公开(公告)号：US12125773B2

公开(公告)日：2024-10-22

申请号：US17629038

申请日：2020-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Hien ,  Michael Zitzlsperger

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/52

CPC classification number: H01L23/49541 ,  H01L21/561 ,  H01L23/3107

Abstract: The invention relates to a lead frame assembly comprising a plurality of regularly arranged lead frames, each of which is suitable for electrically contacting components, comprises at least two lead frame elements distanced laterally by a recess and which are provided as electrical connections of different polarity, and has at least one anchoring element, which is suitable for anchoring a housing body of the component, the lead frame elements being thinned, flat regions of the lead frame, and the at least one anchoring element protrudes from a plane of the lead frame elements in the form of a pillar, and a plurality of connection elements, which in each case connects two lead frame elements of adjacent lead frames to one another, the two connected lead frame elements being provided as terminals of different polarity.

公开(公告)号：US10886145B2

公开(公告)日：2021-01-05

申请号：US16072993

申请日：2017-01-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Tobias Gebuhr ,  Stephan Eicher

IPC: H01L21/40 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L33/62 ,  H01L33/52 ,  H01L21/56 ,  H01L33/00 ,  H01L33/48 ,  H01L25/075

Abstract: A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.

公开(公告)号：US20170263829A1

公开(公告)日：2017-09-14

申请号：US15509505

申请日：2015-09-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： David Racz ,  Michael Zitzlsperger ,  Georg Bogner

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the luminous face and a surface facing away from the luminous face, wherein at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.

公开(公告)号：US20160343917A1

公开(公告)日：2016-11-24

申请号：US15227287

申请日：2016-08-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dominik Eisert ,  Torsten Baade ,  Michael Zitzlsperger

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/06 ,  H01L33/32 ,  H01L33/28 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/502 ,  H01L33/06 ,  H01L33/28 ,  H01L33/32 ,  H01L33/44 ,  H01L33/486 ,  H01L33/50 ,  H01L33/505 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2224/48091 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by wavelength conversion of at least part of the primary light, wherein the luminescence conversion element has a first lamina fixed to a first partial region of an outer surface of the semiconductor body, the outer surface emitting primary light, and leaving free a second partial region of the outer surface, the luminescence conversion element has a second lamina fixed to a surface of the first lamina facing away from the semiconductor body and spaced apart from the semiconductor body, the first lamina is at least partly transmissive to the primary radiation, a section of the second lamina covers at least the second partial region, and at least the section of the second lamina is absorbent and/or reflective and/or scattering for the primary radiation.

Abstract translation: 光电子半导体芯片包括发射初级光的半导体本体和通过至少部分初级光的波长转换而发射二次光的发光转换元件，其中发光转换元件具有固定到第一部分区域的第一部分区域 所述半导体主体的外表面，所述外表面发射初级光，并且释放所述外表面的第二部分区域，所述发光转换元件具有固定到所述第一层的背离半导体主体的表面的第二层， 与半导体本体间隔开，第一薄片至少部分地透射到主辐射，第二薄片的一部分至少覆盖第二部分区域，并且至少第二薄片的部分是吸收和/或反射的，并且 /或用于一次辐射的散射。

公开(公告)号：US20160322551A1

公开(公告)日：2016-11-03

申请号：US15105539

申请日：2014-12-18

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Michael Zitzlsperger

IPC: H01L33/62 ,  H01L31/0232 ,  H01L25/04 ,  H01L33/58 ,  H01L31/02 ,  H01L25/075

CPC classification number: H01L33/62 ,  F21S2/005 ,  H01L23/495 ,  H01L25/042 ,  H01L25/0753 ,  H01L31/02005 ,  H01L31/02327 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic component includes a housing that includes a rectangular basic shape with four sides. The sides each merge into one another at a corner point. At least two carrier arms of two contact elements of a lead frame are guided to an edge of the housing. The two carrier arms are arranged on different sides of the housing. The two carrier arms are each at different spacings from the two corner points of the side on which the carrier arms are arranged. The spacings differ at least in the width of a carrier arm.

