公开(公告)号：US09374898B2

公开(公告)日：2016-06-21

申请号：US13869881

申请日：2013-04-24

Applicant: Apple Inc.

Inventor： Kuo-Hua Sung ,  Silvio Grespan

IPC: H01R4/02 ,  H01R9/00 ,  H05K1/11 ,  H01R12/62 ,  H01R43/02 ,  H05K3/36

CPC classification number: H05K1/118 ,  H01R12/62 ,  H01R43/0249 ,  H05K1/117 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/0969 ,  H05K2201/0979 ,  H05K2201/09854 ,  H05K2203/0126

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.

Abstract translation: 所描述的实施例通常涉及电子设备，更具体地涉及用于在电子设备内的组件之间形成机械和电连接的方法。 在一个实施例中，诸如柔性电缆的互连部件附接到诸如印刷电路板的基板。 可以在互连部件中产生穿过位于互连部件的一端上的接合焊盘的多个孔。 然后可以将互连部件与衬底上的接合焊盘对准，并使互连部件上的接合焊盘背离衬底。 可以通过互连部件将导电化合物注入孔中，在接合焊盘之间形成机械和电连接。 在一些实施例中，可以使用粘合剂层来进一步加强互连部件和基底之间的结合。

公开(公告)号：US09314861B2

公开(公告)日：2016-04-19

申请号：US14286015

申请日：2014-05-23

Applicant: GLOBALFOUNDRIES INC.

Inventor： Xiaowei Huang ,  Ke Pu ,  WeiFeng Zhang ,  Shou De Zhen

IPC: B23K37/04 ,  B23K1/00 ,  B23K3/08 ,  H05K3/22 ,  H05K3/30

CPC classification number: B23K1/0016 ,  B23K3/08 ,  B23K37/04 ,  H05K3/225 ,  H05K3/308 ,  H05K2201/09572 ,  H05K2203/0195 ,  H05K2203/1581 ,  H05K2203/176

Abstract: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.

Abstract translation: 提供了一种用于锁定针焊接型组件的温度触发喷射器系统。 提供了一种用于锁销焊接型部件的温度触发喷射器系统，所述部件的锁定销固定在电路板的通孔中，并且在焊接之后焊料填充在通孔中，所述系统包括：位于 在电路板的与所述部件相对的一侧，并且具有与电路板的通孔对准的顶针和驱动顶针的气缸; 温度传感器，用于感测被加热的所述焊料的温度; 控制器，用于基于由温度传感器感测的温度在焊料熔化温度范围内驱动喷射器的顶针，以将所述部件的锁定销从所述电路板中排出。

公开(公告)号：US09178295B1

公开(公告)日：2015-11-03

申请号：US14515209

申请日：2014-10-15

Applicant: DELTA ELECTRONICS, INC.

Inventor： Yu-Liang Lin ,  Wen-Ping Teng ,  Jie Li ,  Guang Yang ,  Wen-Yi Chien

IPC: H01R12/62 ,  H01R12/51 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H05K1/09

CPC classification number: H01R12/62 ,  H01R4/02 ,  H01R12/51 ,  H05K1/0298 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/115 ,  H05K1/117 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/05 ,  H05K2201/09027 ,  H05K2201/09572

Abstract: The present invention provides a flexible printed circuit board having gold fingers, comprising a base sheet, a metallic layer and a protective sheet. The base sheet has a plurality of voids thereon. The metallic layer is provided on the base sheet, and has at least one plated through hole. The protective sheet is provided on the base sheet and the metallic layer to expose a portion of the metallic layer and the plated through hole. The flexible printed circuit board may electrically be connected to a conductive terminal of a rigid printed circuit board with one gold finger and electrically be connected to a system with another gold finger. The plated through hole has a function of heat conduction and soldering, and the voids of the flexible printed circuit board can provide a space for overflowing solder and heat dissipation.

