公开(公告)号：US08928664B2

公开(公告)日：2015-01-06

申请号：US12878165

申请日：2010-09-09

申请人： Yoshiya Hasegawa ,  Kouji Takahashi ,  Masamine Abe ,  Tomoyoshi Suzuki

发明人： Yoshiya Hasegawa ,  Kouji Takahashi ,  Masamine Abe ,  Tomoyoshi Suzuki

IPC分类号： G06T11/20 ,  G09G5/22 ,  G06Q10/08 ,  G06Q40/00 ,  G06Q40/08 ,  G06Q40/06 ,  G06Q30/00

CPC分类号： G06T11/206 ,  G06Q10/087 ,  G06Q30/00 ,  G06Q40/00 ,  G06Q40/06 ,  G06Q40/08

摘要： A graph creation method includes setting on a plane a coordinate system in which three axis extend from an origin in a radial fashion, setting three evaluation results of three evaluation item for an evaluation object on each the three axis; determining a balance being one of center, circumcenter, incenter, orthocenter, and excenter of a polygon the vertices of which correspond to the three evaluation results set on the three axis; and creating on the coordinate system a graph in which the balance is set.

摘要翻译： 图形创建方法包括在平面上设置三轴从径向延伸的坐标系，在三轴上设定评价对象的三个评价项目的三个评价结果; 确定平衡是其顶点对应于在三轴上设置的三个评估结果的多边形的中心，外围中心，入口，正中心和偏心之一; 并在坐标系上创建平衡设置的图表。

公开(公告)号：US20110057928A1

公开(公告)日：2011-03-10

申请号：US12878165

申请日：2010-09-09

申请人： Yoshiya Hasegawa ,  Kouji Takahashi ,  Masamine Abe ,  Tomoyoshi Suzuki

发明人： Yoshiya Hasegawa ,  Kouji Takahashi ,  Masamine Abe ,  Tomoyoshi Suzuki

IPC分类号： G06T15/00

CPC分类号： G06T11/206 ,  G06Q10/087 ,  G06Q30/00 ,  G06Q40/00 ,  G06Q40/06 ,  G06Q40/08

摘要： A graph creation method includes setting on a plane a coordinate system in which three axis extend from an origin in a radial fashion, setting three evaluation results of three evaluation item for an evaluation object on each the three axis; determining a balance being one of center, circumcenter, incenter, orthocenter, and excenter of a polygon the vertices of which correspond to the three evaluation results set on the three axis; and creating on the coordinate system a graph in which the balance is set.

摘要翻译： 图形创建方法包括在平面上设置三轴从径向延伸的坐标系，在三轴上设定评价对象的三个评价项目的三个评价结果; 确定平衡是其顶点对应于在三轴上设置的三个评估结果的多边形的中心，外围中心，入口，正中心和偏心之一; 并在坐标系上创建平衡设置的图表。

公开(公告)号：US20100062173A1

公开(公告)日：2010-03-11

申请号：US12617740

申请日：2009-11-13

申请人： Taiji Torigoe ,  Kazutaka Mori ,  Ikuo Okada ,  Sunao Aoki ,  Kouji Takahashi ,  Minoru Ohara ,  Takehiko Hirata ,  Hideaki Kaneko

发明人： Taiji Torigoe ,  Kazutaka Mori ,  Ikuo Okada ,  Sunao Aoki ,  Kouji Takahashi ,  Minoru Ohara ,  Takehiko Hirata ,  Hideaki Kaneko

IPC分类号： B05D1/08 ,  B05D3/06

CPC分类号： C23C4/18 ,  C23C4/073 ,  C23C4/11 ,  C23C28/3215 ,  C23C28/3455 ,  F01D5/288 ,  F05D2230/31 ,  F05D2230/311 ,  F05D2230/312 ,  F05D2230/40 ,  F05D2230/90 ,  F05D2300/2118

摘要： A thermal barrier coating material, containing a metal binding layer laminated on a base material and ceramic layer laminated on the metal binding layer, the ceramic layer comprising partially stabilized ZrO2 which is partially stabilized by additives of Dy2O3 and Yb2O3.

摘要翻译： 一种热障涂层材料，其包含层叠在基底材料上的金属粘合层和层压在金属粘合层上的陶瓷层，陶瓷层包含部分稳定的ZrO 2，其部分被Dy2O3和Yb2O3的添加剂稳定。

公开(公告)号：US07417309B2

公开(公告)日：2008-08-26

申请号：US11320248

申请日：2005-12-27

申请人： Kouji Takahashi ,  Hideo Matsuki ,  Masami Ito ,  Naoyuki Aoki

发明人： Kouji Takahashi ,  Hideo Matsuki ,  Masami Ito ,  Naoyuki Aoki

IPC分类号： H01L23/02

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2224/05599

摘要： To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) attached to the conductive pattern. The circuit device further includes: a sealing resin for covering the semiconductor element (TR) and the conductive pattern with a rear surface of the conductive pattern being exposed; and a coating resin for covering the rear surface of the conductive pattern exposed from the sealing resin. The rear surface of the conductive pattern is exposed from openings of the coating resin, and the openings are arranged with rotational symmetry about a central point of the circuit device.

