公开(公告)号：US06492251B1

公开(公告)日：2002-12-10

申请号：US09523512

申请日：2000-03-10

申请人： Belgacem Haba ,  Klaus-Jurgen Wolter

发明人： Belgacem Haba ,  Klaus-Jurgen Wolter

IPC分类号： H01L2144

CPC分类号： H01L24/75 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49224 ,  Y10T29/53178 ,  H01L2924/00

摘要： A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part by a flexible film. Atmospheric pressure on the flexible film can urge the components together during bonding. Temporary securements such as adhesive bonds between the microelectronic element and the component can hold the microelectronic element in place relative to the component while electrical connections are made by conductive bonding material such a solder.

摘要翻译： 微电子元件设置有小的弯液面状焊料块，并且这些质量连接到诸如柔性引线的可变形连接元件。 连接可以在真空中在腔室中或在由柔性膜部分包围的空间中制成。 柔性膜上的大气压力可以在粘合期间将组分推压在一起。 诸如微电子元件和部件之间的粘合剂的临时固定可以将微电子元件相对于部件保持在适当的位置，而电连接由诸如焊料的导电接合材料制成。

公开(公告)号：US06750539B2

公开(公告)日：2004-06-15

申请号：US10278465

申请日：2002-10-23

申请人： Belgacem Haba ,  Klaus-Jurgen Wolter

发明人： Belgacem Haba ,  Klaus-Jurgen Wolter

IPC分类号： H01L2348

CPC分类号： H01L24/75 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49224 ,  Y10T29/53178 ,  H01L2924/00

摘要： A unit includes one or more semiconductor chips. Each chip has a front surface with a plurality of contacts surrounded by a passivated surface. The passivated surface is not wettable by bonding material. The contacts have masses of bonding material thereon and the masses have a height less than the diameter of the contacts.

摘要翻译： 一个单元包括一个或多个半导体芯片。 每个芯片具有前表面，其具有被钝化表面包围的多个触点。 钝化表面不能通过粘合材料润湿。 接触件上具有大量的接合材料，并且质量块的高度小于接触件的直径。

公开(公告)号：US06651321B2

公开(公告)日：2003-11-25

申请号：US09523513

申请日：2000-03-10

申请人： Masud Beroz ,  Belgacem Haba ,  Klaus-Jurgen Wolter

发明人： Masud Beroz ,  Belgacem Haba ,  Klaus-Jurgen Wolter

IPC分类号： H05K334

CPC分类号： H01L24/75 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49224 ,  Y10T29/53178 ,  H01L2924/00

摘要： A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and then cooled, leaving said contacts on said microelectronic element bonded to said conductive features on the connection component. The connection component is maintained at an average temperature below the glass transition temperature of the polymer in the connection component during the heating and cooling steps.

摘要翻译： 一种微电子接合方法，其中微电子元件与具有聚合物主体的连接部件连接，并且在微电子元件上的触点和连接部件的导电特征之间提供接合材料。 加热微电子元件以激活接合材料，然后冷却，使所述微电子元件上的接触物接合到连接部件上的导电特征上。 在加热和冷却步骤期间，连接部件保持在连接部件中聚合物的玻璃化转变温度以下的平均温度。

公开(公告)号：US09125333B2

公开(公告)日：2015-09-01

申请号：US13183870

申请日：2011-07-15

申请人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

发明人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K3/40

CPC分类号： H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

摘要： Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.

摘要翻译： 用于电气应用的阻隔层。 在一些实施例中，阻挡层是层压阻挡层。 在一些实施例中，阻挡层包括梯度阻挡层。

公开(公告)号：US08988895B2

公开(公告)日：2015-03-24

申请号：US13215725

申请日：2011-08-23

申请人： Ilyas Mohammed ,  Belgacem Haba

发明人： Ilyas Mohammed ,  Belgacem Haba

IPC分类号： H05K7/04 ,  H01B7/00 ,  H01R43/00 ,  H01L21/50 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H01R12/52

CPC分类号： H05K3/4602 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01R12/523 ,  H05K2201/10378 ,  H05K2203/0235 ,  Y10T29/49176

摘要： An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.

