公开(公告)号：EP1328142A2

公开(公告)日：2003-07-16

申请号：EP02028224.0

申请日：2003-01-01

Applicant: ROBERT BOSCH GMBH

Inventor： Uhland, Thomas ,  Beckbissinger, Kai ,  Mueller-Hirsch, Wolfgang ,  Schinzel, Ralf ,  Hennel, Udo

IPC: H05K3/20 ,  H05K7/14

CPC classification number: H05K3/202 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/301 ,  H05K3/305 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10651

Abstract: Es wird eine Schaltungsanordnung vorgeschlagen, die sich zum einen sehr kompakt realisieren lässt und zum anderen Schwingungsbelastungen sehr gut standhält.
Die Schaltungsanordnung ist zumindest teilweise auf einer ersten Leiterplatte (4) realisiert und umfasst mindestens ein bedrahtetes Bauelement (14, 15). Das bedrahtete Bauelement (14, 15) ist erfindungsgemäß auf einem eigenen Bauelementeträger (5) angeordnet. Außerdem sind die erste Leiterplatte (4) und der Bauelementeträger (5) übereinander angeordnet und mechanisch miteinander verbunden.

Abstract translation: 该布置至少部分地实现在电路板（4）上并且包含安装在部件载体（5）上的至少一个有线部件。 组件载体彼此并排设置并机械连接在一起。 在第一电路板上实现的部件和级之间的电连接通过部件载体进行。 AN还包括以下的独立权利要求：具有本发明电路装置的发动机控制器。

公开(公告)号：EP1303575A1

公开(公告)日：2003-04-23

申请号：EP00990184.4

申请日：2000-11-16

Applicant: 3M Innovative Properties Company

Inventor： YANG, Rui ,  MAO, Guoping

IPC: C09K13/02 ,  H05K1/00 ,  H05K3/00

CPC classification number: C09K13/02 ,  C08J7/12 ,  H05K3/002 ,  H05K2201/0141 ,  H05K2201/0397 ,  H05K2203/0786 ,  Y10T428/249953 ,  Y10T428/249958 ,  Y10T428/249975 ,  Y10T428/249979

Abstract: A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids formed therein using an etchant composition comprising a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt; and from 10 wt. % to 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from 50 °C to 120 °C.

公开(公告)号：EP1241481A2

公开(公告)日：2002-09-18

申请号：EP02004602.5

申请日：1994-11-16

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor, Y. ,  Mathieu, Gaetan, L.

IPC: G01R1/073 ,  H01L21/66 ,  H01L21/60 ,  H01L23/48

CPC classification number: H05K7/1069 ,  B23K2201/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，其包括具有表面的电子部件（102）和由电子部件（102）承载且可在表面可访问的导电接触端子（103）。 接触结构（101）包括具有第一（107）和第二端（108）的内部柔性细长构件（106），并且第一端（107）形成与导电接触端子（103）的表面的第一紧密接合， 而不使用单独的粘合材料。 提供导电外壳（116），并且由至少一层包围细长构件（106）的导电材料层形成，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合 。

公开(公告)号：EP1198001A2

公开(公告)日：2002-04-17

申请号：EP01127397.6

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: H01L21/66

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: A method of connecting to a semiconductor device comprises the steps of permanently mounting a plurality of elongate electrical contact structures (1330) to a semiconductor device (1302), the semiconductor device comprising at least one die; urging the semiconductor device against a first electronic component (1310) to effect a temporary connection between the semiconductor device and the first electronic component, with the electrical contact structures serving as electrical interconnects between the semiconductor device and the first electronic component; and using at least a plurality of the same electrical contact structures mounted to the semiconductor device to effect a permanent connection between at least one die of the semiconductor device and a second electronic component.

Abstract translation: 连接到半导体器件的方法包括将多个细长电接触结构（1330）永久地安装到半导体器件（1302）的步骤，所述半导体器件包括至少一个管芯; 使所述半导体器件抵靠第一电子部件（1310），以实现所述半导体器件与所述第一电子部件之间的临时连接，其中所述电接触结构用作所述半导体器件与所述第一电子部件之间的电互连; 以及使用安装到所述半导体器件的至少多个相同的电接触结构来实现所述半导体器件的至少一个管芯与第二电子部件之间的永久连接。

公开(公告)号：EP1187520A2

公开(公告)日：2002-03-13

申请号：EP01121380.8

申请日：2001-09-06

Applicant: Visteon Global Technologies, Inc.

