体和布置在支撑体的上表面和下表面中的每一个上的金属体。 布线基板至少包括上下布线绝缘层和连接上下布线的通孔。 安装在金属体上的布线板与金属体构成布线板。 因此，在金属体上形成配线基板的工序中，能够有效地使用支撑金属体的支撑体，具有有利的结构和制造特性的布线基板复合体。 还提供了一种用于制造这种布线板复合体和半导体器件的半导体器件和方法。

公开(公告)号：US20100103634A1

公开(公告)日：2010-04-29

申请号：US12593489

申请日：2008-03-28

申请人： Takuo Funaya ,  Shintaro Yamamichi ,  Hideya Murai ,  Kentaro Mori ,  Katsumi Kikuchi

发明人： Takuo Funaya ,  Shintaro Yamamichi ,  Hideya Murai ,  Kentaro Mori ,  Katsumi Kikuchi

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K1/16 ,  H05K1/14 ,  H05K3/02

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/20 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2201/10674 ,  H05K2203/061 ,  Y10T29/49155 ,  H01L2924/00

摘要： A circuit board includes a functional device, a circuit board embedding therein the functional device, and first and second conductive-wiring layers formed on the front and rear surfaces of the circuit board to sandwich therebetween the functional device and each include at least one conductor layer. The surface of each of the outermost patterned interconnections of the first conductive-wiring layer is exposed, and the surface of a first dielectric layer isolating the outermost patterned interconnections from one another protrudes from the surface of the each of the patterned interconnections. The patterned interconnections of the second conductive-wiring layer are connected to respective electrode terminals of the functional device, and the surface of a second dielectric layer isolating the electrode terminals from one another is substrate within the same plane as the surface of the electrode terminals disposed adjacent to the second dielectric layer.

摘要翻译： 电路板包括功能器件，嵌入功能器件的电路板以及形成在电路板的前表面和后表面上的第一和第二导电布线层，以夹在其间的功能器件，并且每个包括至少一个导体层 。 第一导电布线层的每个最外图案化互连的表面被暴露，并且隔离最外图案化互连的第一电介质层的表面从每个图案化互连的表面突出。 第二导电布线层的图案化布线连接到功能元件的各个电极端子，并且将电极端子彼此隔离的第二电介质层的表面是与设置的电极端子的表面相同的平面内的衬底 邻近第二电介质层。

公开(公告)号：US20090046441A1

公开(公告)日：2009-02-19

申请号：US12160132

申请日：2006-12-20

申请人： Takuo Funaya ,  Hideya Murai ,  Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hirokazu Honda ,  Shinichi Miyazaki

发明人： Takuo Funaya ,  Hideya Murai ,  Shintaro Yamamichi ,  Katsumi Kikuchi ,  Hirokazu Honda ,  Shinichi Miyazaki

IPC分类号： H05K1/11 ,  H05K1/18

CPC分类号： H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/19041 ,  H05K1/115 ,  H05K1/117 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/4682 ,  H05K3/4694 ,  H05K2201/0272 ,  H05K2201/0352 ,  H05K2201/09845 ,  H05K2201/09972 ,  H05K2203/0425 ,  H05K2203/061 ,  H01L2924/00 ,  H01L2224/05599

摘要： A wiring board for mounting semiconductor device, includes at least a dielectric film 1; wirings formed in the dielectric film 1; a plurality of electrode pads provided at front and back surfaces of the dielectric film with their surfaces exposed and at least portions of lateral sides of them buried into the dielectric film; vias connecting the wirings and the electrode pads. At least one via connecting each other the wirings formed in the dielectric film includes second material different from first material forming the vias connecting the wirings and the electrode pads. The wiring board for mounting semiconductor device, is effective for an increase in terminals and finer pitch of terminal intervals due to an improvement in integration, performance or multi-function of semiconductor devices, can mount semiconductor devices especially on both sides of the board at a high density and high accuracy, and furthermore, is excellent in reliability as well.

摘要翻译： 一种用于安装半导体器件的布线板，至少包括电介质膜1; 电介质膜1中形成的布线; 多个电极焊盘，其设置在电介质膜的前表面和后表面，其表面暴露，并且其侧面的至少一部分埋入电介质膜中; 连接布线和电极垫的通孔。 至少一个彼此连接的通孔形成在电介质膜中的布线包括与形成连接布线和电极焊盘的通孔的第一材料不同的第二材料。 用于安装半导体器件的布线板，由于半导体器件的集成度，性能或多功能性的提高，端子间距的增加和端子间隔的更细的间距是有效的，所以可以在半导体器件的两侧特别地安装半导体器件 高密度和高精度，此外，也具有优异的可靠性。

公开(公告)号：US08198140B2

公开(公告)日：2012-06-12

申请号：US12882277

申请日：2010-09-15

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US07674989B2

公开(公告)日：2010-03-09

申请号：US11449673

申请日：2006-06-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Takehiko Maeda ,  Hirokazu Honda ,  Kenta Ogawa ,  Jun Tsukano

IPC分类号： H01R12/04

CPC分类号： H05K1/115 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2201/09854 ,  H05K2203/1476 ,  Y10T29/49165

摘要： A wiring board for mounting a semiconductor element or electronic component having a plurality of wiring layers, an insulating layer provided between these wiring layers, and a via which is provided to the insulating layer and which electrically connects the wiring layers. In this wiring board, the cross-sectional shape of the via in the plane parallel to the wiring layers is obtained by the partial overlapping of a plurality of similar shapes (circles). Stable operation can be obtained in a semiconductor element by minimizing obstacles to increased density, effectively increasing the cross-sectional area of the via, and preventing the wiring resistance from increasing by making the cross-sectional shape of the via into a shape obtained by the partial overlapping of a plurality of similar shapes.

摘要翻译： 一种用于安装具有多个布线层的半导体元件或电子元件的布线板，设置在这些布线层之间的绝缘层，以及设置在绝缘层上并将布线层电连接的通孔。 在该布线板中，通过多个相似形状（圆圈）的部分重叠，获得与布线层平行的平面中的通孔的截面形状。 通过最小化增加密度的障碍物，有效地增加通孔的横截面积，并且通过使通孔的横截面形状成为由通孔形成的形状来防止布线电阻增加，可以在半导体元件中获得稳定的操作 多个类似形状的部分重叠。