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    Plastic molded chip carrier package and method of fabricating the same
    133.
    发明授权
    Plastic molded chip carrier package and method of fabricating the same 失效
    塑料成型芯片载体封装及其制造方法

    公开(公告)号：US4890152A

    公开(公告)日：1989-12-26

    申请号：US8222

    申请日：1987-01-29

    Applicant: Atsuomi Hirata ,  Hirokuni Mamiya

    Inventor： Atsuomi Hirata ,  Hirokuni Mamiya

    IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H05K3/30

    CPC classification number: H05K3/306 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/49827 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/181 ,  H05K2201/10568 ,  H05K2201/10704 ,  H05K2201/2036

    Abstract: A novel plastic molded chip carrier package for an integrated circuit chip has a carrier member molded of a plastic material to which are integrally embedded a plurality of I/O pins and a conductor member for interconnection between the terminals of the chip and the corresponding I/O pins to provide a unitary construction obtained at a single molding process. This plastic molded chip carrier package is preferred to have integral positioning studs which project in the same direction of the I/O pins for abutment against a printed circuit board for mounting the package in a spaced relation thereto with the I/O pins plugged into metallized through holes provided in the board. A method of fabricating the plastic chip carrier package is also disclosed to comprise the steps of placing a plurality of I/O pins into corresponding vertical slots formed in a molding die with the top portion of the I/O pins projecting above the molding die surface; supporting a conductor member on the I/O pins with the distal top ends of the I/O pins extending into correspondingly through holes formed in the conductor member, the conductor member including a plurality of conductor lines for electrical interconnection between the individual I/O pins and the terminals of the chip; and filling a molten plastic material at least between the conductor member and the molding die surface and solidifying the same so as to form thereat a plastic carrier member to which the conductor member is integrally embedded together with the top portions of the I/O pins.

    Abstract translation: 用于集成电路芯片的新型塑料模制芯片载体封装具有由塑料材料模制的载体构件，其整体地嵌入有多个I / O引脚和导体构件，用于在芯片的端子与相应的I / O引脚，以提供在单个成型工艺中获得的单一结构。 该塑料模制芯片载体封装优选具有整体的定位螺柱，该定位螺柱沿与I / O销相同的方向突出，以抵靠印刷电路板，用于以与其间隔的关系安装封装，其中I / O引脚插入金属化 通孔设在板上。 还公开了一种制造塑料芯片载体封装的方法，包括以下步骤：将多个I / O引脚放置在形成在模具中的相应垂直槽中，其中I / O销的顶部突出于模具模具表面上方 ; 支撑I / O引脚上的导体部件，其中I / O引脚的顶端延伸到形成在导体部件中的相应通孔中，导体部件包括用于各个I / O之间的电互连的多条导体线 引脚和芯片的端子; 并且至少在导体构件和成型模具表面之间填充熔融的塑料材料并使其固化，从而在导体构件与I / O销的顶部一体地嵌入其中的塑料载体构件上形成。

    Surface mounted array strain relief device
    135.
    发明授权
    Surface mounted array strain relief device 失效
    表面安装阵列应变消除装置

    公开(公告)号：US4764848A

    公开(公告)日：1988-08-16

    申请号：US934297

    申请日：1986-11-24

    Applicant: John P. Simpson

    Inventor： John P. Simpson

    IPC: H01R12/04 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34

    CPC classification number: H05K3/3426 ,  H05K1/0271 ,  H05K2201/09418 ,  H05K2201/10704 ,  H05K2201/10757 ,  Y02P70/613

    Abstract: An electrical assembly having an integrated circuit package which has a plurality of electrical conductors fixed thereto. The electrical conductors form mechanical and electrical connections. Each of the electrical conductors has a root at one end and a tip at the other end. The root of each conductor is attached to the integrated circuit package to form a fixed electrical and mechanical connection. The tip of each conductor is adapted to be connected to a surface at a predetermined location. Each of the electrical conductors has at least two bends between the root and the tip for providing strain relief when the tip is connected to a surface.

