Semiconductor memory device and method of fabricating the same
    97.
    发明授权
    Semiconductor memory device and method of fabricating the same 有权
    半导体存储器件及其制造方法

    公开(公告)号:US08912575B2

    公开(公告)日:2014-12-16

    申请号:US13718808

    申请日:2012-12-18

    申请人: SK Hynix Inc.

    发明人: Min Gyu Koo

    摘要: The semiconductor device includes a semiconductor substrate having a first active area defined by a first isolation layer; a gate insulating layer formed on the semiconductor substrate; a first conductive layer formed on the gate insulating layer; a dielectric layer formed on the first conductive layer; at least one first contact hole passing through the dielectric layer; a second conductive layer, formed on the dielectric layer, the second conductive layer filling the at least one first contact hole to contact the first conductive layer; and at least one first contact plug connected to the second conductive layer in the first active area, wherein the at least one first contact plug is offset from the at least one first contact hole to overlap the dielectric layer.

    摘要翻译: 半导体器件包括具有由第一隔离层限定的第一有源区的半导体衬底; 形成在半导体衬底上的栅极绝缘层; 形成在所述栅绝缘层上的第一导电层; 形成在所述第一导电层上的电介质层; 至少一个穿过介电层的第一接触孔; 形成在所述电介质层上的第二导电层,所述第二导电层填充所述至少一个第一接触孔以接触所述第一导电层; 以及至少一个第一接触插塞,其连接到所述第一有源区域中的所述第二导电层,其中所述至少一个第一接触插塞从所述至少一个第一接触孔偏移以与所述介电层重叠。