公开(公告)号：US08476538B2

公开(公告)日：2013-07-02

申请号：US12719136

申请日：2010-03-08

Applicant: Benjamin N. Eldridge ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu

IPC: H05K1/11

CPC classification number: H05K3/4664 ,  H05K3/1241 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4647 ,  H05K2203/049 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements. A jumper can be formed by making a relatively small deposit of electrically insulating material between the two traces to be connected and then making a relatively small deposit of electrically conductive material on parts of the two traces and the insulating material. Via structures can be coupled to traces and an insulating material can be cast around the via structures. Alternatively, via structures can be formed in openings with sloped side walls in an insulating layer.

Abstract translation: 可以将一个或多个定制层添加到布线基板。 定制层可以提供从基底布线基板的电触点到定制层外表面处的电触点的定制电连接，这允许定制层外表面处的触点可以与触点不同的图案 在基极配线基板的表面。 定制层可以包括电绝缘材料，通过绝缘材料的导电通孔结构，导电迹线，电连接两个迹线的导电跳线，而不接触设置在两个迹线之间的迹线和/或其它这样的元件。 可以通过在要连接的两个迹线之间形成相对较小的电绝缘材料沉积，然后在两个迹线和绝缘材料的部分上形成相对较小的导电材料沉积物来形成跳线。 通孔结构可以耦合到迹线，并且绝缘材料可以围绕通孔结构铸造。 或者，通孔结构可以形成在具有绝缘层中的倾斜侧壁的开口中。

公开(公告)号：US20120242363A1

公开(公告)日：2012-09-27

申请号：US13288925

申请日：2011-11-03

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

IPC: G01R1/067 ,  H01R43/16 ,  H01R24/66 ,  G01R31/26 ,  H01R24/00 ,  H01R13/02

CPC classification number: G01R1/06716 ,  G01R1/06733 ,  G01R1/07357 ,  H01R13/2407 ,  H01R43/16 ,  Y10T29/49204

Abstract: An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.

Abstract translation: 导电接触元件可以包括第一基部和在基部之间具有细长间隔开的叶片的第二基部。 每个叶片的第一端可以联接到第一基部，并且叶片的相对的第二端可以联接到第二基部。 在第一端和第二端之间的叶片的主体可以是足够伸长的，以响应于通过所述接触元件的力，所述力通过在所述力小于屈曲力的同时第一轴向压缩而基本上平行于第一轴线和第二轴线，并且 然后在所述力大于屈曲力时弯曲。

公开(公告)号：US07977956B2

公开(公告)日：2011-07-12

申请号：US12431271

申请日：2009-04-28

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

IPC: G01R31/00 ,  G01R31/20

CPC classification number: G01R31/2891

Abstract: Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly.

Abstract translation: 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中，所识别的一个或多个特征集合的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准。

公开(公告)号：US07920989B2

公开(公告)日：2011-04-05

申请号：US12611525

申请日：2009-11-03

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge

IPC: G01R31/00 ,  G06F19/00

CPC classification number: G01R31/2884 ,  G01R31/3025 ,  G01R31/31907

Abstract: A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.

Abstract translation: 中央测试设备将无线测试数据传输到本地测试设备，该测试设备使用测试数据测试电子设备。 本地测试设备将由电子设备生成的无线响应数据发送回中央测试设备，分析响应数据以确定哪些电子设备通过测试。 中央测试设备可以向其他实体提供测试结果，例如设计电子设备的设计设施或其中制造的电子设备的制造设施。 中央测试设备可以接受来自任何本地测试设施的测试资源的请求，对应于每个测试请求的调度测试时间，并且在预定的测试时间，将测试数据无线地传输到相应的本地测试设施。

公开(公告)号：US20110057018A1

公开(公告)日：2011-03-10

申请号：US12942709

申请日：2010-11-09

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K31/02

CPC classification number: B23K20/004 ,  B23K2101/40 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/013 ,  H01L2924/00013

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

公开(公告)号：US07884006B2

公开(公告)日：2011-02-08

申请号：US12326486

申请日：2008-12-02

Applicant: Benjamin N. Eldridge ,  Bruce Jeffrey Barbara

Inventor： Benjamin N. Eldridge ,  Bruce Jeffrey Barbara

IPC: H01L21/321 ,  H01R13/405

CPC classification number: G01R3/00 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2889 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/30111 ,  Y10T29/49121 ,  Y10T29/49147 ,  Y10T29/49224 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a space transformer substrate. The support substrates with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate to improve yield. The resilient spring contacts are manufactured using photolithographic techniques to form the contacts on a release layer, before the spring contacts are epoxied to the support substrate and the release layer removed. The support substrate can be transparent to allow alignment of the contacts and testing of optical components beneath. The support substrate can include a ground plane provided beneath the spring contacts for improved impedance matching.

