公开(公告)号：US20040222523A1

公开(公告)日：2004-11-11

申请号：US10841861

申请日：2004-05-06

Applicant: Hanwha Chemical Corporation

Inventor： Joo-Seok Oh ,  Sang-Hun Lee ,  Jeong-Deok Seo ,  Kee-Ho Chang ,  Jeong-Teck Rim

IPC: H01L023/495

CPC classification number: H05K3/323 ,  H01L23/49883 ,  H01L2224/29399 ,  H01L2924/01019 ,  H01L2924/01067 ,  H01L2924/01079 ,  H05K2201/0224 ,  H05K2203/0786 ,  Y10T428/2991

Abstract: Disclosed is an insulated conductive ball for anisotropic conductive connection, a method of preparing the same and a product using the same. The insulated conductive ball includes a conductive ball, and an insulating resin layer coated on a surface of the conductive ball, in which the insulating resin layer is formed of water-soluble resin beads of core/shell structure. Therefore, the conductive ball of the current invention can exhibit superior current feed and insulation characteristics, compared to those of conventional insulated conductive balls for anisotropic conductive connection coated with thermoplastic resin or thermosetting resin.

Abstract translation: 公开了用于各向异性导电连接的绝缘导电球，其制备方法和使用其的产品。 绝缘导电球包括导电球和涂覆在导电球表面上的绝缘树脂层，其中绝缘树脂层由芯/壳结构的水溶性树脂珠形成。 因此，与用热塑性树脂或热固性树脂涂覆的各向异性导电连接的传统绝缘导电球相比，本发明的导电球可以表现出优异的电流馈送和绝缘特性。

公开(公告)号：US20040056233A1

公开(公告)日：2004-03-25

申请号：US10617117

申请日：2003-07-10

Inventor： Michael Robert Samuels ,  Michael Joseph Molitor

IPC: C09K019/52 ,  C09K019/54

CPC classification number: C09K19/52 ,  C09K19/00 ,  C09K19/38 ,  C09K19/542 ,  H01B3/305 ,  H01B3/445 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0224 ,  H05K2201/0254

Abstract: Disclosed are liquid crystalline polymer compositions, which are melt moldable, and which contain a perfluorinated polymer, and a particulate aramid, and optionally contain hollow glass or quartz spheres, and which usually have low dielectric constants. They are particularly useful as electrical connectors and substrates for other electronic applications which use high frequency signals.

Abstract translation: 公开了液态聚合物组合物，其是可熔融模塑的，并且其含有全氟化聚合物和芳族聚酰胺颗粒，并且任选地包含中空玻璃或石英球，并且通常具有低介电常数。 它们特别适用于使用高频信号的其他电子应用的电连接器和基板。

公开(公告)号：US06632532B1

公开(公告)日：2003-10-14

申请号：US09693892

申请日：2000-10-23

Applicant: Yukio Yamada ,  Toshiyuki Matsumoto

Inventor： Yukio Yamada ,  Toshiyuki Matsumoto

IPC: B32B516

CPC classification number: H01L23/4828 ,  B03C5/026 ,  C08K9/08 ,  C09J9/02 ,  H01B1/22 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01R4/04 ,  H01R13/03 ,  H05K3/323 ,  H05K2201/0224 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A particle material for anisotropic conductive connection, is comprised of a conductive particle and an insulating resin layer covering the surface thereof, wherein the insulating resin layer includes an insulating gelled resin with a gel proportion of at least 90%. The particle material can be manufactured by fixing an insulating gelled resin powder with a gel proportion of at least 90% to the surface of the conductive particle by a physical/mechanical method to form the insulating resin layer.

Abstract translation: 用于各向异性导电连接的颗粒材料由导电颗粒和覆盖其​​表面的绝缘树脂层组成，其中绝缘树脂层包括具有至少90％的凝胶比例的绝缘凝胶树脂。 可以通过物理/机械方法将具有至少90％的凝胶比例的绝缘胶凝树脂粉末固定到导电颗粒的表面上以形成绝缘树脂层来制造颗粒材料。

公开(公告)号：US06338195B1

公开(公告)日：2002-01-15

申请号：US09472026

申请日：1999-12-27

Applicant: Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

Inventor： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC: H05K330

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer containing a second adhesive having an insulating property and a conductive material and placed at least on one side of the first adhesive layer. At the same time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

Abstract translation: 通过将连接片插入电极之间，将彼此面对的电极牢固地接合在一起的连接片。 连接片包括含有绝缘性的第一粘合剂的第一粘合剂层和包含具有绝缘性的第二粘合剂和导电材料的第二粘合剂层，并且至少放置在第一粘合剂层的一侧。 在电极连接的同时，熔融时的第二粘合剂的粘度等于或低于第一粘合剂的粘度。 当电极与该结构连接时，包含在第二粘合剂层中的导电材料被嵌入具有相对较高熔融粘度的第一粘合剂层中，并且部分导电材料被捕​​获在与其连接的电极上。 因此，导电材料可以牢固地保持在电极之间。 此外，由于相邻的突出电极之间的区域不含气泡，因此确保了连接可靠性和优异的耐湿性。

公开(公告)号：US6034331A

公开(公告)日：2000-03-07

申请号：US681397

申请日：1996-07-23

Applicant: Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

Inventor： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC: H01L21/60 ,  H05K3/32 ,  H05K1/16

CPC classification number: H01L24/83 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2201/0224 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, wherein at the time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

