公开(公告)号：EP2104136A4

公开(公告)日：2012-03-07

申请号：EP07850933

申请日：2007-12-19

Applicant: IBM

Inventor： OYAMA YUKIFUMI ,  TORIYAMA KAZUSHIGE ,  NISHIWAKI HIDETOSHI ,  ORII YASUMITSU ,  NISHIO TOSHIHIKO

IPC: H01L21/60

CPC classification number: H01L24/13 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2201/40 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/7515 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/3478 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/049 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: After preliminary supply of an equal amount of solder to all of stud-bumps of a semiconductor part, establishing solder connection between the stud-bumps and connecting pads of a circuit substrate. A method for mounting a semiconductor part on a circuit substrate is provided, which includes the steps of preparing the semiconductor part (10) having a surface thereof provided with a plurality of stud-bumps (12), preparing a solder substrate (13) having a surface thereof on which solid-solders (14) corresponding to respective of the plurality of stud-bumps (12) are arranged, preparing the circuit substrate (20) having a surface thereof provided with connecting pads (21) corresponding to respective of the plurality of stud-bumps, attaching, to respective tip ends of the plurality of stud bumps, the corresponding solid-solders on the solder substrate, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective of the tip ends of the stud-bumps with the corresponding connecting pads, and melting the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective of the stud-bumps and the corresponding connecting pads.

公开(公告)号：EP2175485A3

公开(公告)日：2011-06-01

申请号：EP09305859.2

申请日：2009-09-17

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Marion, François

IPC: H01L23/485 ,  H01L21/60 ,  H01L21/98 ,  H05K3/30 ,  H05K3/34 ,  H01R4/02

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/1147 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16503 ,  H01L2224/81136 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/85365 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0367 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05552

Abstract: La présente invention concerne un dispositif de connexion entre deux composants (1, 1') comprenant un insert conducteur creux (2), dans lequel est emboîté un autre insert conducteur (3), la connexion électrique entre les deux inserts étant assurés à l'aide d'un élément de soudure (4), ainsi qu'un procédé d'hybridation entre deux composants dotés de tels inserts.

公开(公告)号：EP2293324A1

公开(公告)日：2011-03-09

申请号：EP09769870.8

申请日：2009-06-18

Applicant: Panasonic Corporation

Inventor： SASAOKA, Tatsuo, c/o Panasonic Corporation IPROC ,  TOYODA, Kaori, c/o Panasonic Corporation IPROC ,  NISHIWAKI, Kentaro, c/o Panasonic Corporation IPROC ,  IKEUCHI, Hiroki, c/o Panasonic Corporation IPROC ,  NASU, Hiroshi, c/o Panasonic Corporation IPROC

IPC: H01L21/60 ,  H01L21/52 ,  H05K3/32 ,  H01B1/22 ,  H01L33/00

CPC classification number: H01L33/62 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L31/024 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/29076 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83207 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/2036 ,  H05K2203/1131 ,  H05K2203/1178 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2224/29298 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00014

Abstract: A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21 a of the electronic component 3 and is used as a spacer.

Abstract translation: 提供一种安装结构，其可以允许当执行热处理时产生的气体有效逸出到外部。 安装结构10包括具有电极2a和2b的基板1，具有电极21a和21b的电子部件3，将基板1的电极2a和2b与电子部件的电极21a和21b电连接的接头15a和15b 并且还将电子部件3固定到基板1的表面，以及与基板1的电极2a和电子部件3的电极21a接触并用作间隔件的凸部4。

公开(公告)号：EP2232964A1

公开(公告)日：2010-09-29

申请号：EP08862313.7

申请日：2008-12-03

Applicant: Micron Technology, Inc.

Inventor： LEE, Teck, Kheng

IPC: H05K3/40

CPC classification number: H01L24/14 ,  H01L21/4846 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20105 ,  H01L2924/20106 ,  H05K3/06 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0315 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00012

Abstract: A method is disclosed which includes forming a layer of conductive material above a substrate, forming a masking layer above the layer of conductive material, performing a first etching process on the layer of conductive material with the masking layer in place, removing the masking layer and, after removing the masking layer, performing an isotropic etching process on the layer of conductive material to thereby define a plurality of piercing bond structures positioned on the substrate.

公开(公告)号：EP1705972A4

公开(公告)日：2010-05-19

申请号：EP05738530

申请日：2005-04-28

Applicant: IBIDEN CO LTD

Inventor： KARIYA TAKASHI ,  FURUTANI TOSHIKI

IPC: H05K3/46 ,  H01L23/498 ,  H05K1/02 ,  H05K3/28 ,  H05K3/40

CPC classification number: H05K1/0271 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49151 ,  Y10T29/49162 ,  H01L2224/0401

Abstract: A multilayer printed wiring board 10 includes: a build-up layer 30 that is formed on a core substrate 20 and has a conductor pattern 32 disposed on an upper surface; a low elastic modulus layer 40 that is formed on the build-up layer 30; lands 52 that are disposed on an upper surface of the low elastic modulus layer 40 and connected via solder bumps 66 to a IC chip 70; and conductor posts 50 that pass through the low elastic modulus layer 40 and electrically connect lands 52 with conductor patterns 32. The conductor posts 50 have the aspect ratio Rasp (height/minimum diameter) of not less than 4 and the minimum diameter exceeding 30µm, and the aspect ratio Rasp of external conductor posts 50a, which are positioned at external portions of the low elastic modulus layer 40, is greater than or equal to the aspect ratio Rasp of internal conductor posts 50b, which are positioned at internal portions of the low elastic modulus layer 40.

