公开(公告)号：US08952896B2

公开(公告)日：2015-02-10

申请号：US12379952

申请日：2009-03-05

Applicant: Chin-Lin Liu

Inventor： Chin-Lin Liu

IPC: G06F3/033 ,  G09G5/08 ,  G06F3/03 ,  G06F3/0354 ,  G06F3/038

CPC classification number: G06F3/0317 ,  G06F3/03543 ,  G06F3/0383

Abstract: A COB module of an optical mouse has a controller circuit and optical components of the optical mouse integrated thereon, so as to improve the problem with conventional optical mice that light path shifting tends to occur and improve the imaging definition. By disposing a button and wheel mechanism independently outside the COB module, the optical mouse has significantly improved flexibility in design, lower cost related to design alteration, and relaxed requirements on alignment and correction during production.

公开(公告)号：US08828745B2

公开(公告)日：2014-09-09

申请号：US13176790

申请日：2011-07-06

Applicant: Wei-Che Tsao ,  Chia-Lin Hsu ,  Jen-Chieh Lin ,  Teng-Chun Tsai ,  Hsin-Kuo Hsu ,  Ya-Hsueh Hsieh ,  Ren-Peng Huang ,  Chih-Hsien Chen ,  Wen-Chin Lin ,  Yung-Lun Hsieh

Inventor： Wei-Che Tsao ,  Chia-Lin Hsu ,  Jen-Chieh Lin ,  Teng-Chun Tsai ,  Hsin-Kuo Hsu ,  Ya-Hsueh Hsieh ,  Ren-Peng Huang ,  Chih-Hsien Chen ,  Wen-Chin Lin ,  Yung-Lun Hsieh

IPC: H01L21/66 ,  H01L21/306 ,  H01L21/304 ,  H01L21/768 ,  H01L21/3105 ,  H01L21/321

CPC classification number: H01L21/31053 ,  H01L21/3212 ,  H01L21/76898 ,  H01L22/12 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing TSVs, wherein the method comprises several steps as follows: A stack structure having a substrate and an ILD layer (inter layer dielectric layer) is provided, in which an opening penetrating through the ILD layer and further extending into the substrate is formed. After an insulator layer and a metal barrier layer are formed on the stack structure and the sidewalls of the opening, a top metal layer is then formed on the stack structure to fulfill the opening. A first planarization process stopping on the barrier layer is conducted to remove a portion of the top metal layer. A second planarization process stopping on the ILD layer is subsequently conducted to remove a portion of the metal barrier layer, a portion of the insulator layer and a portion of the top metal layer, wherein the second planarization process has a polishing endpoint determined by a light interferometry or a motor current.

Abstract translation: 一种制造TSV的方法，其中该方法包括以下几个步骤：提供具有基板和ILD层（层间电介质层）的堆叠结构，其中穿透ILD层并进一步延伸到基板中的开口是 形成。 在堆叠结构和开口的侧壁上形成绝缘体层和金属阻挡层之后，在堆叠结构上形成顶部金属层以实现开口。 进行停止在阻挡层上的第一平面化处理以去除顶部金属层的一部分。 随后进行停止在ILD层上的第二平坦化处理以去除金属阻挡层的一部分，绝缘体层的一部分和顶部金属层的一部分，其中第二平坦化工艺具有由光线确定的抛光终点 干涉测量或电机电流。

公开(公告)号：US08796095B2

公开(公告)日：2014-08-05

申请号：US13241014

申请日：2011-09-22

Applicant: Chia-Pin Lin ,  Wen-Sheh Huang ,  Tian-Choy Gan ,  Chia-Lung Hung ,  Hsien-Chin Lin ,  Shyue-Shyh Lin

Inventor： Chia-Pin Lin ,  Wen-Sheh Huang ,  Tian-Choy Gan ,  Chia-Lung Hung ,  Hsien-Chin Lin ,  Shyue-Shyh Lin

IPC: H01L21/336

CPC classification number: H01L29/66795 ,  H01L29/66803

Abstract: Provided is a high-k metal gate structure formed over a semiconductor fin. A nitride layer is formed over the gate structure and the semiconductor fin, using two separate deposition operations, the first forming a very thin nitride film. Implantation operations may be carried out in between the two nitride film deposition operations. The first nitride film may be SiNx or SiCNx and the second nitride film is SiCNx. The nitride films may be combined to form low wet etch rate spacers enabling further processing operations to be carried out without damaging underlying structures and without requiring the formation of further dummy spacers. Further processing operations include epitaxial silicon/SiGe processing sequences and source/drain implanting operations carried out with the low etch rate spacers intact.

