公开(公告)号：US20040155332A1

公开(公告)日：2004-08-12

申请号：US10364549

申请日：2003-02-10

申请人： Skyworks Solutions, Inc.

发明人： Sandra L. Petty-Weeks ,  Patrick L. Welch

IPC分类号： H01L023/48

CPC分类号： H01L24/32 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

摘要： In one exemplary embodiment, a structure comprises a substrate having a top surface, and a die attach pad situated on the top surface of the substrate. The die attach pad includes a die attach region and at least one substrate ground pad region electrically connected to the die attach region. The die attach pad further includes a die attach stop between the die attach region and the at least one substrate ground pad region. The die attach stop acts to control and limit die attach adhesive flow out to the at least one substrate ground pad region during packaging so that the at least one substrate ground pad region can be moved closer to die attach region so that shorter bond wires for connecting the at least one substrate ground pad region to a die wire bond pad may be used during packaging.

摘要翻译： 在一个示例性实施例中，结构包括具有顶表面的衬底和位于衬底的顶表面上的管芯附接焊盘。 管芯附接焊盘包括管芯附接区域和电连接到管芯附着区域的至少一个衬底接地焊盘区域。 管芯附接垫还包括在管芯附着区域和至少一个衬底接地焊盘区域之间的管芯连接止动件。 管芯附着止动器用于在包装期间控制和限制管芯附着粘合剂流出到至少一个衬底接地焊盘区域，使得至少一个衬底接地焊盘区域能够靠近管芯附着区域移动，从而使用于连接的较短接合线 在封装期间可以使用至芯片接合焊盘的至少一个衬底接地焊盘区域。

公开(公告)号：US06769469B2

公开(公告)日：2004-08-03

申请号：US09928516

申请日：2001-08-14

申请人： Yukio Yamada

发明人： Yukio Yamada

IPC分类号： H05K300

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/27013 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29019 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/75313 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T156/1744 ,  H01L2924/00 ,  H01L2924/00012

摘要： A process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other. A process for mounting a semiconductor device by electrically connecting an electrode of the semiconductor device 4 to an electrode of a wiring board by using an anisotropic conductive adhesive film having conductive particles dispersed in an insulating adhesive, which process comprising: the step of tentatively thermocompression bonding a conductive particle-free filmy insulating adhesive onto a wiring board 22 to thereby form an insulating adhesive layer 23; the step of forming a concave 23a of a predetermined size in said insulating adhesive layer 23 by using a compression bonding head 2 provided with a pressing chip 21 at a predetermined position; the step of putting in the concave 23a of said insulating adhesive layer 23 an anisotropic conductive adhesive film of a predetermined size; and the step of mounting a predetermined IC chip 11 at a predetermined position of the compression bonding head 2 and then positioning said IC chip 11 and thermocompression bonding to said wiring board 22.

摘要翻译： 一种用于安装半导体器件和安装设备的方法，由此能够可靠地连接细间距半导体器件和布线板的电极。 一种通过使用具有分散在绝缘粘合剂中的导电粒子的各向异性导电粘合膜将半导体器件4的电极电连接到布线板的电极来安装半导体器件的方法，该方法包括：暂时热压接 将导电无颗粒的膜状绝缘粘合剂粘合到布线板22上，从而形成绝缘粘合剂层23; 通过使用在预定位置设置有加压芯片21的压接头2，在所述绝缘粘合剂层23中形成预定尺寸的凹部23a的步骤; 将绝缘粘合剂层23的凹部23a放入预定尺寸的各向异性导电粘合膜的步骤; 以及将预定的IC芯片11安装在压接头2的预定位置，然后将所述IC芯片11定位并热压接到所述布线板22上的步骤。

公开(公告)号：US06759307B1

公开(公告)日：2004-07-06

申请号：US09703920

申请日：2000-11-01

申请人： Jicheng Yang

发明人： Jicheng Yang

IPC分类号： H01L2130

CPC分类号： H01L24/83 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29012 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83139 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01031 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention provides methods and apparatus related to preventing adhesive contamination of the electrical contacts of a semiconductor device in a stacked semiconductor device package. The methods and apparatus include providing a first semiconductor device with an adhesive flow control dam located on an upper surface thereof. The dam is positioned between electrical contacts and a substrate attach site on the upper surface of the first semiconductor device. The dam is rendered of a sufficient height and shape to block applied adhesive from flowing over the electrical contacts of the first semiconductor device when a second substrate is mounted onto the upper surface of the first semiconductor device. The semiconductor device package may be encapsulated with the dam in place or with the dam removed. The adhesive flow control dam thus protects the electrical contacts of the first semiconductor device from contamination by excess adhesive, which can result in unusable electrical contacts.

