公开(公告)号：US20120001308A1

公开(公告)日：2012-01-05

申请号：US13173248

申请日：2011-06-30

申请人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

发明人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/32 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/291 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.

摘要翻译： 在半导体模块中，第一散热器设置在构成上臂的第一半导体芯片的后表面上，第二散热器通过第一端子设置在第一半导体芯片的前表面上。 第三散热器设置在构成下臂的第二半导体芯片的后表面上，第四散热器通过第二端子设置在第二半导体芯片的前表面上。 用于连接上臂和下臂的连接部分与第一端子成一体，并且相对于第一端子倾斜地连接到第三散热器。

公开(公告)号：US20110317366A1

公开(公告)日：2011-12-29

申请号：US13170554

申请日：2011-06-28

申请人： Keita FUKUTANI ,  Kuniaki Mamitsu

发明人： Keita FUKUTANI ,  Kuniaki Mamitsu

IPC分类号： H05K7/20 ,  H05K13/00

CPC分类号： H05K1/028 ,  H01L23/4012 ,  H01L23/473 ,  H01L23/5387 ,  H01L23/5389 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/0061 ,  H05K3/4632 ,  H05K7/20927 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/10166 ,  Y10T29/49002 ,  H01L2924/00

摘要： In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.

摘要翻译： 在电路板到冷却器的固定结构中，电路板包括布线部分，电连接到布线部分的电子部件和将布线部分和电子部件嵌入其中的绝缘基材。 绝缘基材包括其中嵌入电子部件的嵌入部分和在嵌入部分之间具有柔性的弯曲部分。 冷却器具有沿第一方向排列的固定部。 电路板在弯曲弯曲部分时固定在冷却器上。 弯曲部分与一个固定部分的端部相对，并且每个嵌入部分保持在相邻的两个固定部分之间，使得嵌入部分的相对表面与相邻的两个固定部分的表面紧密接触。

公开(公告)号：US08547697B2

公开(公告)日：2013-10-01

申请号：US13170554

申请日：2011-06-28

申请人： Keita Fukutani ,  Kuniaki Mamitsu

发明人： Keita Fukutani ,  Kuniaki Mamitsu

IPC分类号： H05K7/20

CPC分类号： H05K1/028 ,  H01L23/4012 ,  H01L23/473 ,  H01L23/5387 ,  H01L23/5389 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/0061 ,  H05K3/4632 ,  H05K7/20927 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/10166 ,  Y10T29/49002 ,  H01L2924/00

摘要： In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.

摘要翻译： 在电路板到冷却器的固定结构中，电路板包括布线部分，电连接到布线部分的电子部件和将布线部分和电子部件嵌入其中的绝缘基底材料。 绝缘基材包括其中嵌入电子部件的嵌入部分和在嵌入部分之间具有柔性的弯曲部分。 冷却器具有沿第一方向排列的固定部。 电路板在弯曲弯曲部分时固定在冷却器上。 弯曲部分与一个固定部分的端部相对，并且每个嵌入部分保持在相邻的两个固定部分之间，使得嵌入部分的相对表面与相邻的两个固定部分的表面紧密接触。

公开(公告)号：US08497572B2

公开(公告)日：2013-07-30

申请号：US13173248

申请日：2011-06-30

申请人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

发明人： Keita Fukutani ,  Kuniaki Mamitsu ,  Yasushi Ookura ,  Masayoshi Nishihata ,  Hiroyuki Wado ,  Syun Sugiura

IPC分类号： H01L23/34

CPC分类号： H01L24/32 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/291 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.

摘要翻译： 在半导体模块中，第一散热器设置在构成上臂的第一半导体芯片的后表面上，第二散热器通过第一端子设置在第一半导体芯片的前表面上。 第三散热器设置在构成下臂的第二半导体芯片的后表面上，第四散热器通过第二端子设置在第二半导体芯片的前表面上。 用于连接上臂和下臂的连接部分与第一端子成一体，并且相对于第一端子倾斜地连接到第三散热器。

公开(公告)号：US10079226B2

公开(公告)日：2018-09-18

申请号：US13357690

申请日：2012-01-25

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： H01L23/36 ,  H01L25/11 ,  H01L23/473 ,  H05K7/20 ,  H01L23/40

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

公开(公告)号：US07235876B2

公开(公告)日：2007-06-26

申请号：US11516501

申请日：2006-09-07

申请人： Tomomi Okumura ,  Yoshitsugu Sakamoto ,  Naohiko Hirano ,  Kuniaki Mamitsu

发明人： Tomomi Okumura ,  Yoshitsugu Sakamoto ,  Naohiko Hirano ,  Kuniaki Mamitsu

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/051 ,  H01L23/492 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block between the second metallic plate and the semiconductor element; a solder member between the second metallic plate and the block; and a resin mold. The heat radiation surface is exposed from the resin mold. The second metallic plate includes a groove for preventing the solder member from expanding outside of the block. The groove is disposed on the inner surface and disposed on an outer periphery of the block. The second metallic plate further includes an inner surface member on an inner surface of the groove. The inner surface member has a solder wettability, which is larger than a solder wettability of the block.