Inventor： Jairazbhoy, Vivek Amir ,  Pham, Cuong Van ,  Glovatsky, Andrew Z. ,  Krautheim, Thomas Bernd ,  Belke, Robert Edward, Jr.

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4084 ,  H05K1/056 ,  H05K3/062 ,  H05K3/4092 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2203/0195 ,  H05K2203/063 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49156

Abstract: The present invention discloses a multi-layer circuit board assembly having a first circuit portion having a top surface and a bottom surface a first pre-circuit assembly which is attached to the top surface of the first circuit portion and which includes a top conductive layer. A second pre-circuit assembly is attached to the bottom surface of the first circuit portion and includes a bottom conductive layer. An aperture is formed through the first circuit portion, the first pre-circuit assembly and the second pre-circuit assembly. A plurality of tab portions are integrally formed from the top conductive layer, which extend through the aperture and which are coupled to the bottom conductive layer.

Abstract translation: 本发明公开了一种多层电路板组件，其具有具有顶表面的第一电路部分和底部表面，其被附接到所述第一电路部分的顶表面，并包括一顶导电层的第一前置电路组合件。 第二预制电路组件附接到第一电路部分的底表面并且包括底部导电层。 通过第一电路部分，第一预电路组件和第二预电路组件形成孔。 多个接片部分由顶部导电层整体形成，其延伸穿过孔并耦合至底部导电层。

公开(公告)号：EP1186478A2

公开(公告)日：2002-03-13

申请号：EP01307584.1

申请日：2001-09-06

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Kasai, Koji, c/o Sumitomo Wiring Systems, Ltd.

IPC: B60R16/02 ,  H05K7/02

CPC classification number: H05K3/328 ,  H05K3/244 ,  H05K7/026 ,  H05K2201/0397 ,  H05K2201/10272 ,  Y10S439/949

Abstract: An electrical circuit for use in an electrical junction box of a vehicle, has two bus bars (15, 20) welded to each other at a weld. A first one of the bus bars is formed of a material having an electrical conductivity selected from (a) in the range 10 to 60% and (b) not less than 60%, and the second of the two bus bars is formed of a material having an electrical conductivity of not less than 60%. At least one of the bus bars is tin-plated and at the weld the bus bars are joined through a tin-plating layer. Appropriate selection of the bus bar material in view of current loads is achieved, and good welding.

Abstract translation: 用于车辆的电接线盒的电路具有在焊接处彼此焊接的两个母线（15,20）。 母线中的第一个由具有选自（a）在10至60％和（b）不小于60％的范围内的电导率的材料形成，并且两个汇流条中的第二个由 导电率不小于60％的材料。 母线中的至少一个镀锡，并且在焊接处，母线通过镀锡层连接。 鉴于目前的负载，对母线材料进行了适当选择，焊接性良好。

公开(公告)号：EP0897653B1

公开(公告)日：2001-06-06

申请号：EP97918276.3

申请日：1997-05-01

Applicant: FORD MOTOR COMPANY LIMITED ,  FORD-WERKE AKTIENGESELLSCHAFT

Inventor： GLOVATSKY, Andrew Zachary ,  TODD, Michael, George ,  MCMILLAN, Richard, Keith, II

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0207 ,  H05K1/0206 ,  H05K1/0224 ,  H05K1/0253 ,  H05K3/4092 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2201/10689

Abstract: A circuit board is disclosed comprising a substantially non-conductive substrate (12) and first and second rigid sheets (14, 16). The first sheet (14) forms a grid pattern substantially encapsulated by the substrate (12), and a portion (20) of the first sheet extends beyond a boundary of the substrate to form a first interconnection terminal. The second sheet (16) is also substantially encapsulated by the substrate (12) and has a portion which extends beyond the boundary of the substrate (12) to form a second interconnection terminal. The second sheet (16) acts as an electromagnetic interference shield, and also has a coefficient of thermal expansion less than a coefficient of thermal expansion of the substrate (12).