Abstract translation: 通过将连接片插入电极之间，将彼此面对的电极牢固地接合在一起的连接片。 连接片包括含有绝缘性的第一粘合剂的第一粘合剂层和位于第一粘合剂层的至少一侧并且包含具有绝缘性的第二粘合剂和导电材料的第二粘合剂层，其中在此时 的第二粘合剂熔融时的粘度等于或低于第一粘合剂熔融时的粘度。 当电极与该结构连接时，包含在第二粘合剂层中的导电材料被嵌入具有相对较高熔融粘度的第一粘合剂层中，并且部分导电材料被捕​​获在与其连接的电极上。 因此，导电材料可以牢固地保持在电极之间。 此外，由于相邻的突出电极之间的区域不含气泡，因此确保了连接可靠性和优异的耐湿性。

公开(公告)号：US5213715A

公开(公告)日：1993-05-25

申请号：US338954

申请日：1989-04-17

Applicant: Timothy P. Patterson ,  Carl E. Hoge

Inventor： Timothy P. Patterson ,  Carl E. Hoge

IPC: C08K9/10 ,  H01B1/22 ,  H01R13/24 ,  H05K1/18 ,  H05K3/32

CPC classification number: H01R13/2414 ,  C08K9/10 ,  H01B1/22 ,  H05K3/323 ,  H05K3/325 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29399 ,  H01L2924/01079 ,  H05K1/181 ,  H05K2201/0129 ,  H05K2201/0224

Abstract: A directionally conductive polymer (DCP) provides an electrical interconnect between terminal or conductors on a pair of electrical components. The DCP is applied in viscous film form to the interface between the two components. The DCP comprises a resinous matrix containing metal particles in an amount normally causing the film to act as an electrical insulator. Electrical conduction through the film is normally inhibited in an unstressed state. When a stress is applied to the film, the metal particles make contact to form a continuous electrical path through the film in alignment with the applied stress. The metal particles maintain electrical insulating properties in regions of the film not subjected to the applied stress. In one embodiment, the film includes a metal polymer dispersed in a dielectric carrier resin. A first resinous material dissolved in a solvent contains a dispersion of metal particles. The dielectric material comprises a second resinous material dissolved in the same solvent. The second resin in immiscible in the first resin so that application of a compressive force on the film during solvent evaporation reduces the solubility of the solvent in the first resin, causing a collapse of the film in the compressed region, thereby forming a metal-resin composite which is electrically conductive. The regions of the film remote from the compressed regions provide a dimensionally stable electrical insulator.

Abstract translation: 定向导电聚合物（DCP）提供一对电气部件上的端子或导体之间的电互连。 DCP以粘膜形式应用于两个部件之间的界面。 DCP包括含有通常导致膜用作电绝缘体的量的金属颗粒的树脂基质。 在无应力状态下通常抑制通过膜的导电。 当对膜施加应力时，金属颗粒接触以形成与施加的应力对准的通过膜的连续电路径。 金属颗粒在没有施加应力的膜的区域中保持电绝缘性能。 在一个实施方案中，该膜包括分散在电介质载体树脂中的金属聚合物。 溶解在溶剂中的第一树脂材料含有金属颗粒的分散体。 介电材料包括溶解在相同溶剂中的第二树脂材料。 在第一树脂中不混溶的第二树脂使得在溶剂蒸发期间在膜上施加压缩力降低了溶剂在第一树脂中的溶解度，导致在压缩区域中的膜崩溃，从而形成金属树脂 复合材料是导电的。 远离压缩区域的膜的区域提供尺寸稳定的电绝缘体。

公开(公告)号：US20190214781A1

公开(公告)日：2019-07-11

申请号：US16356546

申请日：2019-03-18

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: H01R43/20 ,  H01R4/04 ,  C09J9/02 ,  C09J7/20 ,  H01R43/00 ,  H05K3/32

CPC classification number: H01R43/205 ,  C08K3/04 ,  C08K3/08 ,  C08K7/18 ,  C09J7/20 ,  C09J9/02 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2203/326 ,  H01R4/04 ,  H01R12/62 ,  H01R43/007 ,  H05K3/143 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1344

Abstract: An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.

公开(公告)号：US09832870B2

公开(公告)日：2017-11-28

申请号：US14407190

申请日：2013-06-06

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Hiroaki Kobayashi ,  Masanobu Sogame ,  Kentaro Nomizu ,  Yoshinori Mabuchi ,  Yoshihiro Kato

IPC: B32B3/10 ,  H05K1/03 ,  C08J5/24 ,  C08L63/00 ,  C08G59/40 ,  B32B15/14 ,  B32B15/20 ,  C08K9/02 ,  B32B5/02 ,  H05K1/05 ,  C08K3/14

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/5825 ,  B32B2307/726 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/04 ,  C08K3/14 ,  C08K9/02 ,  C08L63/00 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0227 ,  Y10T428/24893 ,  Y10T442/2721 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/656 ,  C08L79/04

Abstract: A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

公开(公告)号：US09796052B2

公开(公告)日：2017-10-24

申请号：US14389668

申请日：2012-03-30

Applicant: Teruo Komatsu ,  Ryo Matsubayashi

Inventor： Teruo Komatsu ,  Ryo Matsubayashi

IPC: B23K35/00 ,  B23K35/22 ,  B23K35/02 ,  H01B1/22 ,  B22F1/00 ,  H01B1/02 ,  H05K1/09 ,  B23K1/20 ,  B23K35/30 ,  B23K35/36 ,  B22F7/06

CPC classification number: B23K35/025 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B23K1/20 ,  B23K35/302 ,  B23K35/3612 ,  H01B1/026 ,  H01B1/22 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0272

Abstract: The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property.The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.

公开(公告)号：US09615463B2

公开(公告)日：2017-04-04

申请号：US11857871

申请日：2007-09-19

Applicant: Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K3/22 ,  H05K3/24 ,  H05K3/12

CPC classification number: H05K3/125 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/245 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.