Abstract translation: 提供了形成在半导体鳍上的高k金属栅极结构。 在栅极结构和半导体鳍片上形成氮化物层，使用两个单独的沉积操作，首先形成非常薄的氮化物膜。 植入操作可以在两个氮化物膜沉积操作之间进行。 第一氮化物膜可以是SiNx或SiCNx，第二氮化物膜是SiCNx。 可以将氮化物膜组合以形成低湿蚀刻速率间隔物，使得能够进行进一步的处理操作而不损坏下面的结构，而不需要形成另外的虚设间隔物。 进一步的处理操作包括外延硅/ SiGe处理序列和用低蚀刻速率间隔物完整地进行的源极/漏极注入操作。

公开(公告)号：US20140015343A1

公开(公告)日：2014-01-16

申请号：US13898404

申请日：2013-05-20

Applicant: Wei Chin LIN

Inventor： Wei Chin LIN

IPC: H03K17/94

CPC classification number: H03K17/94 ,  H01R13/6658 ,  H01R24/62 ,  H01R31/065 ,  Y10T307/858

Abstract: A USB multi-adapter for connecting to a USB plug of an electronic device, and a USB receptacle of a laptop computer, a desktop computer, or an electric socket, includes a device identifying module including at least one USB plug and/or at least one USB receptacle, the device identifying module being capable of identifying kind of a connected electronic device based on a voltage signal in a differential pair and communicating therewith; and a mode determining module electrically connected to the device identifying module for determining whether the connected electronic device is in a power supply mode or a communication mode so that at least one electronic device can be charged by the USB multi-adapter or a communication between the at least one electronic device can be carried out by the USB multi-adapter.

Abstract translation: 用于连接到电子设备的USB插头的USB多适配器，以及膝上型计算机，台式计算机或电插座的USB插座，包括设备识别模块，其包括至少一个USB插头和/或至少 一个USB插座，所述设备识别模块能够基于差分对中的电压信号识别连接的电子设备的种类并与之通信; 以及模式确定模块，电连接到所述设备识别模块，用于确定所连接的电子设备是处于电源模式还是通信模式，以便至少一个电子设备可以由USB多适配器充电或者在 至少一个电子设备可以由USB多适配器执行。

公开(公告)号：US08564970B2

公开(公告)日：2013-10-22

申请号：US12723321

申请日：2010-03-12

Applicant: Hung-Kun Chen ,  Chi-Chin Lin

Inventor： Hung-Kun Chen ,  Chi-Chin Lin

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H01L27/1259 ,  G09G3/3208 ,  G09G2300/0426 ,  H05K1/0268 ,  H05K3/0052 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2203/175

Abstract: This invention discloses a display device mother substrate, a display device substrate and a manufacture method of display device substrate thereof. The display device mother substrate includes a first substrate, a second substrate, a first active area circuit and a first transmission line, wherein a first cutting line is defined between the first substrate and the second substrate. The first active area circuit is disposed on the first substrate and is electrically connected to the first transmission line. The first transmission line includes a display line portion, an end line portion and a middle line portion, wherein the display line portion is electrically connected to the first active area circuit. The middle line portion is disposed on the second substrate, wherein two ends of the middle line portion are electrically connected to the display line portion and the end line portion respectively at the first cutting line. The display device mother substrate is cut along the first cutting line to be separated into the first substrate and the second substrate, wherein the middle line portion is also separated from the display line portion and the end line portion.

