公开(公告)号：EP1868242A2

公开(公告)日：2007-12-19

申请号：EP07011562.1

申请日：2007-06-13

Applicant: Hitachi, Ltd.

Inventor： Oyama, Kazuhiro ,  Mori, Mutsuhiro ,  Saito, Katsuaki ,  Koike, Yoshihiko

IPC: H01L25/00

CPC classification number: H05K1/144 ,  H01L23/24 ,  H01L25/072 ,  H01L25/16 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/147 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/10287 ,  H05K2201/10318 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An elastic printed board (102) is provided so that stress applied by the silicon gel (101) is absorbed by the printed board (102). Further, the printed board (102) is formed to be so narrow that the stress may be escaped. On the other hand, the wires on which a high voltage is applied are patterned on respective printed boards. This serves to prevent discharge through the surface of the same printed board served as current passage. This design makes it possible to hermetically close the power module, prevent intrusion of moisture or contamination as well as displacement, transformation and crack of the cover plate (105).

公开(公告)号：EP1764833A1

公开(公告)日：2007-03-21

申请号：EP05777107.3

申请日：2005-08-30

Applicant: IBIDEN CO., LTD. ,  TIBC Co. Ltd.

Inventor： KAWADE, Masanori ,  TSURUGA, Hiroyuki ,  EBINA, Makoto

IPC: H01L23/50

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/05599

Abstract: Providing a semiconductor loading lead pin which does not tilt at the time of reflow. Void B is sometimes left in solder 48 between an electrode pad 44 and the flange 20 of a semiconductor loading lead pin as shown in FIG. 3(A). When reflow is carried out to load an IC chip, solder 48 for connection is melted and at the same time, void B in the solder is expanded. Because it escapes sideway along the groove portion 24 as shown in FIG. 3(B), it does not happen that the flange 20 is raised by the void B so that the semiconductor loading lead pin 10 is tilted.

Abstract translation: 提供在回流时不倾斜的半导体负载引脚。 空隙B有时留在电极焊盘44和半导体负载引脚的凸缘20之间的焊料48中，如图1所示。 图3（A）。 当进行回流以加载IC芯片时，用于连接的焊料48熔化，同时焊料中的空隙B膨胀。 因为如图1所示沿着槽部24一侧逸出。 如图3（B）所示，不会发生凸缘20被空隙B升高，使得半导体负载引脚10倾斜。

公开(公告)号：EP1092338B1

公开(公告)日：2004-12-15

申请号：EP99933638.1

申请日：1999-06-30

Applicant: FormFactor, Inc.

Inventor： PEDERSEN, David, V. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, Y.

IPC: H05K3/32

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. A securing device such as a housing positions the electronic component securely to the socket substrate. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

公开(公告)号：EP1447846A2

公开(公告)日：2004-08-18

申请号：EP04010749.2

申请日：1995-11-13

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin, N. ,  Grube, Gary, W. ,  Dozier, Thomas, H.

IPC: H01L23/48 ,  H05K7/10 ,  H01R43/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: According to the invention a socket is provided for removably connecting a first electronic component (304) to a second electronic component (302). The socket comprises a plurality of elongate, resilient contact structures (320) extending away from a first surface (310a) of a support substrate (310), contact regions (320b) of said elongate, resilient contact structures (320) deflecting to form pressure connections with terminals (308) of the first electronic component (304); and a plurality of contact structures (314) disposed on the opposing surface (310b) of the support substrate (310), the plurality of contact structures permanently connected to terminals of the second electronic component (302), selected ones of the contact structures (314) are connected through the support substrate (310) to selected ones of the elongate, resilient contact structures (320). Each of the plurality of elongate contact structures of the socket comprises an elongate element (122) of a first material; and a second material (124) deposited on the first material, wherein the second material has a yield strength that is greater than a yield strength of the first material. Further a method for removably connecting a first electronic component (304) to a second electronic component (302) is provided.

Abstract translation: 根据本发明，提供了用于将第一电子部件（304）可拆卸地连接到第二电子部件（302）的插座。 插座包括从支撑衬底（310）的第一表面（310a）延伸的多个细长的弹性接触结构（320），所述细长弹性接触结构（320）的接触区域（320b）偏转以形成压力 与第一电子部件（304）的端子（308）的连接; 以及设置在所述支撑基板（310）的相对表面（310b）上的多个接触结构（314），所述多个接触结构永久地连接到所述第二电子部件（302）的端子，所述接触结构 314）通过支撑衬底（310）连接到细长的弹性接触结构（320）中的选定的一个。 插座的多个细长接触结构中的每一个包括第一材料的细长元件（122） 和沉积在第一材料上的第二材料（124），其中第二材料的屈服强度大于第一材料的屈服强度。 此外，提供了一种用于可拆卸地将第一电子部件（304）连接到第二电子部件（302）的方法。

公开(公告)号：EP1315243A3

公开(公告)日：2004-01-28

申请号：EP02026007.1

申请日：2002-11-21

Applicant: HIROSE ELECTRIC CO., LTD.

Inventor： Matsuo, Tsutomu, Hirose Electric Co., Ltd.

IPC: H01R12/16

CPC classification number: H01R12/7076 ,  H01R12/716 ,  H05K1/141 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/2018 ,  H05K2203/1572

Abstract: An electronic component assembly mounted on a circuit board (1) comprises an intermediate connector (2) mounted on the circuit board and having a first space (7) for accommodating first electronic components (8A, 8B, and 8C) provided on the circuit board and a unit body (11) provided on the intermediate connector and connected to the circuit board through the intermediate connector. The unit body comprises a connector member (12) having a second space (16) and a mounting member (13) having second electronic component (19A, 19B, and 19C) accommodated in the second space.