Abstract translation: 提供用于晶片测试探测的弹性弹簧触点，其可以以非常精细的间距间隔制造并且精确地位于支撑基板上。 弹性接触结构适于引线接合到空间变压器基板上的电路。 具有附接弹簧触点的支撑基板可以一起大量制造，并在连接到空间变压器基板之前进行切割和测试，以提高产量。 弹性弹簧触点使用光刻技术制造，以在将弹簧触点环氧化为支撑基底并且去除释放层之前在释放层上形成触点。 支撑衬底可以是透明的，以允许触点的对准和下面的光学部件的测试。 支撑基板可以包括设置在弹簧触点下方的接地平面，用于改善阻抗匹配。

公开(公告)号：US20100271062A1

公开(公告)日：2010-10-28

申请号：US12431271

申请日：2009-04-28

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

IPC: G01R31/02

CPC classification number: G01R31/2891

Abstract: Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly

Abstract translation: 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中，所识别的一组一个或多个特征的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准

公开(公告)号：US20100093229A1

公开(公告)日：2010-04-15

申请号：US12577444

申请日：2009-10-12

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R4/48

CPC classification number: G01R1/06727 ,  G01R1/06738 ,  H01L21/6835 ,  H01L2221/68359 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13565 ,  H01L2224/13582 ,  H01L2224/819 ,  H01L2924/01019 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

Abstract translation: 通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。 开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。 每个弹簧接触元件具有基端部分，接触端部分和中心体部分。 接触端部在与中心体部分相同的z轴（不同高度）偏移。 基端部优选地沿着与中心主体部分的z轴相反的方向偏移。 以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸 的电子元件。 在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

公开(公告)号：US07675301B2

公开(公告)日：2010-03-09

申请号：US11779183

申请日：2007-07-17

Applicant: Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: G01R31/26

CPC classification number: G01R1/06716 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/07342 ,  G01R3/00 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01R12/52 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2442 ,  H01R2201/20 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

Abstract: An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.

Abstract translation: 公开了一种电子部件，其具有安装到部件的平面上的多个微电子弹簧触头。 微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座， 梁的第一端和位于梁的与基座相对的自由端的尖端。 梁在其自由端和底座之间具有不受支撑的跨距。 微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。 弹簧触点可以具有各种创新的轮廓形状。 在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

公开(公告)号：US07621044B2

公开(公告)日：2009-11-24

申请号：US10971489

申请日：2004-10-22

Applicant: Benjamin N. Eldridge ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu

IPC: H01R43/20

CPC classification number: C25D1/10 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/20 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07342 ,  G01R3/00 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/341 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/42 ,  H05K2203/0726 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/53378

Abstract: Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later etched away. In one embodiment, the mandrel includes a form or mold area that is inserted through a plated through hole in a substrate. Plating is then performed to create the spring contact on the mold area of the mandrel as well as to attach the spring contact to the substrate. In a second embodiment, the mandrel includes a form that is initially plated to form the resilient contact structure and then attached to a region of a substrate without being inserted through the substrate. Attachment in the second embodiment can be achieved during the plating process used to form the spring contact, or by using a conductive adhesive or solder either before or after releasing the spring contact from the mandrel.

Abstract translation: 通过将接触结构电镀在可重复使用的心轴上来制造弹性弹性接触结构，而不是在随后蚀刻掉的牺牲层上形成接触结构。 在一个实施例中，心轴包括通过衬底中的电镀通孔插入的形状或模具区域。 然后进行电镀以在心轴的模具区域上产生弹簧接触以及将弹簧接触件附接到基底。 在第二实施例中，心轴包括最初电镀以形成弹性接触结构然后在不插入衬底的情况下附着到衬底的区域的形式。 在用于形成弹簧接触的电镀工艺期间，或者在从芯棒释放弹簧接触之前或之后使用导电粘合剂或焊料，可以实现第二实施例中的附接。