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公开(公告)号：US11629425B2
公开(公告)日：2023-04-18
申请号：US17164539
申请日：2021-02-01
发明人： Hui Wang , Fuping Chen , Xi Wang
摘要： The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.
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公开(公告)号：US20220154357A1
公开(公告)日：2022-05-19
申请号：US17533015
申请日：2021-11-22
申请人： MODUMETAL, INC.
IPC分类号： C25D5/20 , C25D7/06 , C25D21/10 , C25D21/12 , C25D5/18 , C25D17/00 , B82Y40/00 , C25D5/08 , C25D5/10 , C25D7/04 , C25D3/04 , C25D3/12 , C25D3/20 , C25D3/22 , C25D3/30 , C25D3/34 , C25D3/38 , C25D3/42 , C25D3/44 , C25D3/46 , C25D3/48 , C25D3/54 , C25D3/56 , C25D5/12 , C25D17/06
摘要： Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.
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公开(公告)号：US20210254233A1
公开(公告)日：2021-08-19
申请号：US17180670
申请日：2021-02-19
申请人： Mark R. Schroeder
发明人： Mark R. Schroeder
IPC分类号： C25D3/56 , H01F1/055 , C25D7/00 , C25D5/00 , C25D5/02 , C25D5/20 , C25D21/10 , C25D5/54 , C03C17/10 , C03C15/00 , G01R33/07 , G01R33/09
摘要： In one example, a method to manufacture a magnetic sensor, comprises providing an electrolyte solution, submersing a substrate in the electrolyte solution, submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic, and depositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate. Other examples and related methods are also disclosed herein.
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公开(公告)号：US11078572B2
公开(公告)日：2021-08-03
申请号：US16247443
申请日：2019-01-14
发明人： Huaiyuan Wang , Ziyi Hu , Yanji Zhu , Yixing Zhu , Chijia Wang
IPC分类号： C25D11/34 , C23C18/16 , C23C18/50 , C23C18/18 , C25D5/48 , C25D5/08 , C25D17/00 , C25D5/14 , C25D7/04 , C25D5/50 , C25D5/34 , C25D5/44 , C25D15/00 , C25D3/18 , C25D5/20 , C25D5/36 , C23C18/36
摘要： Method for preparing high-strength and durable super-hydrophobic film layer on inner wall of elongated metal tube includes roughening treatment of inner wall of a metal tube, electrodepositing preparation of nickel-phosphorus alloy layer and functional coating, heat treatment, subsequent anodizing and low surface energy modification. The method greatly reduces the influence of local mass transfer resistance, and a uniform nanocrystalline film layer is electroplated under the ultrasound induction. Since only electroplating solution is filled in the tube during the preparation process, the consumption of device and raw materials is greatly reduced. Also, since silica particles are added to the electroplating solution in preparing the nanocrystalline film layer, the surface morphology can be made more uniform and denser in terms of the microscopic morphology. Nano-scale channels structures are etched, so that the super-hydrophobic inner surface can have a better ability to store air, and its water flow impact resistance is greatly enhanced.
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公开(公告)号：US10907266B2
公开(公告)日：2021-02-02
申请号：US16142789
申请日：2018-09-26
发明人： Hui Wang , Fuping Chen , Xi Wang
摘要： The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.
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公开(公告)号：US10544510B2
公开(公告)日：2020-01-28
申请号：US14729020
申请日：2015-06-02
申请人： Modumetal, Inc.
摘要： Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings.
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公开(公告)号：US20180010059A1
公开(公告)日：2018-01-11
申请号：US15543164
申请日：2015-12-04
发明人： Soo Wohn Lee , Seung Ho Kim , Tae Ho Kim , Sang Hoon Jeong , Jin Hyuk Choi
IPC分类号： C10M103/04 , C10M125/28 , C10M125/02 , C25D3/12 , C25D5/18 , C25D5/20 , C10M125/26 , C25D15/00
CPC分类号： C10M103/04 , C10M103/02 , C10M125/02 , C10M125/26 , C10M125/28 , C10M2201/041 , C10M2201/0413 , C10M2201/053 , C10M2201/10 , C10M2201/12 , C10N2220/082 , C10N2230/06 , C10N2240/10 , C10N2250/08 , C25D3/12 , C25D5/18 , C25D5/20 , C25D13/22 , C25D15/00 , F01M1/00 , F16N15/00 , F16N19/00
摘要： The present invention relates to a low-friction member imitating shark skin and a manufacturing method therefor, the low-friction member implementing a structure similar to shark skin and having riblets by stacking, in layers, composite particles formed by attaching spherical particles on the surfaces of plate-shaped particles, and thus the low-friction member has excellent low-friction characteristics. The present invention comprises: a base plate; plate-shaped particles stacked in layers on the surface of the base plate in the form of scales; and a plurality of spherical metal lubricating particles having a size smaller than that of the plate-shaped particles, and coated on the surfaces of the plate-shaped particles, wherein the metal lubricating particles are arranged in the form of a bridge connecting the base plate and the plate-shaped particles, and the plate-shaped particles to each other.