公开(公告)号：US20050167802A1

公开(公告)日：2005-08-04

申请号：US11019242

申请日：2004-12-23

申请人： Naohiko Hirano ,  Kuniaki Mamitsu

发明人： Naohiko Hirano ,  Kuniaki Mamitsu

IPC分类号： H01L23/40 ,  H01L21/28 ,  H01L21/44 ,  H01L21/50 ,  H01L21/60 ,  H01L23/02 ,  H01L23/34 ,  H01L23/433 ,  H01L23/488 ,  H01L23/492 ,  H01L25/07

CPC分类号： H01L24/33 ,  H01L23/4334 ,  H01L23/488 ,  H01L24/32 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/32258 ,  H01L2224/33181 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes first and second semiconductor elements, a first metal body attached to a first side of the semiconductor elements by a first solder portion, a second metal body attached to a second side of the semiconductor elements with a second solder portion, and a resin mold sealing the semiconductor elements, the first metal body and the second metal body by encapsulating them. In the semiconductor device having the second side as an element disposition surface, strain measurement caused by heat stress is maximum at the first solder portion among soldering portions of the semiconductor elements.

摘要翻译： 半导体器件包括第一和第二半导体元件，通过第一焊料部分附着到半导体元件的第一侧的第一金属体，用第二焊料部分附着到半导体元件的第二侧的第二金属体，以及 树脂模具通过封装半导体元件，第一金属体和第二金属体来密封。 在具有作为元件配置面的第二面的半导体器件中，在半导体元件的焊接部中的第一焊料部处，由热应力引起的应变测量最大。

公开(公告)号：US06798062B2

公开(公告)日：2004-09-28

申请号：US10699838

申请日：2003-11-04

申请人： Kuniaki Mamitsu ,  Yasuyoshi Hirai

发明人： Kuniaki Mamitsu ,  Yasuyoshi Hirai

IPC分类号： H01L2334

CPC分类号： H01L24/33 ,  H01L23/051 ,  H01L23/4006 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29386 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/37147 ,  H01L2224/40137 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01094 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.

公开(公告)号：US08441122B2

公开(公告)日：2013-05-14

申请号：US12805733

申请日：2010-08-17

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu ,  Ken Sakamoto ,  Tetsuo Fujii ,  Akira Tai ,  Kazuo Akamatsu ,  Masayoshi Nishihata

IPC分类号： H01L23/34

CPC分类号： H01L23/3192 ,  H01L23/4334 ,  H01L23/492 ,  H01L24/01 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/48491 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor device includes a first protection film for covering a first metal wiring. A second protection film is disposed on the first protection film, which is covered with a solder layer. Even if a crack is generated in the second protection film before the solder layer is formed on the second protection film, the crack is restricted from proceeding into the first protection film.

摘要翻译： 半导体器件包括用于覆盖第一金属布线的第一保护膜。 第一保护膜设置在第一保护膜上，该第一保护膜被焊料层覆盖。 即使在第二保护膜上形成焊料层之前，在第二保护膜中产生裂纹，限制裂纹进入第一保护膜。

公开(公告)号：US20070236891A1

公开(公告)日：2007-10-11

申请号：US11730360

申请日：2007-03-30

申请人： Kuniaki Mamitsu

发明人： Kuniaki Mamitsu

IPC分类号： H05K7/20

CPC分类号： H01L23/4334 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A manufacturing method of a semiconductor device having a semiconductor chip, first and second heat radiation members, and a connection terminal includes: preparing a lead frame having first and second suspended terminals and the connection terminal; bending the suspended terminals; mounting the chip on the first member, press-contacting the first terminal to the first member, and bonding the chip with the connection terminal to the first member; and preparing an assembling jig having a base and a cover, mounting the first member on the base, arranging the second member on the second terminal, pressing the second member with the cover toward the base to parallelize heat radiation surfaces, and bonding the chip and the second member. A distance between the first member and the second terminal is larger than a distance between the first member and the chip.

摘要翻译： 具有半导体芯片，第一和第二散热构件和连接端子的半导体器件的制造方法包括：制备具有第一和第二悬置端子的引线框架和连接端子; 弯曲悬挂端子; 将所述芯片安装在所述第一构件上，将所述第一端子压接到所述第一构件，以及将所述芯片与所述连接端子接合到所述第一构件; 并准备具有底座和盖子的组装夹具，将第一构件安装在基座上，将第二构件布置在第二端子上，将第二构件与盖朝向底座挤压以平行散热表面，并且将芯片和 第二名成员。 第一构件和第二端子之间的距离大于第一构件和芯片之间的距离。