Abstract translation: 本发明公开了一种显示装置母板，显示装置用基板及其显示装置用基板的制造方法。 显示装置母板包括第一基板，第二基板，第一有源区电路和第一传输线，其中在第一基板和第二基板之间限定第一切割线。 第一有源区电路设置在第一基板上，并与第一传输线电连接。 第一传输线包括显示线部分，端部线部分和中间线部分，其中显示线部分电连接到第一有源区电路。 中间线部分设置在第二基板上，其中中间线部分的两端分别在第一切割线处电连接到显示线部分和端部线部分。 显示装置母基板沿着第一切割线切割以分离成第一基板和第二基板，其中中间线部分也与显示线部分和端部线部分分离。

公开(公告)号：US08507159B2

公开(公告)日：2013-08-13

申请号：US13049123

申请日：2011-03-16

Applicant: Hung-Chun Wang ,  Pei-Shiang Chen ,  Tzu-Chin Lin ,  Faruk Krecinic ,  Jeng-Horng Chen ,  Wen-Chun Huang ,  Ru-Gun Liu

Inventor： Hung-Chun Wang ,  Pei-Shiang Chen ,  Tzu-Chin Lin ,  Faruk Krecinic ,  Jeng-Horng Chen ,  Wen-Chun Huang ,  Ru-Gun Liu

IPC: G03F9/00

CPC classification number: H01J37/3026 ,  B82Y10/00 ,  B82Y40/00 ,  G03F1/20 ,  G03F1/36 ,  G03F7/2037 ,  H01J37/3174 ,  H01J2237/063 ,  H01J2237/31762 ,  H01J2237/31764 ,  Y10S430/143

Abstract: The present disclosure provides for many different embodiments of a charged particle beam data storage system and method. In an example, a method includes dividing a design layout into a plurality of units; creating a lookup table that maps each of the plurality of units to its position within the design layout and a data set, wherein the lookup table associates any repeating units in the plurality of units to a same data set; and exposing an energy sensitive layer to a charged particle beam based on the lookup table.

Abstract translation: 本公开提供了带电粒子束数据存储系统和方法的许多不同实施例。 在一个示例中，一种方法包括将设计布局划分成多个单元; 创建将所述多个单元中的每一个映射到其在所述设计布局内的位置和数据集合的查找表，其中所述查找表将所述多个单元中的任何重复单元关联到相同的数据集; 并且基于查找表将能量敏感层暴露于带电粒子束。

公开(公告)号：US08459791B2

公开(公告)日：2013-06-11

申请号：US13151250

申请日：2011-06-01

Applicant: Yung-Chin Lin

Inventor： Yung-Chin Lin

IPC: G02C5/00

CPC classification number: G02C5/00 ,  G02C1/06 ,  G02C5/001

Abstract: A spectacle frame comprises a substantially straight or slightly curved structure composed of two rims and a bridge, and two temples. The bridge is connected between the two rims. One end of each temple is rotatably connected with an outward portion of a respective rim via a hinge. Each temple is formed into a bow-shaped bar that has a front portion, a middle portion, and a rear portion. The spectacle frame is designed to have a predetermined first parameter, a predetermined second parameter, a predetermined third parameter, and a predetermined fourth parameter, whereby the spectacle frame has a size smaller than general glasses to facilitate a person engaging a special task to wear a protective shield and prevent the protective shield from being interfered with, and can perfectly fit various facial profiles of persons so as to keep the protective shield airtight.

Abstract translation: 眼镜架包括由两个轮辋和一个桥梁组成的基本上直的或稍微弯曲的结构，以及两个寺庙。 桥梁连接在两个轮辋之间。 每个镜腿的一端通过铰链与相应边缘的向外部分可旋转地连接。 每个镜腿形成为具有前部，中间部和后部的弓形杆。 眼镜框被设计成具有预定的第一参数，预定的第二参数，预定的第三参数和预定的第四参数，由此眼镜架的尺寸小于一般的眼镜，以便于参与特殊任务的人穿戴 防护罩，防止保护罩受到干扰，并可以完美适合人身各种面部轮廓，以保护防护罩的密封性。