公开(公告)号：US06750550B1

公开(公告)日：2004-06-15

申请号：US09597218

申请日：2000-06-20

申请人： Kimio Yamakawa ,  Minoru Isshiki ,  Katsutoshi Mine

发明人： Kimio Yamakawa ,  Minoru Isshiki ,  Katsutoshi Mine

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  C08G59/306 ,  C08G59/3254 ,  C08K7/18 ,  C08L2666/54 ,  C09J11/02 ,  C09J183/04 ,  H01L21/563 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

摘要： An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 &mgr;m and a major axis-to-minor axis ratio of from 1 to 1.5. Also, semiconductor devices in which a semiconductor chip therein is bonded to its chip mounting component by the aforesaid adhesive composition.

摘要翻译： 一种用于将半导体芯片接合到其芯片安装部件的粘合剂组合物，其包含可固化聚合物组合物，其包含1至900重量ppm的平均粒度为10至100μm的球形填料，并且长轴与短轴比为 1〜1.5。 此外，其中通过上述粘合剂组合物将其中的半导体芯片结合到其芯片安装部件的半导体器件。

公开(公告)号：US06750539B2

公开(公告)日：2004-06-15

申请号：US10278465

申请日：2002-10-23

申请人： Belgacem Haba ,  Klaus-Jurgen Wolter

发明人： Belgacem Haba ,  Klaus-Jurgen Wolter

IPC分类号： H01L2348

CPC分类号： H01L24/75 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49224 ,  Y10T29/53178 ,  H01L2924/00

摘要： A unit includes one or more semiconductor chips. Each chip has a front surface with a plurality of contacts surrounded by a passivated surface. The passivated surface is not wettable by bonding material. The contacts have masses of bonding material thereon and the masses have a height less than the diameter of the contacts.

摘要翻译： 一个单元包括一个或多个半导体芯片。 每个芯片具有前表面，其具有被钝化表面包围的多个触点。 钝化表面不能通过粘合材料润湿。 接触件上具有大量的接合材料，并且质量块的高度小于接触件的直径。

公开(公告)号：US20040108602A1

公开(公告)日：2004-06-10

申请号：US10436262

申请日：2003-05-13

申请人： MITSUBISHI DENKI KABUSHIKI KAISHA

发明人： Dai Nakajima ,  Kiyoshi Ishida ,  Taketoshi Shikano

IPC分类号： H01L023/28

CPC分类号： H01L24/85 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/85009 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： A resin-sealed semiconductor device includes a metallic plate and a semiconductor element soldered thereto. The metallic plate has a semiconductor element mounting region formed on one surface thereof and a plurality of squared recesses defined lengthwise and crosswise in the one surface at approximately regular intervals at locations other than the semiconductor element mounting region.

摘要翻译： 树脂密封半导体器件包括金属板和焊接到其上的半导体元件。 金属板具有在其一个表面上形成的半导体元件安装区域和在半导体元件安装区域之外的位置处以大致规则的间隔在一个表面中纵向和横向限定的多个平方的凹槽。

公开(公告)号：US20040089926A1

公开(公告)日：2004-05-13

申请号：US10292055

申请日：2002-11-12

申请人： Taiwan IC Packaging Corporation

发明人： Cheng-Ho Hsu ,  Yi-Hua Chang ,  Kuei-Hua Liu

IPC分类号： H01L023/02

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An ultra thin semiconductor device has a lead frame for holding a chip and an encapsulant sealing the chip and the lead frame. The lead frame has a die pad and multiple leads for wire bonding with the chip. A die recess to hold the chip is defined in the die pad. A depth of the die recess decreases a total height of the chip and the die pad to provide the wires enough bonding space. That is, the semiconductor device easily has a 0.4 mm thickness to be an ultra thin semiconductor product.

