公开(公告)号：EP1056318B1

公开(公告)日：2006-10-11

申请号：EP00304230.6

申请日：2000-05-18

Applicant: TRW LucasVarity Electric Steering Ltd.

Inventor： Penketh, David Michael

IPC: H05K1/14 ,  B62D5/04

CPC classification number: H05K1/144 ,  B62D5/0406 ,  H05K1/0215 ,  H05K1/0231 ,  H05K1/0263 ,  H05K3/202 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/10409 ,  H05K2201/10636 ,  Y02P70/611

公开(公告)号：EP1503417B1

公开(公告)日：2006-09-06

申请号：EP04018024.2

申请日：2004-07-29

Applicant: NEC TOSHIBA Space Systems, Ltd.

Inventor： Ebihara, Nobuaki NEC Toshiba Space Systems, Ltd. ,  Suzuki, Naoshi NEC Toshiba Space Systems, Ltd.

IPC: H01L25/10 ,  H05K3/32 ,  H01L25/065

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/145 ,  H05K3/321 ,  H05K3/3421 ,  H05K2201/0397 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10969 ,  H01L2924/00

公开(公告)号：EP1665914A1

公开(公告)日：2006-06-07

申请号：EP04765410.8

申请日：2004-09-20

Applicant: Endress + Hauser GmbH + Co. KG

Inventor： BIRGEL, Dietmar ,  BURGER, Paul ,  HAUPTVOGEL, Karl-Peter

IPC: H05K3/30 ,  H05K1/11 ,  H05K1/18 ,  H05K13/04

CPC classification number: H05K13/0465 ,  H05K1/036 ,  H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10575 ,  H05K2201/1059 ,  H05K2203/1476 ,  Y10T29/49165

Abstract: The aim of the invention is to securely fasten wired components having a great mass or an unequal mass distribution to a printed circuit board (60) without gluing the components to the printed board or retaining the same on the printed board by means of snap-in fixtures, as is commonly done. Said aim is achieved by integrating a holding device (65) for retaining a connecting wire or pin (111) of an electronic component (110) in a connecting bore (11) used for accommodating said connecting wire or pin (111). The holding device (65) represents a constriction in the connecting bore (11) to a diameter that is smaller than the diameter of the connecting wire or pin (111). The holding device (65) can be formed by a connecting bore (11) that is configured as a one-sided bore (16) which does not entirely penetrate the printed board (60), for example. In this case, one edge remains in place as a constriction (65) which clamps the connecting pin (111) of the respective component (110) and retains said component on the printed board.

公开(公告)号：EP1168441A3

公开(公告)日：2005-06-15

申请号：EP01113671.0

申请日：2001-06-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Kuirhara, Takashi ,  Horiuchi, Michio ,  Mizuno, Shigeru ,  Tamadate, Yuka

IPC: H01L23/498

CPC classification number: H05K3/363 ,  H01L23/49805 ,  H01L23/4985 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H05K1/144 ,  H05K2201/0397 ,  H05K2201/10681

Abstract: A multi-layer wiring substrate comprises: a plurality of wiring substrates, each of the substrates comprising a plate or sheet-like insulating layer and a wiring layer formed on only one of surfaces of the insulating layer; the plurality of wiring substrates being laminated in such a manner that the insulating layer and wiring layer are alternately arranged; at least a pair of said wiring layers arranged on respective surfaces of the insulating layer being electrically connected with each other by means of connecting portions formed so as to pass through the insulating layer; and the connecting portion comprises a part of the wiring layer which is extended into a region of an opening formed so as to pass through said insulating layer and a low-melting point metal disposed in the opening and electrically connecting the part of the wiring layer with a wiring substrate formed on an adjacent insulating layer of the laminated structure.

公开(公告)号：EP1520454A1

公开(公告)日：2005-04-06

申请号：EP03762158.8

申请日：2003-06-27

Applicant: PPG Industries Ohio, Inc.

Inventor： WANG, Alan E. ,  OLSON, Kevin C. ,  DI STEFANO, Thomas H.

IPC: H05K3/44 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/0231 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09554 ,  H05K2201/10446 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A circuit board layer (2) in accordance with the present invention includes a conductive sheet (4) sandwiched between an insulating top layer (10) and an insulating bottom layer (14). The top and bottom layers (10) and (14) and the conductive sheet (4) define the circuit board layer (2) having an edge that includes an edge (20) of the conductive sheet (4). An insulating edge layer (18) covers substantially all of the edge (20) of the conductive sheet (4).

Abstract translation: 提供了一种形成一个电路板，包括（a）提供第一导电片的方法; （B）选择性地去除所述第一导电片材的一个或多个部分，以形成具有第一电路板没有被连接到通过至少一个标签中的第一面板的一个一次性部分的确从在所述第一电路板的边缘延伸的第一面板 于在所述第一面板的一次性部分的边缘; （C）施加到绝缘涂层至第一电路板，从而确实至少所述第一电路板的每个边缘从而覆盖; 和（d）在第一电路板从一次性部分的方式在所述片的至少一部分，其中分离保持附接至所述第一电路板和包括在所述第一电路板的所述导电片的暴露边缘。 因此，提供通过该方法形成的电路板。

公开(公告)号：EP1328142A3

公开(公告)日：2005-03-09

申请号：EP02028224.0

申请日：2003-01-01

Applicant: ROBERT BOSCH GMBH

Inventor： Uhland, Thomas ,  Beckbissinger, Kai ,  Mueller-Hirsch, Wolfgang ,  Schinzel, Ralf ,  Hennel, Udo

IPC: H05K3/20 ,  H05K7/14

CPC classification number: H05K3/202 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/301 ,  H05K3/305 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10651

Abstract: Es wird eine Schaltungsanordnung vorgeschlagen, die sich zum einen sehr kompakt realisieren lässt und zum anderen Schwingungsbelastungen sehr gut standhält.
Die Schaltungsanordnung ist zumindest teilweise auf einer ersten Leiterplatte (4) realisiert und umfasst mindestens ein bedrahtetes Bauelement (14, 15). Das bedrahtete Bauelement (14, 15) ist erfindungsgemäß auf einem eigenen Bauelementeträger (5) angeordnet. Außerdem sind die erste Leiterplatte (4) und der Bauelementeträger (5) übereinander angeordnet und mechanisch miteinander verbunden.

