公开(公告)号：EP0792462A4

公开(公告)日：1997-12-29

申请号：EP95939968

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

Abstract translation: 探针卡组件（500）包括探针卡（502）和具有安装到其表面上的端子（522）并且在其表面上从端子（522）延伸的弹性接触结构（524）的空间变换器（506）。 插入器（504）设置在空间变换器和探针卡之间。 空间变压器和插入器堆叠在探针卡上，并且可以布置弹性接触结构以优化整个晶片的探测。

公开(公告)号：EP0792517A1

公开(公告)日：1997-09-03

申请号：EP95941408.0

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R31 ,  B23K20 ,  C23C18 ,  C25D7 ,  G01R1 ,  H01L21 ,  H01L23 ,  H01L25 ,  H01R12 ,  H01R13 ,  H01R33 ,  H05K3 ,  H05K7 ,  C25D5 ,  C25D21 ,  H01R107 ,  H05K1

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

公开(公告)号：EP0729652A1

公开(公告)日：1996-09-04

申请号：EP95901950.0

申请日：1994-11-16

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L.

IPC: H01L23 ,  C23C18 ,  C25D7 ,  G01R1 ,  G01R31 ,  H01L21 ,  H01L25 ,  H01R4 ,  H01R12 ,  H01R33 ,  H05K3 ,  H05K7 ,  G01R3 ,  H05K1

CPC classification number: H05K7/1069 ,  B23K2201/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

公开(公告)号：EP0337686A2

公开(公告)日：1989-10-18

申请号：EP89303483.5

申请日：1989-04-10

Applicant: HITACHI, LTD.

Inventor： Ogihara, Satoru ,  Numata, Shunichi ,  Miyazaki, Kunio ,  Yokoyama, Takashi ,  Takahashi, Ken ,  Soga, Tasao ,  Yamada, Kazuji ,  Shinohara, Hiroichi ,  Suzuki, Hideo

IPC: H01L23/52 ,  H01L23/50 ,  H01L23/64

CPC classification number: H01L23/642 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10318 ,  H05K2201/10704

Abstract: A semiconductor chip module has semiconductor chips (12) each having contacts on its entire front face, and a multi-layered organic circuit board (15) having a small dielectric constant intermediate ceramic substrates (11) having the same thermal expansion coefficient as that of the semiconductor chip (12), each having contacts on its front and back faces corresponding to those of the semiconductor chip (12) and being electrically connected directly in a one to one relationship. The contacts on the semiconductor chip (12) and the corresponding contacts on the substrates (11) are connected by a solder, the contacts on the other of the substrate (11) and the corresponding contacts on the multi-layered ceramic circuit board (15) are connected by respective conductive pins (14) having a predetermined flexibility and rigidity through a predetermined gap therebetween. In this way there is the possibility of the relative displacement due to theremal expansion difference between the intermediate ceramic substrate (11) and the multi-layered organic circuit board (15).

Abstract translation: 半导体芯片模块具有在其整个正面上都具有接触的半导体芯片（12）和具有小介电常数的陶瓷衬底（11）的具有相同热膨胀系数的多层有机电路板（15）具有与 所述半导体芯片（12）在其与所述半导体芯片（12）的前表面和后表面相对应的接触部分以一对一的关系直接电连接。 半导体芯片（12）上的触点和基板（11）上的相应触点通过焊料连接，基板（11）中的另一个上的触点和多层陶瓷电路板（15）上的相应触点 ）通过具有预定的柔性和刚性的相应的导电销（14）通过它们之间的预定间隙连接。 以这种方式，由于中间陶瓷基板（11）和多层有机电路板（15）之间的膨胀差异，存在相对位移的可能性。

公开(公告)号：EP3407688A1

公开(公告)日：2018-11-28

申请号：EP18171913.9

申请日：2018-05-11

Applicant: Rosemount Aerospace Inc.

Inventor： DeAngelo, Tim

IPC: H05K1/11 ,  H01R12/52 ,  H05K3/36 ,  H05K1/14

CPC classification number: H01R12/58 ,  H01R12/52 ,  H01R43/205 ,  H05K1/11 ,  H05K1/144 ,  H05K1/145 ,  H05K3/007 ,  H05K3/366 ,  H05K3/368 ,  H05K3/4644 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325

Abstract: A circuit card assembly (10; 110; 210; 310) includes a first printed wiring board (28; 128; 228; 328) with a first receiving feature (38; 138; 238; 338) and a trace (12; 112; 212; 312) attached to the first printed wiring board (28; 128; 228; 328). The three dimensional trace (12; 112; 212; 312) is formed by layer-by-layer additive manufacturing. The three dimensional trace (12; 112; 212; 312) includes first (14; 114; 214; 314) and second ends. The first end (14; 114; 214; 314) of the three dimensional trace (12; 112; 212; 312) engages with the first receiving feature (38; 138; 238; 338) of the first printed wiring board (28; 128; 228; 328). The second end of the three dimensional trace (12; 112; 212; 312) is configured to engage with a second printed wiring board (40; 140; 240; 340).