    Abstract translation: 一种具有集成电路封装的电气组件，其具有固定到其上的多个电导体。 电导体形成机械和电气连接。 每个电导体在一端具有根部，在另一端具有尖端。 每个导体的根部连接到集成电路封装以形成固定的电气和机械连接。 每个导体的尖端适于在预定位置处连接到表面。 每个电导体在根部和尖端之间具有至少两个弯曲部，用于当尖端连接到表面时提供应变消除。

    Electronic component package with multiconductive base forms for multichannel mounting
    137.
    发明授权
    Electronic component package with multiconductive base forms for multichannel mounting 失效
    具有多通道安装多电极底座形式的电子元件封装

    公开(公告)号：US4654472A

    公开(公告)日：1987-03-31

    申请号：US682558

    申请日：1984-12-17

    Applicant: Samuel Goldfarb

    Inventor： Samuel Goldfarb

    IPC: H01L23/055 ,  H01L23/49 ,  H05K3/30 ,  H05K3/34 ,  H05K5/00

    CPC classification number: H01L24/48 ,  H01L23/055 ,  H05K3/308 ,  H05K3/3426 ,  H01L2223/6622 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/484 ,  H01L2224/49171 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2201/09645 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10893 ,  Y02P70/613 ,  Y10S439/931

    Abstract: An improved electronic component or integrated circuit (IC) package characterized by an extraordinary small size for the number of input-output (I/O) leads which are available and capable of use on surface mounted, Flat Pack, hybrid, or through hole (DIP) printed circuit boards. The package has one or more cylindrical or shaped forms at the base, with a flange to provide a stop in order to limit the insertion travel in those circuit boards having through holes, and a top body which is used to house the electronic device. The forms, which protrude down from the upper body (housing), have one or more conductive lead segments, either pins or printed circuit types, running longitudinally and continuing through the housing to the upper body.Each lead segment is connected directly to the electronic device or attached via an additonal lead to a pad on the electronic device, mounted on the upper body. A cover to seal the device is provided. Grooves in the body or on the cover aid in handling the device, either manually or by automatic machinery, are provided. These grooves also provide gripping areas for top hat heat sinks.

    Abstract translation: 一种改进的电子部件或集成电路（IC）封装，其特征在于具有非常小的尺寸，用于输入输出（I / O）引线的数量，其可用并且能够用于表面安装，平板封装，混合或通孔（ DIP）印刷电路板。 该包装在基座处具有一个或多个圆柱形或成形形状，具有凸缘以提供止挡件，以限制具有通孔的那些电路板中的插入行程，以及用于容纳电子装置的顶体。 从上体（壳体）向下突出的形式具有一个或多个导电引线段，即引脚或印刷电路类型，其纵向延伸并且通过外壳继续到上体。 每个引线段直接连接到电子设备，或者通过附加引线连接到安装在上部主体上的电子设备上的焊盘。 提供密封装置的盖子。 提供身体或护罩上的沟槽，手动或自动机械处理设备。 这些凹槽还为顶帽散热片提供抓握区域。

    Method and apparatus for providing a carrier termination for a semiconductor package
    138.
    发明授权
    Method and apparatus for providing a carrier termination for a semiconductor package 失效
    用于为半导体封装提供载体终端的方法和装置

    公开(公告)号：US4652065A

    公开(公告)日：1987-03-24

    申请号：US701575

    申请日：1985-02-14

    Applicant: Edgar R. Cassinelli

    Inventor： Edgar R. Cassinelli

    IPC: H01R12/04 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H01R9/09

    CPC classification number: H05K1/141 ,  H05K7/1084 ,  H05K1/023 ,  H05K2201/049 ,  H05K2201/10022 ,  H05K2201/10325 ,  H05K2201/10704 ,  H05K3/3447 ,  H05K3/368 ,  Y10T29/49126

    Abstract: A semiconductor termination socket for use with a printed wiring board has a mounting socket base for attachment to the board and plural pin socket receiving elements in the base for connecting to leads of a semiconductor chip package which will be removably inserted into the socket. The socket further has electrical components fabricated within the socket base for connecting a pin of the socket and a termination potential. The electrical components are preferably fabricated using planar technology so that the socket becomes, in essence, a printed wiring board. The semiconductor packages can be of any configuration including, for example, 149 pin grid array packages. If more than one layer of component circuitry is needed, a plurality of layers can be embedded within the mounting socket.

    Abstract translation: 与印刷电路板一起使用的半导体终端插座具有用于连接到基板的安装插座底座和底座中的多个插座接收元件，用于连接到可拆卸地插入插座中的半导体芯片封装的引线。 插座还具有在插座底座内制造的电气部件，用于连接插座的插脚和终端电位。 电气部件优选使用平面技术制造，使得插座本质上是印刷电路板。 半导体封装可以是包括例如149针栅格阵列封装的任何配置。 如果需要多于一层的部件电路，则可以在安装插座内嵌入多个层。

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