公开(公告)号：US20230187430A1

公开(公告)日：2023-06-15

申请号：US17547455

申请日：2021-12-10

申请人： WESTERN DIGITAL TECHNOLOGIES, INC.

发明人： Ken Funaki

IPC分类号： H01L25/18 ,  H01L23/00 ,  H01L25/065 ,  H01L23/538 ,  H01L25/00

CPC分类号： H01L25/18 ,  H01L24/08 ,  H01L25/0655 ,  H01L23/5386 ,  H01L25/50 ,  H01L2224/08145 ,  H01L2924/14511 ,  H01L2924/10156 ,  H01L24/94 ,  H01L24/06 ,  H01L2224/06152

摘要： A solid state drive (SSD) wafer device includes first and second semiconductor wafers coupled together. The first wafer may include a number of memory dies with die bond pads, and the second wafer may include a number of electrical interconnects, each including first and second terminals at opposed ends of the electrical interconnect. When the wafers are bonded together, the first terminals of the second wafer are bonded to the die bond pads of the memory dies of the first wafer. The second terminals are left exposed to couple with an SSD controller, which controls the transfer of data and signals between the memory dies of the first wafer and a host device such as a server in a datacenter.

公开(公告)号：US10014268B2

公开(公告)日：2018-07-03

申请号：US15057673

申请日：2016-03-01

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chun-Jun Zhuang ,  Hung-Chun Kuo ,  Chun-Chin Huang

IPC分类号： H01L23/00

CPC分类号： H01L24/06 ,  H01L23/5386 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/03472 ,  H01L2224/06051 ,  H01L2224/06152 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14134 ,  H01L2224/14136 ,  H01L2224/14151 ,  H01L2224/14156 ,  H01L2224/17106 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81447 ,  H01L2924/15321 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device includes a substrate main body, a plurality of first bump pads, and redistribution layer (RDL). The first bump pads are disposed adjacent to a surface of the substrate main body, each of the first bump pads has a first profile from a top view, the first profile has a first width along a first direction and a second width along a second direction perpendicular to the first direction, and the first width of the first profile is greater than the second width of the first profile. The RDL is disposed adjacent to the surface of the substrate main body, and the RDL includes a first portion disposed between two first bump pads.

公开(公告)号：US20150156881A1

公开(公告)日：2015-06-04

申请号：US14555856

申请日：2014-11-28

申请人： IBIDEN CO., LTD.

发明人： Keisuke SHIMIZU ,  Yuichi NAKAMURA ,  Tsuyoshi YAMAGUCHI

IPC分类号： H05K1/18 ,  H05K3/10 ,  H05K3/42 ,  H05K1/02 ,  H05K1/11

CPC分类号： H05K1/183 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/06152 ,  H01L2224/06153 ,  H01L2224/12105 ,  H01L2224/14152 ,  H01L2224/14153 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/181 ,  H05K1/185 ,  H05K3/30 ,  H05K3/4602 ,  H05K2201/096 ,  H05K2201/10674 ,  Y10T29/4913

摘要： A substrate with a built-in electronic component includes multiple resin insulating layers including first, second, third and fourth insulating layers, multiple conductor layers including a first wiring layer including a first pad, a second wiring layer including a second pad, and a third wiring layer including third and fourth pads, multiple via conductors including a first via connecting the first and second pads through the second insulating layer, a second via connecting the second and third pads through the third and fourth insulating layers, and a third via connected to the fourth pad through the fourth insulating layer, and an electronic component positioned a cavity through the second and third insulating layers such that the third via is connecting terminal of the component and fourth pad. The second and third vias have filled plating filling opening portions through the third and fourth insulating layers and through the fourth insulating layer.

摘要翻译： 具有内置电子部件的基板包括包括第一，第二，第三和第四绝缘层的多个树脂绝缘层，多个导体层，包括包括第一焊盘的第一布线层，包括第二焊盘的第二布线层和第三焊盘的第三布线层 包括第三和第四焊盘的布线层，多个通孔导体，包括通过第二绝缘层连接第一和第二焊盘的第一通孔，通过第三和第四绝缘层连接第二和第三焊盘的第二通孔，以及连接到 通过第四绝缘层的第四焊盘和通过第二和第三绝缘层定位空腔的电子部件，使得第三通孔是部件和第四焊盘的连接端子。 第二和第三通孔已经通过第三绝缘层和第四绝缘层填充电镀填充开口部分并穿过第四绝缘层。

