公开(公告)号：US20060103595A1

公开(公告)日：2006-05-18

申请号：US11274348

申请日：2005-11-16

Applicant: Ki-Jung Kim ,  Kyoung-Ho Kang

Inventor： Ki-Jung Kim ,  Kyoung-Ho Kang

IPC: G09G3/28

CPC classification number: H05K3/361 ,  H05K3/328 ,  H05K2201/0367 ,  H05K2201/10977

Abstract: A plasma display apparatus including a plasma display panel, on which terminal units of electrodes are drawn and disposed at an edge of the panel, a chassis base supporting the plasma display panel, and a circuit board arranged at a rear portion of the chassis base to drive the plasma display panel. A connection member has a first end arranged at the plasma display panel and a second end arranged at the circuit board, and the first end includes a wiring unit on which conductive lines are formed to correspond in a one-to-one basis with the electrode terminal units and to overlap the electrode terminal units. At least one conductive bump is arranged between each electrode terminal unit and conductive line to couple the terminal unit with the conductive line.

Abstract translation: 一种等离子体显示装置，包括等离子体显示面板，电极的端子单元被布置在该等离子体显示面板上并设置在面板的边缘，支撑等离子体显示面板的底座基板和布置在底架的后部的电路板， 驱动等离子显示面板。 连接构件具有布置在等离子体显示面板的第一端和布置在电路板的第二端，并且第一端包括布线单元，导线在其上形成为与电极成一一对应 端子单元并且与电极端子单元重叠。 在每个电极端子单元和导线之间布置至少一个导电凸块，以将端子单元与导电线耦合。

公开(公告)号：US07040906B2

公开(公告)日：2006-05-09

申请号：US10623626

申请日：2003-07-21

Applicant: Shuji Yamakawa ,  Eriko Yuasa

Inventor： Shuji Yamakawa ,  Eriko Yuasa

IPC: H01R12/00

CPC classification number: H05K3/328 ,  H01R4/029 ,  H01R4/70 ,  H01R43/0214 ,  H01R2201/26 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/10053 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y10S439/936

Abstract: A connection structure is between bus bars and relay terminals in an electrical connection box to be mounted on an automobile. Each bus bar is produced by punching an aluminum-based metal plate into a desired circuit configuration. An end of each bus bar is bent so that the end is connected to each respective relay terminal. Each bus bar end is welded to the respective relay terminal. Connection parts between the bus bars and the relay terminals are embedded in a molded insulation. Alternatively, grease is applied to and fills in exteriors and clearances of the connection parts.

Abstract translation: 连接结构在要安装在汽车上的电气接线盒中的母线和继电器端子之间。 每个汇流条通过将铝基金属板冲压成所需的电路结构来制造。 每个母线的端部被弯曲，使得端部连接到每个相应的中继端子。 每个母线端焊接到相应的中继端子。 母线和继电器端子之间的连接部分嵌入模制绝缘体中。 或者，将润滑脂施加到并填充连接部件的外部和间隙。

公开(公告)号：US20060060983A1

公开(公告)日：2006-03-23

申请号：US11216807

申请日：2005-08-31

Applicant: Atsushi Saito

Inventor： Atsushi Saito

IPC: H01L23/48

CPC classification number: H01L21/563 ,  H01L24/10 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H05K3/305 ,  H05K3/325 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic component-mounted structure includes an electronic component having a bump electrode, the bump electrode including a projection made of a first resin and a conductive film covering at least a top of the projection; a substrate having a connecting terminal; and a second resin filling the space between the electronic component and the substrate, wherein the bump electrode abuts against the connecting terminal, and wherein the relationship T0

Abstract translation: 电子部件安装结构包括具有凸起电极的电子部件，所述凸起电极包括由第一树脂制成的突起和至少覆盖所述突起的顶部的导电膜; 具有连接端子的基板; 以及填充所述电子部件与所述基板之间的空间的第二树脂，其中所述凸起电极与所述连接端子抵接，并且其中满足关系T0

公开(公告)号：US07014094B2

公开(公告)日：2006-03-21

申请号：US11221137

申请日：2005-09-07

Applicant: David J. Alcoe

Inventor： David J. Alcoe

IPC: B23K31/02

CPC classification number: H05K13/0465 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/10126 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49204 ,  Y10T29/49211 ,  Y10T29/49213 ,  H01L2924/00014

Abstract: An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.