摘要翻译： 公开了一种互连元件，其包括多个拉制的金属导体，电介质层和在其上具有多个可湿接触点的相对表面。 导体可以包括具有沿导体的第一和第二端之间的方向定向的长度的晶粒。 用于绝缘导体的电介质层可以具有第一和第二相对表面，并且在第一和第二表面之间可以具有小于1毫米的厚度。 一个或多个导体可以被配置为将信号传送到微电子元件或从微电子元件传送信号。 可以使用第一和第二可湿触点将互连元件接合到微电子元件和电路板中的至少一个。 可湿性触点可以匹配微电子元件的表面处的元件触点的空间分布或暴露在微电子元件以外的部件的表面处的电路触点。

公开(公告)号：US08937361B2

公开(公告)日：2015-01-20

申请号：US13114243

申请日：2011-05-24

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L31/0232 ,  H01L27/146

CPC分类号： H01L27/14625 ,  H01L27/1461 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687

摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.

摘要翻译： 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域在第一光感测元件和后表面之间具有第一厚度，并且在第二光感测元件和后表面之间具有第二厚度，使得第一和第二光感测元件接收基本上相同强度的光。 提供至少基本上填充与至少一个光感测元件相邻的半导体区域的空间的电介质区域。 电介质区域可以包括至少一个光导。

公开(公告)号：US08916781B2

公开(公告)日：2014-12-23

申请号：US13296785

申请日：2011-11-15

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Cyprian Emeka Uzoh

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Cyprian Emeka Uzoh

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K1/00 ,  H01L23/498 ,  H01R12/71 ,  H05K3/42

CPC分类号： H05K1/0271 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/714 ,  H05K1/114 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09645 ,  H05K2201/10378 ,  H05K2203/0242 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

摘要： An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.

摘要翻译： 互连部件包括具有开口的元件，延伸穿过开口彼此电绝缘的多个导体以及彼此电绝缘的多个第二触点。 该元件由热膨胀系数小于10ppm /℃的材料构成。 至少一些导体沿开口的至少一个内表面延伸。 导体在第一表面限定多个可润湿的第一接触。 第一触点在厚度方向上与开口至少部分地对齐，并且彼此电绝缘。

公开(公告)号：US08884432B2

公开(公告)日：2014-11-11

申请号：US13155845

申请日：2011-06-08

申请人： Kazuo Sakuma ,  Philip Damberg ,  Belgacem Haba

发明人： Kazuo Sakuma ,  Philip Damberg ,  Belgacem Haba

IPC分类号： H05K1/09 ,  H01L23/498

CPC分类号： H01L21/4853 ,  H01L23/3142 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/01 ,  H01L24/15 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/002 ,  H05K2201/0166 ,  H01L2924/00

摘要： An interconnection substrate includes a plurality of electrically conductive elements of at least one wiring layer defining first and second lateral directions. Electrically conductive projections for bonding to electrically conductive contacts of at least one component external to the substrate, extend from the conductive elements above the at least one wiring layer. The conductive projections have end portions remote from the conductive elements and neck portions between the conductive elements and the end portions. The end portions have lower surfaces extending outwardly from the neck portions in at least one of the lateral directions. The substrate further includes a dielectric layer overlying the conductive elements and extending upwardly along the neck portions at least to the lower surfaces. At least portions of the dielectric layer between the conductive projections are recessed below a height of the lower surfaces.

摘要翻译： 互连衬底包括限定第一和第二横向方向的至少一个布线层的多个导电元件。 导电突起，用于粘合到基板外部的至少一个部件的导电触点，从导电元件延伸到至少一个布线层之上。 导电突起具有远离导电元件的端部和导电元件与端部之间的颈部。 端部具有在至少一个横向方向上从颈部部分向外延伸的下表面。 衬底还包括覆盖导电元件并且沿着颈部部分至少向下表面向上延伸的电介质层。 导电突起之间的电介质层的至少部分凹陷在下表面的高度之下。

公开(公告)号：US08772946B2

公开(公告)日：2014-07-08

申请号：US13492064

申请日：2012-06-08

申请人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

发明人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/34 ,  H01L21/76841 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/32105 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81805

摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.

摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。

公开(公告)号：US08735287B2

公开(公告)日：2014-05-27

申请号：US13488930

申请日：2012-06-05

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L21/441

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit can include a semiconductor element having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts at the front surface and a rear surface remote from the front surface. The semiconductor element can have through holes extending from the rear surface through the semiconductor element and through the contacts. A dielectric layer can line the through holes. A conductive layer may overlie the dielectric layer within the through holes. The conductive layer can conductively interconnect the contacts with unit contacts.

摘要翻译： 微电子单元可以包括具有前表面的半导体元件，与前表面相邻的微电子半导体器件，在前表面处的接触和远离前表面的后表面。 半导体元件可以具有从后表面穿过半导体元件并通过触点延伸的通孔。 电介质层可以对通孔进行排列。 导电层可覆盖通孔内的电介质层。 导电层可以将触点与单元触点导电互连。