公开(公告)号：US20100148198A1

公开(公告)日：2010-06-17

申请号：US12505759

申请日：2009-07-20

申请人： Yoshiaki SUGIZAKI ,  Hideki Shibata ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu ,  Akihiro Kojima

发明人： Yoshiaki SUGIZAKI ,  Hideki Shibata ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu ,  Akihiro Kojima

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/62 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/34 ,  H01L33/38 ,  H01L33/44 ,  H01L33/486 ,  H01L33/50 ,  H01L33/58 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05571 ,  H01L2224/06132 ,  H01L2224/06152 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate; forming a dielectric film on a second surface side opposite to the first surface of the multilayer body, the dielectric film having a first and second openings on a p-side electrode and an n-side electrode provided on the second surface; forming a seed metal on the dielectric film and an exposed surface of the first and second openings; forming a p-side metal interconnect layer and an n-side metal interconnect layer on the seed metal; separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal, which is provided between the p-side metal interconnect layer and the n-side metal interconnect layer; and forming a resin in a space from which the seed metal is removed.

摘要翻译： 制造发光器件的方法包括：形成包括发光层的多层体，使得其第一表面与透光性基板的第一表面侧相邻; 在与所述多层体的第一面相反的第二表面侧上形成电介质膜，所述电介质膜在p侧电极上具有第一和第二开口，在所述第二表面上具有n侧电极; 在所述电介质膜上形成种子金属和所述第一和第二开口的暴露表面; 在种子金属上形成p侧金属互连层和n侧金属互连层; 通过去除设置在p侧金属互连层和n侧金属互连层之间的种子金属的一部分，将种子金属分离成p侧种子金属和n侧种子金属; 并在去除种子金属的空间中形成树脂。

公开(公告)号：US11894294B2

公开(公告)日：2024-02-06

申请号：US17804271

申请日：2022-05-26

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Hanho Park ,  Jeongeun Park ,  Soyeon Joo

IPC分类号： H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14 ,  H01L23/538 ,  H01L23/00 ,  H01L25/18 ,  H10K59/131

CPC分类号： H01L23/49838 ,  H01L23/5386 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/14 ,  H05K1/189 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L25/18 ,  H01L2224/06152 ,  H01L2224/06155 ,  H01L2224/29006 ,  H01L2224/29028 ,  H01L2224/32227 ,  H05K2201/09936 ,  H05K2201/10128 ,  H10K59/131

摘要： A display apparatus includes a printed circuit board including first to fourth output pad regions and a flexible circuit board having a first end connected to a display panel and a second end connected to the printed circuit board. The first output pad region includes a 1st-1st output pad group and a 1st-2nd output pad group, the second output pad region includes a 2nd-1st output pad group and a 2nd-2nd output pad group, the fourth output pad region includes a 4th-1st output pad group and a 4th-2nd output pad group, and the printed circuit board includes a first input terminal electrically connected to the 1st-1st output pad group, a second input terminal electrically connected to the 2nd-2nd output pad group, a third input terminal electrically connected to the first input terminal, and a fourth input terminal electrically connected to the 4th-2nd output pad group.

公开(公告)号：US20230307393A1

公开(公告)日：2023-09-28

申请号：US18044746

申请日：2022-02-10

申请人： Nuvoton Technology Corporation Japan

发明人： Kouki YAMAMOTO ,  Shinichi AKIYOSHI ,  Ryouichi AJIMOTO

IPC分类号： H01L23/00 ,  H01L29/78 ,  H01L25/065

CPC分类号： H01L24/06 ,  H01L24/08 ,  H01L25/0655 ,  H01L29/7813 ,  H01L2224/06152 ,  H01L2224/08225

摘要： A semiconductor device includes: a semiconductor layer; first and second transistors; one or more first source pads and a first gate pad of the first transistor in a first region of the upper surface of the semiconductor layer; and one or more second source pads and a second gate pad of the second transistor in a second region of the upper surface adjacent to the first region in a plan view of the semiconductor layer. In a plan view of the semiconductor layer, a virtual straight line connecting the centers of the first and second gate pads passes through the center of the semiconductor layer and forms a 45 degree angle with each side of the semiconductor layer. An upper surface boundary line between the first and second regions monotonically changes in the directions of extension of the longer and shorter sides of the semiconductor layer.

