利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

187 条记录 (耗时 0.052 秒)

    Methods for planarizing a semiconductor contactor
    91.
    发明授权
    Methods for planarizing a semiconductor contactor 失效
    平面化半导体接触器的方法

    公开(公告)号：US07737709B2

    公开(公告)日：2010-06-15

    申请号：US11846012

    申请日：2007-08-28

    申请人： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

    发明人： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

    IPC分类号： G01R31/02

    CPC分类号： G01R1/07307 ,  G01R3/00

    摘要： A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

    摘要翻译： 用于探针卡组件的平面化器。 平面化器包括从探针卡组件中的衬底延伸的第一控制构件。 第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。 驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

    Method and system for compensating thermally induced motion of probe cards
    92.
    发明授权
    Method and system for compensating thermally induced motion of probe cards 有权
    用于补偿探针卡热诱导运动的方法和系统

    公开(公告)号：US07642794B2

    公开(公告)日：2010-01-05

    申请号：US11963575

    申请日：2007-12-21

    申请人： Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

    发明人： Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Using electric discharge machining to manufacture probes
    95.
    发明授权
    Using electric discharge machining to manufacture probes 失效
    使用放电加工制造探头

    公开(公告)号：US07122760B2

    公开(公告)日：2006-10-17

    申请号：US10302969

    申请日：2002-11-25

    申请人： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

    发明人： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

    IPC分类号： B23H9/00

    CPC分类号： B23H9/00 ,  G01R1/07314

    摘要： A method of forming a probe array includes forming a layer of tip material over a block of probe material. A first electron discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to the plurality of probes is positioned so that the probes penetrate the plurality of through holes. The substrate is bonded to the plurality of probes. Excess probe material is removed so as to planarize the substrate.

    摘要翻译： 形成探针阵列的方法包括在探针材料块上形成尖端材料层。 第一电子放电机（EDM）电极位于尖端材料层上方，EDM电极具有与要形成的多个探针对应的多个开口。 去除从尖端材料层和探针材料块的多余材料以形成多个探针。 具有对应于多个探针的多个通孔的基板被定位成使得探针穿透多个通孔。 衬底被结合到多个探针。 去除过量的探针材料以使基底平坦化。

    Method and apparatus for shaping spring elements
    98.
    发明授权
    Method and apparatus for shaping spring elements 失效
    用于成形弹簧元件的方法和装置

    公开(公告)号：US06701612B2

    公开(公告)日：2004-03-09

    申请号：US09753296

    申请日：2000-12-29

    申请人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

    发明人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

    IPC分类号： H05K300

    CPC分类号： H05K3/4015 ,  G01R1/06744 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/13018 ,  H01L2224/13144 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/45144 ,  H01L2224/81192 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2203/049 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  H01L2924/00012 ,  H01L2224/1134 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01004

    摘要： Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.

    摘要翻译： 通过使用成形工具（512）来形成软质材料（例如金或软铜）的细长芯元件（502），形成用于电子部件的互连元件，其具有期望的机械特性（例如弹性，用于形成压力接触） 电线）具有弹性形状（包括悬臂梁，S形，U形），并用硬质材料（例如镍及其合金）涂覆成形芯元件，以赋予期望的弹簧（弹性）特性 所得到的复合互连元件。 可以对复合互连元件施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。 所得到的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外罩材料将复合互连元件锚定到电子部件上的端子等），可以被安装 以支撑用作内插件的基板，并且可以安装到用作探针卡或探针卡插入件的基板。 成型工具可以是砧座（622）和模具（624），并且可以切割或切断细长元件的连续成形部分，并且细长元件可以是固有的硬（弹性）材料。 描述了在牺牲基板上制造互连元件的方法。 还描述了在互连元件的末端处制造尖端结构（258）和接触尖端的方法。