公开(公告)号：EP1052736A1

公开(公告)日：2000-11-15

申请号：EP00401185.4

申请日：2000-04-28

Applicant: SAGEM SA

Inventor： Lequenne, Yves

IPC: H01R13/629 ,  H01R12/28

CPC classification number: H01R13/641 ,  H01R12/79 ,  H05K1/0268 ,  H05K1/117 ,  H05K1/148 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397

Abstract: Le composant électrique est pourvu d'une nappe souple (10) de conducteurs de liaison (11-16) qui comporte deux conducteurs (11, 16) de test de continuité raccordés par le composant et s'étendant le long des bords de la nappe (10).
L'invention s'applique bien aux cartes de circuit imprimé.

Abstract translation: 该系统使用色带中的两个可用导体来确保电缆链路的完整性。 电气部件包括承载来自第一（21）至第二（9）电路板的一组平行导体（11-16）的柔性带（10）。 该组导体包括两条外部线（11和16），用于测试连接的连续性。 这些是该组件的最外面的导体，并与第二个电路板上相应的端子焊盘（1,6）接触。 这两个端子焊盘直接连接在一起，从而可以从第一电路板（2）检测带状物到第二电路板的完整连接，从而提供完整的电路。

公开(公告)号：EP1026930A1

公开(公告)日：2000-08-09

申请号：EP00300036.1

申请日：2000-01-06

Applicant: Thomas & Betts International, Inc.

Inventor： Mason, Jeffrey W. ,  Petrocelli, William

IPC: H05K3/40

CPC classification number: H05K3/403 ,  H05K1/117 ,  H05K3/325 ,  H05K3/366 ,  H05K3/4092 ,  H05K3/4611 ,  H05K2201/0314 ,  H05K2201/0397 ,  H05K2201/0919 ,  H05K2201/10378

Abstract: The circuit traces of a circuit board extend to and usually outward from a side surface of the board for direct connection to contacts of a mating connector, circuit board or device. The contact portions of the traces are the end surfaces of the traces which in one embodiment extend outward of the plane of the associated side surface of the circuit board. The contact portion may be of greater cross-sectional area than that of the associated trace to provide a contact area of intended size. The contact portion of a trace may be plated with gold or other appropriate conductive material to enhance conductivity and prevent or minimize oxidation or corrosion. Interconnection to the contact portions of the traces is provided by mating contacts which respectively engage the contact and surfaces of the traces. Preferably, the mating contacts are resilient conductive columns or elements which are maintained in engagement with the contact ends by suitable hardware.

Abstract translation: 电路板的电路迹线延伸到板的侧表面并且通常从板的侧表面直接连接到配合连接器，电路板或器件的触点。 迹线的接触部分是迹线的端面，其在一个实施例中从电路板的相关侧表面的平面向外延伸。 接触部分可以具有比相关迹线更大的横截面积，以提供预期尺寸的接触面积。 迹线的接触部分可以镀金或其它合适的导电材料以增强导电性并防止或最小化氧化或腐蚀。 与迹线的接触部分的互连由分别接合迹线的接触面和表面的配合触点提供。 优选地，配合触点是弹性导电柱或元件，其通过合适的硬件与接触端保持接合。

公开(公告)号：EP0901695A4

公开(公告)日：2000-04-12

申请号：EP97926707

申请日：1997-05-22

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  DISTEFANO THOMAS H ,  KARAVAKIS KONSTANTINE ,  FARACI ANTHONY B ,  NGUYEN TAN

IPC: H01R11/01 ,  G01R31/28 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R12/52 ,  H01R33/76 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10 ,  H01R9/09

CPC classification number: H01L23/32 ,  H01L23/49827 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/73251 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81901 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01R12/52 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1061 ,  H05K2201/0397 ,  H05K2201/049 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: A connector (10) for microelectronic elements includes a sheetlike body (24) having a plurality of active contacts (22) arranged in a regular grid pattern. The active contacts (22) may include several metallic projections (28) extending inwardly around a hole (27) in the sheetlike element (24), on a first major surface (32). A support structure such as a grid array of noncollapsing structural posts (23) is on a second major surface (33), and each of the posts (23) is electrically connected to one of the active contacts (22). The grid array of the posts (23) and the grid array of active contacts (22) are offset from one another so that an active contact (22) is surrounded by several posts (23). The posts (23) support the sheetlike element (24) spaced away from a substrate (41) to which the posts (23) are attached. A microelectronic element (45) having bump leads (46) thereon may be engaged by contacting the bump leads (46) with the active contacts (22), and deflecting the sheetlike element (24) between the bump leads (46) on one side and the posts (23) on the other side.