摘要翻译： 超薄半导体器件具有用于保持芯片的引线框架和密封芯片和引线框架的密封剂。 引线框架具有管芯焊盘和多个引线，用于与芯片引线接合。 在芯片焊盘中限定保持芯片的裸片凹槽。 模具凹槽的深度减小了芯片和芯片焊盘的总高度，以提供导线足够的粘结空间。 也就是说，半导体器件容易成为厚度为0.4mm的超薄半导体产品。

公开(公告)号：US20040084757A1

公开(公告)日：2004-05-06

申请号：US10694955

申请日：2003-10-29

申请人： SIGNETICS KOREA CO., LTD.

发明人： Dae Sung Seo

IPC分类号： H01L023/495

CPC分类号： H01L24/49 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A micro leadframe package employing an oblique etching method is disclosed. The micro leadframe package includes a semiconductor chip, an oblique-etched micro leadframe (MLF) having a die pad on which the semiconductor chip is mounted via adhesive means, leads formed along outer sides of the die pad, and tie bars for supporting four corners of the die pad, wires for connecting the semiconductor chip with the leads of the MLF, and an epoxy molding compound (EMC) for encapsulating the semiconductor chip, the MLF, and the wires.

摘要翻译： 公开了采用倾斜蚀刻方法的微引线框封装。 微型引线框架封装包括半导体芯片，斜面蚀刻微引线框架（MLF），其具有通过粘合装置安装半导体芯片的管芯焊盘，沿着管芯焊盘的外侧形成的引线以及用于支撑四个角的连接杆 的芯片，用于将半导体芯片与MLF的引线连接的导线，以及用于封装半导体芯片，MLF和电线的环氧树脂模塑料（EMC）。

公开(公告)号：US20040040742A1

公开(公告)日：2004-03-04

申请号：US10644487

申请日：2003-08-20

申请人： Murata Manufacturing Co. Ltd.

发明人： Hiroyuki Ishizaki

IPC分类号： H05K001/00

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/32 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： Wiring electrodes are formed on a first principal surface of a base substrate. An insulation film partially covers the first principal surface of the base substrate and the wiring electrodes. The insulation film has opening portions where the base substrate and the wiring electrodes are not coated with the insulation film. An electronic component having bump electrodes is mounted on the mounting board by connecting the bump electrodes with the wiring electrodes in the opening portions. A gap between the first principal surface of the base substrate and the electronic component is filled with sealing resin. The opening portions are substantially orthogonal to the longitudinal direction of the wiring electrodes. The ratio of the minimum width of a portion of the base substrate exposed at each of the opening portions to the thickness of the insulation film may advantageously be greater than or equal to 2.

摘要翻译： 接线电极形成在基底基板的第一主表面上。 绝缘膜部分地覆盖基底基板的第一主表面和布线电极。 绝缘膜具有开口部分，其中基底基板和布线电极未被绝缘膜涂覆。 具有凸起电极的电子部件通过将凸起电极与开口部中的布线电极连接而安装在安装基板上。 基底基板的第一主表面和电子部件之间的间隙填充有密封树脂。 开口部与布线电极的长度方向大致正交。 在每个开口部分暴露的基底部分的一部分的最小宽度与绝缘膜的厚度之比可以有利地大于或等于2。

公开(公告)号：US06651321B2

公开(公告)日：2003-11-25

申请号：US09523513

申请日：2000-03-10

申请人： Masud Beroz ,  Belgacem Haba ,  Klaus-Jurgen Wolter

发明人： Masud Beroz ,  Belgacem Haba ,  Klaus-Jurgen Wolter

IPC分类号： H05K334

CPC分类号： H01L24/75 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49224 ,  Y10T29/53178 ,  H01L2924/00

摘要： A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and then cooled, leaving said contacts on said microelectronic element bonded to said conductive features on the connection component. The connection component is maintained at an average temperature below the glass transition temperature of the polymer in the connection component during the heating and cooling steps.

摘要翻译： 一种微电子接合方法，其中微电子元件与具有聚合物主体的连接部件连接，并且在微电子元件上的触点和连接部件的导电特征之间提供接合材料。 加热微电子元件以激活接合材料，然后冷却，使所述微电子元件上的接触物接合到连接部件上的导电特征上。 在加热和冷却步骤期间，连接部件保持在连接部件中聚合物的玻璃化转变温度以下的平均温度。