公开(公告)号：US08456021B2

公开(公告)日：2013-06-04

申请号：US12954397

申请日：2010-11-24

Applicant: Chien-Te Feng ,  Shih-Chin Lin

Inventor： Chien-Te Feng ,  Shih-Chin Lin

IPC: H01L21/31

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L23/481 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81409 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81416 ,  H01L2224/81418 ,  H01L2224/8142 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/8146 ,  H01L2224/81463 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81473 ,  H01L2224/81476 ,  H01L2224/81478 ,  H01L2224/83385 ,  H01L2224/85409 ,  H01L2224/85411 ,  H01L2224/85413 ,  H01L2224/85416 ,  H01L2224/85418 ,  H01L2224/8542 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85457 ,  H01L2224/8546 ,  H01L2224/85463 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2224/85473 ,  H01L2224/85476 ,  H01L2224/85478 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit (IC) device includes a polymer substrate having a topside surface and a bottomside surface opposite the topside surface, a plurality of through-holes that extend from the topside surface to the bottomside surface, and a plurality of bottom metal pads on the bottomside surface positioned over the plurality of through-holes. At least one IC die having an active topside including a plurality of bond pads and a second side is affixed to the topside surface. Bonding features are coupled to the plurality of bond pads for coupling respective ones of the plurality of bond pads to the plurality bottom metal pads. The bonding features extend into the through-holes to contact the bottom metal pads.

Abstract translation: 集成电路（IC）装置包括具有顶侧表面和与顶侧表面相对的底部表面的聚合物基板，从顶侧表面延伸到底部表面的多个通孔，以及多个底部金属焊盘 底部表面定位在多个通孔上。 具有包括多个接合焊盘的活动顶面和第二侧的至少一个IC管芯固定到顶侧表面。 接合特征耦合到多个接合焊盘，用于将多个接合焊盘中的相应接合焊盘连接到多个底部金属焊盘。 接合特征延伸到通孔中以接触底部金属焊盘。

公开(公告)号：US08409054B2

公开(公告)日：2013-04-02

申请号：US13192628

申请日：2011-07-28

Applicant: Hong-Chin Lin

Inventor： Hong-Chin Lin

IPC: B60W10/02

CPC classification number: F16D48/06 ,  B60W10/023 ,  B60W10/06 ,  B60Y2200/415 ,  F16D2500/10412 ,  F16D2500/1045 ,  F16D2500/1112 ,  F16D2500/3108 ,  F16D2500/31413 ,  F16D2500/31466 ,  F16D2500/51 ,  F16D2500/5126 ,  F16D2500/70494 ,  F16D2500/7105 ,  F16H61/143 ,  F16H61/21 ,  F16H2061/0237 ,  F16H2061/147 ,  F16H2061/216 ,  Y10T477/6403 ,  Y10T477/6414 ,  Y10T477/6422 ,  Y10T477/753 ,  Y10T477/87

Abstract: An overspeed system for a vehicle is disclosed. The overspeed system may have a power source, a transmission unit, and a torque converter assembly operatively coupling the power source to the transmission unit. The overspeed system may also have a travel speed sensor configured to generate a signal indicative of a vehicle speed, and a controller in communication with the torque converter assembly and the travel speed sensor. The controller may be configured to prevent a decoupling of the torque converter assembly in response to the signal.

Abstract translation: 公开了一种用于车辆的超速系统。 超速系统可以具有电源，传输单元和将电源可操作地耦合到传动单元的变矩器组件。 超速系统还可以具有配置成产生指示车辆速度的信号的行驶速度传感器，以及与变矩器组件和行驶速度传感器通信的控制器。 控制器可以被配置为防止响应于信号的变矩器组件的去耦。

公开(公告)号：US08405096B2

公开(公告)日：2013-03-26

申请号：US12888399

申请日：2010-09-22

Applicant: Chien-Min Chen ,  Ko-Wei Chien ,  Hung-Chin Lin

Inventor： Chien-Min Chen ,  Ko-Wei Chien ,  Hung-Chin Lin

IPC: H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.

Abstract translation: LED封装结构包括LED管芯，引线框架和连接到引线框架的壳体。 LED管芯位于引线框架的表面上。 壳体包括围绕LED管芯的内表面。 内表面具有连接到引线框架的表面的底边缘，底边缘和顶边之间的上边缘和腰线。 底部边缘围绕小于由腰围包围的区域的区域。 由腰围包围的区域小于由顶部边缘包围的区域。 内表面在腰线和底边之间具有弯曲表面。