公开(公告)号：EP2175485A2

公开(公告)日：2010-04-14

申请号：EP09305859.2

申请日：2009-09-17

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： Marion, François

IPC: H01L23/485 ,  H01L21/60 ,  H01L21/98 ,  H05K3/30 ,  H05K3/34 ,  H01R4/02

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/1147 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16503 ,  H01L2224/81136 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/85365 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0367 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05552

Abstract: La présente invention concerne un dispositif de connexion entre deux composants (1, 1') comprenant un insert conducteur creux (2), dans lequel est emboîté un autre insert conducteur (3), la connexion électrique entre les deux inserts étant assurés à l'aide d'un élément de soudure (4), ainsi qu'un procédé d'hybridation entre deux composants dotés de tels inserts.

Abstract translation: 该装置具有一个中空的导电插入件雄性（2）进入其中导电的母插件（3）被装配，其中的两个插入件之间的电连接通过焊接元件（4）提供。 空心导电雄性插入件具有到环形设计的横截面那样是圆形，椭圆形或平行六面，其中长度或插入件中的一个的直径（D）比所述两个插入件的壁之间的距离大得多。 将粘合剂组分（1）的表面上装配插入之前插入件之间沉积。 因此独立claimsoft被包括为用于确保两个部件的杂交的方法。

公开(公告)号：EP1843391A4

公开(公告)日：2009-12-30

申请号：EP06811611

申请日：2006-10-11

Applicant: MURATA MANUFACTURING CO

Inventor： KIMURA MASAHIRO ,  SAITO YOSHIFUMI

IPC: H01L23/12 ,  H01L25/00 ,  H01L25/04 ,  H01L25/18 ,  H05K1/14 ,  H05K3/46

CPC classification number: H05K1/141 ,  H01L23/15 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/284 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/10477 ,  H05K2203/308 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2117082A1

公开(公告)日：2009-11-11

申请号：EP06822495.5

申请日：2006-10-27

Applicant: Asahi Denka Kenkyusho Co., Ltd.

Inventor： MIZOGUCHI, Masanori

IPC: H01R12/04 ,  H01R12/32 ,  H05K1/14

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

Abstract: An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection is inserted in the through-hole, through the small aperture, and mechanically contacts the pad.

Abstract translation: 一种电连接结构，其允许降低高度并易于拆卸，其中第一连接构件包括柔性基底，该柔性基底包括柔性绝缘膜，至少一个导电垫在至少一个侧面上形成，导电电路图案从 衬垫，在衬垫内的平面位置处形成通过其厚度的通孔，以及形成在衬垫内的平面位置并与通孔连通的小孔，第二连接构件包括形成在 至少一个侧面，并与形成在第二连接构件内部或第二连接构件上的导电电路图形电连接，其中电连接形成为使得导电突起通过小孔插入到通孔中，并机械地 联系垫

公开(公告)号：EP1554915B1

公开(公告)日：2009-10-28

申请号：EP03726799.4

申请日：2003-05-13

Applicant: International Business Machines Corporation

Inventor： Hougham, Gareth G. ,  Fogel, Keith E. ,  Lauro, Paul A. ,  Zinter, Joseph

IPC: H01R13/24 ,  H05K3/40

CPC classification number: H01R13/2414 ,  H01R12/7082 ,  H01R12/714 ,  H01R43/007 ,  H05K3/4007 ,  H05K3/42 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0959 ,  H05K2201/10378 ,  Y10S439/931 ,  Y10T442/109 ,  Y10T442/172

公开(公告)号：EP1871153A3

公开(公告)日：2009-04-08

申请号：EP07011995.3

申请日：2007-06-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Muramatsu, Shigetsugu ,  Kobayashi, Tsuyoshi ,  Kurihara, Takshi

IPC: H05K3/40 ,  H05K3/32 ,  H01L23/498

CPC classification number: H05K3/4647 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/48227 ,  H05K1/111 ,  H05K3/108 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09909 ,  Y02P70/611

Abstract: In a semiconductor apparatus, a semiconductor element (70,71) is mounted on a wiring substrate (31). Wiring patterns (40) and protrusions (32) are formed on a surface of a substrate (30) with the wiring patterns (40) extending on tops of the protrusions (32). The surface of the substrate (30) on which the wiring patterns (40) are formed are covered with an insulating layer (60). Surfaces of connection parts (40c) of the wiring patterns (40) formed on the tops of the protrusions (32) are formed with the surfaces of the connection parts (40c) exposed to a surface of the insulating layer (60) on a level with the surface of the insulating layer (60) or in a position lower than the surface of the insulating layer. The connection parts (40c) are formed as pads for connection formed in alignment with connection electrodes of the semiconductor element. The semiconductor element (70,71) is mounted by making electrical connection to the connection parts (40c) by flip chip bonding.