公开(公告)号：EP3308610A1

公开(公告)日：2018-04-18

申请号：EP16807031.6

申请日：2016-06-09

Applicant: MEDIGUS LTD.

Inventor： GOVRIN, Amir ,  SONNENSCHEIN, Minelu

IPC: H05K1/14 ,  H04N5/225

CPC classification number: H05K1/144 ,  A61B1/051 ,  A61B1/0607 ,  A61B1/0676 ,  A61B1/0684 ,  G02B23/243 ,  G02B23/2469 ,  G02B23/2484 ,  H04N5/2257 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/2036

Abstract: A video camera head is comprised of at least two rigid printed circuit boards (PCBS) arranged in parallel planes. The at least two PCBs are mechanically supported one above the other by pins made of an electricity conducting material that conduct electrical power from the bottom PCB to electronic components or illumination means mounted on the other PCBs and signals from a solid state sensor chip mounted on one of the other PCBs of the at least two PCBs to the bottom PCB. Several embodiments of the video camera head are described.

公开(公告)号：EP3030061A4

公开(公告)日：2017-03-29

申请号：EP14832561

申请日：2014-07-28

Applicant: KYOCERA CORP

Inventor： OTOMARU HIDEKAZU ,  KIMURA TAKASHI

IPC: H05K3/34 ,  H01L23/12

CPC classification number: H05K1/09 ,  H01L23/15 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H05K1/097 ,  H05K1/111 ,  H05K1/113 ,  H05K1/181 ,  H05K3/34 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0376 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/10318 ,  H05K2203/121

Abstract: A wiring board includes an insulating substrate (1) composed of a ceramic sintered compact; and a connection pad (2) disposed on a surface part of the insulating substrate. The connection pad includes a first portion (2a) disposed on the surface part of the insulating substrate and a second portion (2b) disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion (2b) of the connection pad is composed of platinum, and at least an exposed surface part of the first portion (2a) of the connection pad is composed of platinum containing a ceramic component. Since a brazing material used when a lead terminal is joined to the connection pad does not readily flow onto the second portion (2b), an outer periphery of the brazing material and the outer periphery of the connection pad are located at different positions, and fracture in the connection pad caused by thermal stress concentration on the outer periphery of the connection pad, or the like is suppressed. Further, an exposed surface of the connection pad is composed of platinum or platinum containing a ceramic component, and therefore does not readily oxidize. Thereby, an excellent heat-resistant wiring board or the like can be obtained.

Abstract translation: 布线板包括由陶瓷烧结体构成的绝缘基板（1） 以及设置在所述绝缘基板的表面部分上的连接焊盘（2）。 连接焊盘包括设置在绝缘基板的表面部分上的第一部分（2a）和设置在第一部分上的第二部分（2b），第二部分的外周位于第二部分的外周的内侧 第一部分。 连接焊盘的第二部分（2b）由铂构成，并且至少连接焊盘的第一部分（2a）的露出表面部分由含有陶瓷部件的铂组成。 由于当引线端子连接到连接焊盘时使用的钎焊材料不容易流入第二部分（2b），所以钎焊材料的外周和连接焊盘的外周位于不同的位置，并且断裂 在连接焊盘的外周上的热应力集中引起的连接焊盘等被抑制。 此外，连接焊盘的暴露表面由含有陶瓷组分的铂或铂组成，因此不容易氧化。 由此，可以获得优异的耐热布线板等。

公开(公告)号：EP2887415A4

公开(公告)日：2016-06-22

申请号：EP13836856

申请日：2013-09-13

Applicant: LG DISPLAY CO LTD

Inventor： KANG MINSOO ,  OH DUCKSU ,  LIM SUNG-RYUN ,  HEO DONG-HYUK

IPC: H01L51/50 ,  G02F1/1345 ,  H05B33/06 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40

CPC classification number: F21V19/0025 ,  F21K9/20 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/50 ,  H01L2251/5361 ,  H05B33/06 ,  H05B33/145 ,  H05B33/28 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09845 ,  H05K2201/10128 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611

公开(公告)号：EP1931183B1

公开(公告)日：2013-11-06

申请号：EP07023165.9

申请日：2007-11-29

Applicant: Hitachi, Ltd.

Inventor： Yokozuka, Takehide ,  Ikeda, Ukyo ,  Harada, Masahide ,  Yoshinari, Hideto

IPC: H05K1/14 ,  H05K3/32 ,  H05K1/05 ,  H05K3/36 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/144 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/328 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/0979 ,  H05K2201/1028 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10856 ,  H05K2201/10924 ,  H05K2203/0285 ,  H01L2924/00

公开(公告)号：EP2083470B1

公开(公告)日：2013-06-05

申请号：EP09150899.4

申请日：2009-01-20

Applicant: Chelton Telecom & Microwave

Inventor： Reihs, Jean-Claude

IPC: H01P1/38 ,  H05K5/02 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01P1/387 ,  H05K1/0243 ,  H05K3/3426 ,  H05K2201/1006 ,  H05K2201/10318 ,  H05K2201/10962 ,  Y02P70/613