公开(公告)号：EP1255300A2

公开(公告)日：2002-11-06

申请号：EP02009036.1

申请日：2002-04-23

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Kei, Murayama

IPC: H01L23/498

CPC classification number: H05K1/111 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/4602 ,  H05K2201/09663 ,  H05K2201/09772 ,  H05K2201/10318 ,  Y02P70/611 ,  H01L2224/0401

Abstract: A semiconductor package provided with an interconnection layer including an interconnection pattern and pad formed on an insulating substrate or insulating layer, a protective layer covering the interconnection layer except at the portion of the pad and the insulating substrate or insulating layer, and an external connection terminal bonded with the pad exposed from the protective layer, the pad to which the external connection terminal is bonded being comprised of a plurality of pad segments, sufficient space being opened for passing an interconnection between pad segments, and the pad segments being comprised of at least one pad segment connected to an interconnection and other pad segments not connected to interconnections.

Abstract translation: 一种半导体封装，其具有包括形成在绝缘基板或绝缘层上的互连图案和焊盘的互连层，覆盖所述焊盘和所述绝缘基板或绝缘层的部分以外的所述互连层的保护层，以及外部连接端子 与从保护层暴露的焊盘接合，外部连接端子被接合到的焊盘由多个焊盘段组成，足够的空间被打开以通过焊盘段之间的互连，并且焊盘段至少包括 连接到互连的一个焊盘段和未连接到互连的其它焊盘段。

公开(公告)号：EP1232828A1

公开(公告)日：2002-08-21

申请号：EP02003251.2

申请日：1996-05-24

Applicant: FORMFACTOR, INC.

Inventor： Eldridge, Benjamin N. ,  Mathieu, Gaetan L.

IPC: B23K20/00 ,  H01L21/60

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/07314 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1532 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/81205

Abstract: A method of stimulating production of photo-electrons at a cathode element (118) of an EFO system (116) of a wire bonder (100) is disclosed. Said method comprises illuminating the cathode element (118) of the EFO component with ultraviolet light having sufficient energy to stimulate the production of photo-electrons at the cathode element (118).

Abstract translation: 公开了一种在引线接合器（100）的EFO系统（116）的阴极元件（118）处刺激光电子产生的方法。 所述方法包括用具有足够能量的紫外光照射EFO组分的阴极元件（118），以刺激在阴极元件（118）处产生光电子。

公开(公告)号：EP1176661A1

公开(公告)日：2002-01-30

申请号：EP00308133.8

申请日：2000-09-18

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Barnett, Ron ,  Buondelmonte, Charles Joseph ,  Korisch, Alexander ,  Manzione, Louis Thomas ,  Schwartz, Richard F. ,  Wu, Hui

IPC: H01P1/04

CPC classification number: H05K1/162 ,  H01P1/047 ,  H05K1/0239 ,  H05K1/144 ,  H05K2201/10318

Abstract: A resonant capacitive coupler (124) couples signals across a gap (126) between signal transmission lines (112, 118) of two printed wiring boards (100, 102). The coupler has a conductive contact member that is either positioned in close proximity to one of the transmission lines (112) or is connected to the one transmission line via a dielectric, and forms a capacitor therewith. The coupler further has a conductive interconnect member that is connected to the contact member, and also to the other transmission line (108) either directly or via a second conductive contact member.
The conductive interconnect member is dimensioned to have an inductive impedance at the frequency of the signals that equals, and hence cancels out, the capacitive impedance of the one or two capacitors formed by the one or two contact members. The coupler therefore resonates at the signal frequency, and relative to conventional capacitive coupling achieves a low-loss interconnection over large gaps while requiring only small capacitance to do so.

Abstract translation: 谐振电容耦合器（124）跨越两个印刷电路板（100,102）的信号传输线（112,118）之间的间隙（126）耦合信号。 耦合器具有导电接触构件（202或302），其被定位成紧邻传输线（112）之一或者经由电介质（204或304）连接到一个传输线，并且与其形成电容器 。 耦合器还具有直接（图3）或经由第二导电接触构件（202）连接到接触构件并且还连接到另一个传输线（108）的导电互连构件（200或300）（图3 2）。 导电互连构件的尺寸被设计成在信号的频率处具有感应阻抗，该感应阻抗等于并因此抵消由一个或两个接触构件形成的一个或两个电容器的电容性阻抗。 因此，耦合器以信号频率谐振，并且相对于传统的电容耦合在大间隙上实现低损耗互连，同时仅需要小的电容。

公开(公告)号：EP0536802B1

公开(公告)日：2000-08-23

申请号：EP92117417.3

申请日：1992-10-12

Applicant: NEC CORPORATION

Inventor： Inasaka, Jun

IPC: H01L21/48

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L2224/16 ,  H01L2924/09701 ,  H05K3/225 ,  H05K3/301 ,  H05K3/303 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10704 ,  Y02P70/613

公开(公告)号：EP0959648A1

公开(公告)日：1999-11-24

申请号：EP98900160.7

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： ISHIDA, Naoto ,  ASANO, Kouji

IPC: H05K1/14 ,  H05K3/36 ,  H01L23/12

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 greater than an opening diameter of the through hole and forming a joining portion to the opposite party pad, and a leg portion 12 having a size capable of inserting this leg portion into the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. A joining ball approximately having a spherical shape instead of the joining pin can be also joined to the through hole by the conductive material.