摘要翻译： 为了提供一个电路装置，不受安装方向的约束。 根据本发明的电路装置包括：用于形成管芯焊盘的导电图案，第一焊盘和第二焊盘; 以及附接到导电图案的半导体元件（TR）。 电路装置还包括：用于覆盖半导体元件（TR）的密封树脂和导电图案的背面露出的导电图案; 以及用于覆盖从密封树脂露出的导电图案的后表面的涂覆树脂。 导电图案的后表面从涂覆树脂的开口露出，并且开口围绕电路装置的中心点以旋转对称的方式布置。

公开(公告)号：US20080076373A1

公开(公告)日：2008-03-27

申请号：US11905063

申请日：2007-09-27

申请人： Kouji Takahashi ,  Kosuke Ota

发明人： Kouji Takahashi ,  Kosuke Ota

IPC分类号： H04B1/06

CPC分类号： H03G3/3078

摘要： In a wireless receiver apparatus including a gain control amplifier for controlling a gain of a reception signal, a maintaining device compulsorily maintains the gain of the gain control amplifier at a predetermined fixed value only in a predetermined specified interval. The maintaining device includes a latch circuit for maintaining a gain set value immediately prior to the specified interval. A start timing of the specified interval is determined by an edge of a predetermined timer start signal, and a duration of the specified interval is determined on the basis of a count of a predetermined timer clock signal and a count of a predetermined timer count set bus signal.

摘要翻译： 在包括用于控制接收信号的增益的增益控制放大器的无线接收机装置中，保持装置仅在预定的指定间隔内强制地将增益控制放大器的增益保持在预定的固定值。 保持装置包括用于在紧接指定间隔之前维持增益设定值的锁存电路。 指定间隔的开始定时由预定定时器启动信号的边缘确定，并且基于预定定时器时钟信号的计数和预定定时器计数总线的计数来确定指定间隔的持续时间 信号。

公开(公告)号：US07276793B2

公开(公告)日：2007-10-02

申请号：US11054025

申请日：2005-02-08

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L23/48

CPC分类号： H05K1/188 ,  H01L21/4821 ,  H01L21/4832 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/165 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05557 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/187 ,  H05K3/06 ,  H05K3/202 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/3512

摘要： A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.

摘要翻译： 提供一种半导体器件，其中由晶体形成的导电路径40沿着XY轴比沿着Z轴更好地嵌入绝缘树脂44中，并且导电路径40的背表面通过绝缘树脂44暴露 并密封。 通过这种布置，抑制了嵌入绝缘树脂44中的导电通路40的断裂。

公开(公告)号：US07271282B1

公开(公告)日：2007-09-18

申请号：US10019287

申请日：2000-07-19

申请人： Yasuyuki Kawahara ,  Kouji Takahashi ,  Makiko Takii

发明人： Yasuyuki Kawahara ,  Kouji Takahashi ,  Makiko Takii

IPC分类号： C07C69/74 ,  C07C69/34 ,  C07C69/75

CPC分类号： C07C69/75 ,  C07C2601/14 ,  C07C2601/16 ,  C10M105/36 ,  C10M129/72 ,  C10M171/008 ,  C10M2207/282 ,  C10M2207/2825 ,  C10M2207/34 ,  C10M2211/022 ,  C10M2211/06 ,  C10N2240/00 ,  C10N2240/22 ,  C10N2240/30 ,  C10N2240/50 ,  C10N2240/52 ,  C10N2240/54 ,  C10N2240/56 ,  C10N2240/58 ,  C10N2240/60 ,  C10N2240/66

摘要： A diester represented by the formula wherein A represents a cyclohexane ring, cyclohexene ring or benzene ring, X is H or methyl group, RX and RY are the same or different and each is C3-C18 branched-chain alkyl group, C1-C18 straight-chain alkyl group, C2-C18 straight-chain alkenyl or C3-C10 cycloalkyl, provided that when A is a benzene ring, RX and RY are different from each other and —COORX and —COORY are attached to two adjacent carbon atoms of the benzene ring, and having the following properties: 1) a total acid number of 0.05 mgKOH/g or less, 2) a sulfated ash content of 10 ppm or less, 3) a sulfur content of 20 ppm or less, 4) a phosphorus content of 20 ppm or less, 5) a peroxide value of 1.0 meq/kg or less, 6) a carbonyl value of 10 or less; 7) a volume resistivity of 1×1011Ω·cm or more, 8) a hydroxyl value of 3 mgKOH/g or less, and 9) a water content of 100 ppm or less, a process for preparing the same and a refrigerator lubricating oil comprising the diester.