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公开(公告)号：US20170233884A1
公开(公告)日：2017-08-17
申请号：US15461866
申请日：2017-03-17
IPC分类号： C25D3/60 , C25D5/20 , B23K35/02 , H01L23/00 , B23K35/26 , B22F1/02 , C22C13/00 , F16B5/08 , B23K35/30
CPC分类号： C25D3/60 , B22F1/025 , B22F9/08 , B22F2301/10 , B22F2301/30 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/30 , B23K35/302 , B23K2101/40 , C22C9/00 , C22C13/00 , C25D3/30 , C25D5/12 , C25D5/20 , F16B5/08 , H01B1/02 , H01L24/13 , H01L2224/13014 , H01L2224/13147 , H01L2224/13582 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2924/0105 , H01L2924/01082 , H01L2924/01083 , H01L2924/0109 , H01L2924/01092 , H01L2924/12042 , H01L2924/15321 , H05K3/3436 , H05K2201/0218 , H05K2201/10734 , H01L2924/00
摘要： A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is at least 0.95. A solder plating film coated on the Cu ball is of Sn solder or a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is not more than 5 ppb and that of Th is not more than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is not more than 0./0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 μm.
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公开(公告)号：US09297088B2
公开(公告)日：2016-03-29
申请号：US13959811
申请日：2013-08-06
申请人： EBARA CORPORATION
发明人： Masashi Shimoyama , Yuji Araki , Fumio Kuriyama , Jumpei Fujikata
IPC分类号： C25D5/18 , C25D5/02 , C25D5/20 , C25D17/18 , C25D21/10 , C25D21/12 , H01L21/768 , H01L21/288 , C25D5/10 , C25D17/00
CPC分类号： C25D5/18 , C25D5/02 , C25D5/10 , C25D17/001 , C25D21/10 , C25D21/12 , H01L21/2885 , H01L21/76898
摘要： There is provided an electroplating method for a through-hole. The method includes: a first plating process, a second plating process, and a third plating process. The first plating process is a plating process of forming a metal film with a uniform thickness in the through-hole to reduce a diameter of the through-hole, the second plating process is a plating process of blocking up a central portion of the through-hole with the metal film using a PR pulsed current, and the third plating process is a plating process of completely filling the through-hole with the metal film using the plating current whose value is equal to or larger than a forward-current value of the PR pulsed current used in the second plating process.
摘要翻译： 提供了一种用于通孔的电镀方法。 该方法包括：第一电镀工艺，第二电镀工艺和第三镀覆工艺。 第一电镀工艺是在通孔中形成均匀厚度的金属膜以减小通孔的直径的电镀工艺，第二电镀工艺是封闭通孔的中心部分的电镀工艺， 使用PR脉冲电流与金属膜形成孔，并且第三电镀工艺是使用等于或大于其的正向电流值的电镀电流，用金属膜完全填充通孔的电镀工艺 PR脉冲电流用于第二电镀工艺。
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公开(公告)号：US08419917B2
公开(公告)日：2013-04-16
申请号：US12482171
申请日：2009-06-10
申请人： Yezdi Dordi , Bob Maraschin , John Boyd , Fred C. Redeker
发明人： Yezdi Dordi , Bob Maraschin , John Boyd , Fred C. Redeker
摘要： An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer.
摘要翻译： 电镀头设置在晶片的上表面上方并靠近晶片的上表面。 阳离子从阳极转移到电镀头内的电镀溶液中。 电镀溶液在电镀头的出口处向下流过多孔电阻材料以设置在晶片的上表面上。 通过电镀溶液在晶片的阳极和上表面之间建立电流。 通过存在于阳极和晶片上表面之间的多孔电阻材料均匀分布电流。 电流导致阳离子被吸引到晶片的上表面。
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