公开(公告)号：US20180040660A1

公开(公告)日：2018-02-08

申请号：US15788026

申请日：2017-10-19

申请人： OLYMPUS CORPORATION

发明人： Toru Kondo

IPC分类号： H01L27/146 ,  H01L23/60 ,  H01L27/02 ,  H01L23/00

CPC分类号： H01L27/14636 ,  H01L23/60 ,  H01L24/06 ,  H01L24/08 ,  H01L24/48 ,  H01L27/0296 ,  H01L27/146 ,  H01L27/14634 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06152 ,  H01L2224/06155 ,  H01L2224/06177 ,  H01L2224/08145

摘要： A solid-state imaging device includes a first substrate, a second substrate, an electrode portion, a first substrate connecting portion, an electrostatic protection circuit, and a second substrate connecting portion. A photoelectric conversion element is disposed on the first substrate. A part of the peripheral circuit is arranged on the second substrate. The electrode portion has a connection surface. The first substrate connecting portion electrically connects the electrode portion and the second substrate. The electrostatic protection circuit is connected to a circuit between the first substrate connecting portion and the peripheral circuit. The second substrate connecting portion electrically connects the peripheral circuit and the photoelectric conversion element. The electrostatic protection circuit is disposed at a position such that the electrostatic protection circuit does not overlap any of the first substrate connecting portion and the second substrate connecting portion.

公开(公告)号：US09859204B2

公开(公告)日：2018-01-02

申请号：US15230889

申请日：2016-08-08

申请人： Samsung Electronics Co., Ltd.

发明人： Myeong Soon Park ,  Hyunsoo Chung ,  Won-young Kim ,  Ae-nee Jang ,  Chanho Lee

IPC分类号： H01L23/50 ,  H01L23/00

CPC分类号： H01L23/50 ,  H01L24/02 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06139 ,  H01L2224/06151 ,  H01L2224/06152 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/06159 ,  H01L2224/0616 ,  H01L2224/06165 ,  H01L2224/06169 ,  H01L2224/06177 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16227 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/0613

摘要： Semiconductor devices with redistribution pads are disclosed. The semiconductor device includes a plurality of electric pads provided on a semiconductor substrate, and a plurality of redistribution pads electrically connected to the electric pads and an outer terminal. The plurality of redistribution pads includes a plurality of first redistribution pads constituting a transmission path for a first electrical signal and at least one second redistribution pad constituting a transmission path for a second electrical signal different from the first electrical signal. The first redistribution pads are arranged on the semiconductor substrate to form at least two rows, and the at least one second redistribution pad is disposed between the at least two rows of the first redistribution pads.

公开(公告)号：US20150366049A1

公开(公告)日：2015-12-17

申请号：US14526182

申请日：2014-10-28

申请人： Samsung Display Co., Ltd.

发明人： Dae Geun LEE

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC分类号： H01L27/124 ,  G02F1/13458 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H01L27/3276 ,  H01L2224/05552 ,  H01L2224/06152 ,  H01L2224/81132 ,  H01L2924/3511 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49005

摘要： An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

摘要翻译： 阵列基板，包括显示区域和围绕显示区域的非显示区域。 非显示区域包括包括一个或多个每个具有平行四边形形状的第一焊盘的焊盘部分。

公开(公告)号：US09184357B2

公开(公告)日：2015-11-10

申请号：US13310384

申请日：2011-12-02

申请人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu ,  Akihiro Kojima

发明人： Yoshiaki Sugizaki ,  Hideki Shibata ,  Masayuki Ishikawa ,  Hideo Tamura ,  Tetsuro Komatsu ,  Akihiro Kojima

IPC分类号： H01L33/00 ,  H01L33/44 ,  H01L33/38 ,  H01L33/62 ,  H01L23/00 ,  H01L25/075 ,  H01L33/34 ,  H01L33/48 ,  H01L33/58

CPC分类号： H01L33/62 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/34 ,  H01L33/38 ,  H01L33/44 ,  H01L33/486 ,  H01L33/50 ,  H01L33/58 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05571 ,  H01L2224/06132 ,  H01L2224/06152 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed.

摘要翻译： 一种制造发光器件的方法包括：形成包括发光层的多层体，使得其第一表面与透光性基板的第一表面侧相邻。 在与p层电极和n侧电极之间形成有第一和第二开口的与多层体的第一表面相对的第二表面侧上的电介质膜形成。 电介质膜上的种子金属和第一和第二开口的暴露表面形成将种子金属分离成p侧金属和n侧籽晶的p侧金属互连层和n侧金属互连层 金属，通过去除一部分种子金属。 在除去种子金属的空间中形成树脂。