Abstract translation: 光电子部件包括具有四边的矩形基本形状的壳体。 侧面在角点彼此合并。 引线框架的两个接触元件的至少两个承载臂被引导到壳体的边缘。 两个承载臂布置在外壳的不同侧面上。 两个承载臂各自与布置有承载臂的一侧的两个角点不同的间隔。 至少在承载臂的宽度上的间距不同。

公开(公告)号：US20160308102A1

公开(公告)日：2016-10-20

申请号：US15102904

申请日：2014-12-10

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Michael Zitzlsperger ,  Matthias Goldbach

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2224/4554

Abstract: An optoelectronic component includes a leadframe, a molded body connected to the leadframe, and an optoelectronic semiconductor chip arranged on the leadframe, wherein the leadframe includes an alignment opening, and wherein the molded body includes a recess via which the leadframe is exposed in the area of the alignment opening.

Abstract translation: 光电子部件包括引线框架，连接到引线框架的成型体和布置在引线框架上的光电子半导体芯片，其中引线框架包括对准开口，并且其中模制主体包括凹部，引线框架经由该凹槽暴露在区域中 的对齐开口。

公开(公告)号：US09307647B2

公开(公告)日：2016-04-05

申请号：US14607993

申请日：2015-01-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Stefan Groetsch

IPC: H01L23/48 ,  H05K9/00 ,  H05K1/18 ,  H01L33/48 ,  H05K3/34 ,  H01L31/0203 ,  H01L33/62

CPC classification number: H05K1/181 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

公开(公告)号：US20160064618A1

公开(公告)日：2016-03-03

申请号：US14784879

申请日：2014-04-04

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Martin Brandl ,  Michael Zitzlsperger

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/483 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.

Abstract translation: 光电子部件包括塑料壳体，其中第一引线框架部分嵌入到塑料壳体中，第一引线框架部分的芯片着陆面和焊接接触面至少部分地不被塑料壳体覆盖，焊接接触面具有 凹槽，并且凹槽不被塑料外壳的材料覆盖。

公开(公告)号：US09219210B2

公开(公告)日：2015-12-22

申请号：US14363738

申请日：2012-12-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Jürgen Holz

IPC: H01L21/66 ,  H01L33/62 ,  H01L31/0203 ,  H01L23/00 ,  H01L25/13 ,  H01L33/52 ,  G01R31/26 ,  H01L33/00 ,  H01L33/48 ,  H01L23/495

CPC classification number: H01L33/62 ,  G01R31/2635 ,  H01L22/14 ,  H01L22/32 ,  H01L23/49541 ,  H01L23/49562 ,  H01L24/97 ,  H01L25/13 ,  H01L31/0203 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method serves to produce optoelectronic semiconductor components. A leadframe assemblage includes a number of leadframes. The leadframes each comprise at least two leadframe parts and are connected together at least in part via connecting webs. Electrical connections are attached between neighboring leadframes. A potting body connects the leadframes and the leadframe parts mechanically together. At least some of the connecting webs are removed and/or interrupted, the resulting structure is singulated into the semiconductor components.

Abstract translation: 一种方法用于生产光电半导体元件。 引线框组合包括许多引线框架。 引线框架每个包括至少两个引线框架部件，并且至少部分地经由连接幅材连接在一起。 电连接连接在相邻引线框架之间。 灌封体将引线框和引线框架部分机械地连接在一起。 至少一些连接腹板被去除和/或中断，所得到的结构被分成半导体部件。

公开(公告)号：US20140231837A1

公开(公告)日：2014-08-21

申请号：US14346687

申请日：2012-09-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Michael Zitzlsperger ,  Stefan Groetsch

IPC: H01L25/075 ,  H01L33/62 ,  F21S8/10 ,  H01L33/64

CPC classification number: H01L25/0753 ,  F21S41/141 ,  H01L24/73 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink.

Abstract translation: LED模块具有电绝缘主体，基面和与基面相对的安装面。 多个电连接触点设置在安装表面。 连接触点不与基面相邻。 散热器布置在主体中。 散热片从安装表面延伸到基面最远处。 此外，LED模块具有多个LED芯片，每个LED芯片在芯片下侧具有电绝缘载体基板，在芯片顶侧具有两个芯片触点。 LED芯片布置有散热器上的电绝缘载体衬底。