Abstract translation: 本发明提供一种具有金指的柔性印刷电路板，包括基片，金属层和保护片。 基片在其上具有多个空隙。 金属层设置在基片上，并且具有至少一个电镀通孔。 保护片设置在基片和金属层上，以露出金属层和电镀通孔的一部分。 柔性印刷电路板可以用一个金手指电连接到刚性印刷电路板的导电端子，并用另一个金手指连接到系统。 电镀通孔具有导热和焊接的功能，并且柔性印刷电路板的空隙可以提供溢出焊料和散热的空间。

公开(公告)号：US20130175085A1

公开(公告)日：2013-07-11

申请号：US13650748

申请日：2012-10-12

Applicant: Keita Terajima

Inventor： Keita Terajima

IPC: H02G3/18

CPC classification number: H01R43/0256 ,  H01R4/027 ,  H01R12/58 ,  H01R13/533 ,  H05K3/4046 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2201/10242

Abstract: A connector includes an insulation board, a conductor pattern, a rod-shaped member and a solder. The insulation board is provided with a through hole penetrating from a top face to a bottom face. The conductor pattern covers an internal wall of the through hole. The rod-shaped member includes a first end protruding beyond the bottom face and a second end inside the through hole. The solder closes a gap between the conductor pattern covering the internal wall of the through hole and the rod-shaped member and covers the second end of the rod-shaped member.

Abstract translation: 连接器包括绝缘板，导体图案，棒状构件和焊料。 绝缘板设置有从顶面贯穿到底面的通孔。 导体图案覆盖通孔的内壁。 杆状构件包括突出超过底面的第一端和通孔内的第二端。 焊料封闭覆盖通孔的内壁的导体图案与杆状构件之间的间隙，并且覆盖杆状构件的第二端。

公开(公告)号：US08115292B2

公开(公告)日：2012-02-14

申请号：US12604613

申请日：2009-10-23

Applicant: Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Anthony Yi Sheng Sun

Inventor： Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Anthony Yi Sheng Sun

IPC: H01L23/02

CPC classification number: H01L21/563 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2203/043 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.

Abstract translation: 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。

公开(公告)号：US07931354B2

公开(公告)日：2011-04-26

申请号：US11472523

申请日：2006-06-22

Applicant: Koji Imai

Inventor： Koji Imai

IPC: B41J2/14

CPC classification number: B41J2/14201 ,  B41J2002/14491 ,  H05K1/112 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572

Abstract: Second individual electrodes are formed and arranged in zigzag in two rows on one surface of a flexible sheet, and wirings connected to the second individual electrodes are arranged to pass between adjacent second individual electrodes of the other row. Formed on the other surface of the flexible sheet are electrode connection sections to be connected to the second individual electrodes through through-holes going through the flexible sheet. The electrode connection section has an area larger than the second individual electrode and is connected to an external electrode through solder.

Abstract translation: 第二单独电极在柔性片的一个表面上以锯齿形成并布置成两排，并且连接到第二单独电极的布线被布置成在另一行的相邻的第二单独电极之间通过。 形成在柔性片的另一个表面上的电极连接部分通过穿过柔性片的通孔连接到第二个别电极。 电极连接部具有大于第二单独电极的面积，并且通过焊料与外部电极连接。

公开(公告)号：US20110001222A1

公开(公告)日：2011-01-06

申请号：US12865202

申请日：2009-02-17

Applicant: Nozomu Nishimura ,  Toshinobu Ogatsu ,  Katsumi Abe

Inventor： Nozomu Nishimura ,  Toshinobu Ogatsu ,  Katsumi Abe

IPC: H01L23/552 ,  H01L23/48 ,  H01L21/60

CPC classification number: H05K3/305 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/92144 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/3436 ,  H05K2201/09545 ,  H05K2201/09572 ,  H05K2201/09827 ,  H05K2201/10719 ,  H05K2201/10977 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic device comprises an electronic element package and a mounting substrate on which the electronic element package is mounted. The electronic element package has an LGA electrode. The mounting substrate has a through-hole having a conductor which covers an inner wall. The LGA electrode has an area larger than an opening area of the through-hole on a side facing the LGA electrode. The electronic element package is mounted on the mounting substrate so that at least a part of the opening of the through-hole overlaps with the LGA electrode. The LGA electrode and the conductor of the through-hole are electrically connected to a conductive material provided inside the through-hole. In the LGA electrode, at least a part of the region that does not overlap with the opening of the through-hole is joined to the mounting substrate by an adhesive.