Abstract translation: 提出一种电路装置，一方面可以非常紧凑地实现，另一方面非常好地承受振动载荷。 该电路装置至少部分地在第一印刷电路板（4）上实现并且包括至少一个有线部件（14,15）。 根据本发明的引线部件（14,15）布置在单独的部件载体（5）上。 此外，第一印刷电路板（4）和部件载体（5）一个在另一个之上并且机械连接到彼此。

公开(公告)号：EP1503417A1

公开(公告)日：2005-02-02

申请号：EP04018024.2

申请日：2004-07-29

Applicant: NEC TOSHIBA Space Systems, Ltd.

Inventor： Ebihara, Nobuaki NEC Toshiba Space Systems, Ltd. ,  Suzuki, Naoshi NEC Toshiba Space Systems, Ltd.

IPC: H01L25/10 ,  H05K3/32 ,  H01L25/065

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/145 ,  H05K3/321 ,  H05K3/3421 ,  H05K2201/0397 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10969 ,  H01L2924/00

Abstract: To mount a TSOP (1) on an interposer substrate (2), leads (7) provided to the TSOP (1) are joined to pads of the interposer substrate (2) by a thermosetting conductive resin (5), and the TSOP (1) exclusive of the leads (7) is joined to ground layers formed in the interposer substrate (2) by a thermosetting conductive resin (4). The interposer substrates (2) with the TSOPs (1) mounted thereon are stacked in eight layers in such a manner that the TSOPs (1) face downward. Then, leads (8) of the upper interposer substrate (2) are joined to pads formed in the rear face of the lower interposer substrate (2) by a thermosetting conductive resin (6), so that the interposer substrates (2) adjacent in a vertical direction are connected.

Abstract translation: 为了将TSOP（1）安装在插入物基板（2）上，提供给TSOP（1）的引线（7）通过热固性导电树脂（5）与内插器基板（2）的焊盘接合，并且TSOP 引线（7）不包括通过热固性导电树脂（4）连接到形成在插入器基板（2）中的接地层。 将安装有TSOP（1）的插入器基板（2）以使TSOP（1）面朝下的方式以8层层叠。 然后，通过热固性导电树脂（6）将上部中介层基板（2）的引线（8）与形成在下部插入物基板（2）的背面的焊盘接合，使得相邻的插入基板（2） 连接垂直方向。

公开(公告)号：EP1442463A1

公开(公告)日：2004-08-04

申请号：EP02772390.7

申请日：2002-10-23

Applicant: SCHAFFNER EMV AG

Inventor： SIPPOLA, Mika, Matti

IPC: H01F27/28 ,  H05K3/36

CPC classification number: H05K3/46 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/2847 ,  H01F41/041 ,  H01F2027/2861 ,  H05K1/118 ,  H05K1/165 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/055

Abstract: The invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three-dimensional structure and its use as an electronics assembly substrate and as a winding for transformers and inductors. When a multilayer structure is manufactured by folding a conductor-insulator-conductor laminate, where the conductor layers to be separated from each other follow each other on opposite sides of the conductor-insulator-conductor laminate in the sections following each other and where the insulator has been removed from the places where the conductor layers are to be connected together after folding, it is possible to manufacture a wide range of three-dimensional multilayer structures where the volume occupied by the windings over the total volume can be maximized. Alternatively, by using the method it is also possible to manufacture a multilayer structure where components have been buried inside. The method makes it also possible to make connections between layers in a flexible manner. Among other issues, the method can be easily automated for mass-production.

Abstract translation: 本发明涉及多层结构的制造，特别涉及三维结构的制造及其作为电子组装基板和用于变压器和电感器的绕组的用途。 当通过折叠导体 - 绝缘体 - 导体层叠体来制造多层结构时，彼此分离的导体层在彼此相邻的部分中的导体 - 绝缘体 - 导体层叠体的相对侧彼此相邻，并且绝缘体 已经从折叠后导体层要连接在一起的地方去除，可以制造宽范围的三维多层结构，其中可以使总体积上的绕组占据的体积最大化。 或者，通过使用该方法，也可以制造其中部件被埋在其中的多层结构。 该方法还可以以灵活的方式在层之间进行连接。 除了其他问题之外，该方法可以容易地自动化进行批量生产。

公开(公告)号：EP0792463B1

公开(公告)日：2004-05-12

申请号：EP95940718.0

申请日：1995-11-15

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R1/073 ,  B32B15/08 ,  H01L21/66 ,  H01L23/48 ,  H01L23/49

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 °C, and can be completed in less than 60 minutes.

公开(公告)号：EP0792517B1

公开(公告)日：2003-10-22

申请号：EP95941408.7

申请日：1995-11-13

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: H01R9/00 ,  H01R29/00 ,  H01R12/20 ,  B23K31/02 ,  H05K3/30 ,  H01L23/49 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H01L21/66 ,  H01L21/68 ,  H01L23/32 ,  H05K3/24 ,  C25D5/16 ,  H01L21/603 ,  H01L21/607 ,  H01L23/538

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.