摘要翻译： 由下式表示的二酯其中A表示环己烷环，环己烯环或苯环，X为H或甲基，R X和R Y相同或不同 并且各自为C 3 -C 18支链烷基，C 1 -C 18直链烷基，C 2 -C 18直链烯基或C 3 -C 10环烷基，条件是当A为苯环时，R X' SUP>和R Y'彼此不同，-COOR X和-COOR Y连接到苯环的两个相邻碳原子上 ，具有以下特性：1）总酸值为0.05mgKOH / g以下，2）硫酸灰分含量为10ppm以下，3）硫含量为20ppm以下，4）磷含量 20ppm以下，5）过氧化值为1.0meq / kg以下，6）羰基值为10以下; 7）体积电阻率为1×10 11Ω或更大，8）羟值为3mgKOH / g以下，9）水含量为100ppm以下，制备方法 和含有二酯的冰箱润滑油。

公开(公告)号：US07138296B2

公开(公告)日：2006-11-21

申请号：US10854946

申请日：2004-05-26

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L21/44

CPC分类号： H01L24/32 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48669 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48769 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85469 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device is described. A board that includes a flat back face, corresponding to a resin sealing area, and a front face that has projections is provided. The projections are formed of a metal that is integral with the board and include (a) a bonding pad provided in an area surrounded by an area that contacts an upper die, (b) a wiring that is integrated with the bonding pad and which extends to a semiconductor element mounting area, and (c) an electrode provided in one body with the wiring. A semiconductor element is mounted on the semiconductor element area and electrically connected to the bonding pad. The board is placed on a lower die and resin is filled into a space formed by the board and upper die. The board is divided into multiple devices such that the projections are separated by removing the board exposed at the back face of the resin.

摘要翻译： 对半导体装置的制造方法进行说明。 提供了包括对应于树脂密封区域的平坦背面和具有突起的前表面的板。 突起由与板成一体的金属形成，并且包括（a）设置在由与上模接触的区域包围的区域中的接合焊盘，（b）与焊盘一体化的布线，并且延伸 涉及半导体元件安装区域，以及（c）在一个主体中设置有布线的电极。 半导体元件安装在半导体元件区域上并电连接到接合焊盘。 将板放在下模上，将树脂填充到由板和上模形成的空间中。 板被分成多个装置，使得通过移除在树脂的背面露出的板来分离突起。

公开(公告)号：US20050146052A1

公开(公告)日：2005-07-07

申请号：US11054025

申请日：2005-02-08

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/98 ,  H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H01L25/16 ,  H05K1/18 ,  H05K3/06 ,  H05K3/20

CPC分类号： H05K1/188 ,  H01L21/4821 ,  H01L21/4832 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/165 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05557 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/187 ,  H05K3/06 ,  H05K3/202 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/3512

摘要： A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.

摘要翻译： 提供一种半导体器件，其中由晶体形成的导电路径40沿着XY轴比沿着Z轴更好地嵌入绝缘树脂44中，并且导电路径40的背表面通过绝缘树脂44暴露 并密封。 通过这种布置，抑制了嵌入绝缘树脂44中的导电通路40的断裂。

公开(公告)号：US06894375B2

公开(公告)日：2005-05-17

申请号：US10652184

申请日：2003-08-29

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L23/28 ,  G11B5/48 ,  H01L21/48 ,  H01L23/12 ,  H01L23/29 ,  H01L23/36 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H01L23/02 ,  H01L23/10

CPC分类号： H01L23/3135 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/4334 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10416 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same plane, so that it is readily affixed to a second supporting member (24). In addition, the top surface of the heat radiation electrode (15) is made protrusive beyond the top surfaces of the pads (14) to reduce the distance between the semiconductor chip (16) and the heat radiation electrode (15). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

摘要翻译： 散热电极（15）从绝缘树脂（13）的背面露出，金属板（23）固定在该放热电极（15）上。 该金属板（23）的后表面和柔性片的后表面基本上在相同的平面内，从而容易地固定在第二支撑构件（24）上。 此外，散热电极（15）的顶表面被突出超过焊盘（14）的顶表面，以减小半导体芯片（16）和散热电极（15）之间的距离。 因此，可以通过散热电极（15），金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。