Abstract translation: 电子设备包括电子元件封装和其上安装有电子元件封装的安装基板。 电子元件封装具有LGA电极。 安装基板具有覆盖内壁的导体的通孔。 LGA电极的面积比在LGA电极侧的通孔的开口面积大。 电子元件封装安装在安装基板上，使得通孔的至少一部分开口与LGA电极重叠。 LGA电极和通孔的导体与设置在通孔内部的导电材料电连接。 在LGA电极中，与通孔的开口不重叠的区域的至少一部分通过粘合剂接合到安装基板。

公开(公告)号：US20090257209A1

公开(公告)日：2009-10-15

申请号：US12385575

申请日：2009-04-13

Applicant: Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

Inventor： Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

IPC: H01R9/00 ,  H01R12/04

CPC classification number: H05K1/112 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613

Abstract: A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.

Abstract translation: 一种半导体封装和相关方法，所述半导体封装包括包括插座的衬底以及包括焊球和从所述焊球延伸到所述插座中的支撑部分的连接端子。

公开(公告)号：US20090229879A1

公开(公告)日：2009-09-17

申请号：US12401247

申请日：2009-03-10

Applicant: Masato Udaka ,  Seiji Tokii

Inventor： Masato Udaka ,  Seiji Tokii

IPC: H05K7/14 ,  H05K1/02 ,  H01R43/02

CPC classification number: H05K3/3436 ,  H01R12/523 ,  H05K1/113 ,  H05K2201/09381 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09572 ,  Y02P70/613 ,  Y10T29/49213

Abstract: The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGApackage as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGApackage is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.

Abstract translation: 本发明提供了一种印刷电路板，其能够在安装表面安装装置时足以确保接合强度和接头可靠性，以及使用印刷电路板的表面安装装置的安装结构。 作为表面安装装置的BGA封装包括布置在其上的多个焊球，并且印刷电路板包括分别对应于多个焊球的多个安装焊盘。 BGA封装由于焊球的熔化而连接到印刷电路板上的安装焊盘，从而安装在印刷电路板上。 在具有圆形表面形状的每个安装焊盘上形成凹通孔，并且焊球的一部分在凸通孔中。 这里，凸通孔的中心至少与凹通孔的直径相距离每个安装焊盘的中心。

公开(公告)号：US20090218124A1

公开(公告)日：2009-09-03

申请号：US12038891

申请日：2008-02-28

Applicant: JAROSLAW A. MAGERA ,  BRUCE C. DEEMER

Inventor： JAROSLAW A. MAGERA ,  BRUCE C. DEEMER

IPC: H05K1/00 ,  H05K3/42

CPC classification number: H05K3/421 ,  H05K1/0366 ,  H05K3/062 ,  H05K3/064 ,  H05K3/108 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2203/0361 ,  H05K2203/043 ,  H05K2203/1394 ,  Y02P70/613 ,  Y10T29/49165

Abstract: A method is disclosed in which a blind via in a PCB is filled. The vias are plated with a conductor and then with a fusible metal of lower melting point than the conductor. The plated vias are covered with a photoresist and the fusible metal is removed at locations on the PCB other than where the photoresist is disposed. The photoresist is removed and flux is provided on the PCB before the PCB is heated. The heated fusible metal flows into the via.

Abstract translation: 公开了一种填充PCB中的盲通孔的方法。 通孔用导体电镀，然后与导体熔点低的易熔金属电镀。 电镀通孔用光致抗蚀剂覆盖，并且在PCB上的位置处除去可熔金属，而不是设置光致抗蚀剂。 在PCB加热之前，去除光致抗蚀剂并在PCB上提供焊剂。 加热的可熔金属流入通孔。