公开(公告)号：US20060014403A1

公开(公告)日：2006-01-19

申请号：US11175448

申请日：2005-07-07

Applicant: Daisuke Sakurai ,  Kazuhiro Nishikawa ,  Norihito Tsukahara

Inventor： Daisuke Sakurai ,  Kazuhiro Nishikawa ,  Norihito Tsukahara

IPC: H01R12/00

CPC classification number: H05K3/361 ,  H01R12/52 ,  H01R43/0207 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0376 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/065

Abstract: First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.

Abstract translation: 第一电路板10包括通过加热软化并具有熔融特性的第一树脂基材12和形成在第一树脂基材12的表面上的多个第一导体图案14和第二电路板20， 形成与第一导体图案14相同的间距的第二导体图案24。 在该结构中，第一导体图案14和第二导体图案24彼此机械接触以提供导电; 第一树脂基材12覆盖第一导体图案14和第二导体图案24，并且被接合到第二电路板20的第二树脂基材22，从而将第一电路板10和第二电路板20彼此连接。

公开(公告)号：US20060000294A1

公开(公告)日：2006-01-05

申请号：US11159261

申请日：2005-06-23

Applicant: Tameharu Ohta

Inventor： Tameharu Ohta

IPC: G01L3/00

CPC classification number: G01C19/5719 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0314 ,  H05K2201/10727 ,  H05K2201/10977 ,  H01L2924/00014

Abstract: An angular rate sensor includes: a circuit board; a package including an angular rate sensor chip and a connection terminal; and a conductive member. The angular rate sensor chip is accommodated in the package. The package is disposed on the circuit board through the conductive member. The package further includes a first electrode disposed on a bottom of the package, the first electrode connecting to the connection terminal. The circuit board includes a second electrode disposed on a top of the circuit board. The angular rate sensor chip in the package is electrically connected to the circuit board through the connection terminal, the first and the second electrodes and the conductive member. The circuit board and the package are electrically and elastically connected by the conductive member.

Abstract translation: 角速率传感器包括：电路板; 包括角速率传感器芯片和连接端子的封装; 和导电构件。 角速率传感器芯片容纳在包装中。 封装通过导电部件设置在电路板上。 该封装还包括设置在封装的底部的第一电极，第一电极连接到连接端子。 电路板包括设置在电路板顶部的第二电极。 封装中的角速度传感器芯片通过连接端子，第一和第二电极和导电部件电连接到电路板。 电路板和封装通过导电构件电气弹性连接。

公开(公告)号：US06978540B2

公开(公告)日：2005-12-27

申请号：US10444867

申请日：2003-05-23

Applicant: Paul Morganelli ,  David Peard ,  Jayesh Shah ,  Douglas Katze

Inventor： Paul Morganelli ,  David Peard ,  Jayesh Shah ,  Douglas Katze

IPC: H05K3/30

CPC classification number: H05K3/305 ,  H01L24/31 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K2201/0129 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10984 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method for utilizing one or more pre-formed underfill compositions in the application of surface mount components, most commonly chip scale packages (CSP's), to substrates for use in electronic devices. The pre-formed underfill of the invention is applied directly to the top and/or sides of the CSP before the reflow process and softens during reflow to flow across the circuit/board gap. One underfill composition utilized for this method comprises a thermoplastic film system that provides a coating on the component that is smooth and non-tacky. The film may be applied selectively to parts of the CSP such that it overhangs the top of the component and upon reflow flows over the edge of the CSP to form a connection with the substrate. A second pre-applied underfill composition or solder paste may be applied as an adhesive to provide sufficient tack in order to hold the electronic assembly together during the assembly process and to serve as a flux to facilitate solder wetting.

Abstract translation: 一种用于将表面贴装元件（通常是芯片尺寸封装（CSP））应用于用于电子器件的衬底的一种或多种预先形成的底部填充组合物的方法。 本发明的预形成的底部填充物在回流过程之前直接施加到CSP的顶部和/或侧面，并且在回流期间软化以流过电路板/板间隙。 用于该方法的一种底部填充组合物包括热塑性薄膜体系，其在该组分上提供光滑和非粘性的涂层。 膜可以选择性地施加到CSP的部分，使得其突出部件的顶部，并且在回流流过CSP的边缘以形成与基板的连接。 可以将第二预先施加的底部填充组合物或焊膏作为粘合剂施加以提供足够的粘性，以便在组装过程期间将电子组件保持在一起，并且用作助焊剂以促进焊料润湿。

公开(公告)号：US20050275094A1

公开(公告)日：2005-12-15

申请号：US10626117

申请日：2003-07-23

Applicant: Michele Berry

Inventor： Michele Berry

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15312 ,  H05K3/3421 ,  H05K2201/10318 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2224/05599

Abstract: Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.

Abstract translation: 将引脚连接到微电子封装衬底的焊接接头与封装材料一起包围。 以这种方式，即使引脚焊料随后熔化，引脚移动也受到限制。

公开(公告)号：US20050263909A1

公开(公告)日：2005-12-01

申请号：US11133379

申请日：2005-05-20

Applicant: Kazuhiko Fukuta ,  Kenji Toyosawa ,  Takashi Kidoguchi

Inventor： Kazuhiko Fukuta ,  Kenji Toyosawa ,  Takashi Kidoguchi

IPC: H01L23/29 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/14 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/00 ,  H05K3/28 ,  H05K3/30

CPC classification number: H01L23/49894 ,  H01L21/563 ,  H01L23/145 ,  H01L23/4985 ,  H01L23/49883 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K1/0393 ,  H05K3/285 ,  H05K3/305 ,  H05K2201/0769 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/122 ,  H05K2203/124 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high reliability semiconductor device is provided which can prevent electromigration due to the deposition of metal ions originating from wires. The device includes: a flexible wiring board 11 including a base film 1 and multiple wires 9; a semiconductor chip 5 mounted to the flexible wiring board 11; and a sealing resin 6 disposed between the flexible wiring board 11 and the semiconductor chip 5 so as to at least partially in contact with the wires 9. The sealing resin 6 contains a metal ion binder mixed thereto.

Abstract translation: 提供了一种高可靠性的半导体器件，其可以防止由于来自电线的金属离子的沉积而导致的电迁移。 该装置包括：柔性布线板11，其包括基膜1和多个布线9; 安装到柔性布线板11的半导体芯片5; 以及密封树脂6，其设置在柔性布线板11和半导体芯片5之间，以至少部分地与导线9接触。 密封树脂6含有与其混合的金属离子粘合剂。

公开(公告)号：US20050239233A1

公开(公告)日：2005-10-27

申请号：US11111069

申请日：2005-04-21

Applicant: Yuji Shinkai

Inventor： Yuji Shinkai

IPC: B41J2/16 ,  B41J2/045 ,  B41J2/055 ,  B41J2/14 ,  H01L21/44 ,  H05K3/32 ,  H05K3/36

CPC classification number: B41J2/14209 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/20 ,  H01L2924/0002 ,  H05K3/321 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/1189 ,  H01L2924/00

Abstract: A method of producing a recording head unit including: (A) a recording head including: a plurality of recording elements; and an actuator unit including a plurality of individual electrodes which respectively correspond to the recording elements; and (B) a printed wiring board which includes conductive leads respectively having terminal portions, which is electrically connected to the individual electrodes, and through which an operating signal for operating the recording elements is supplied to the individual electrodes, the method including: forming a plurality of conductive bumps on a surface of the actuator unit such that the bumps protrude from the surface of the actuator unit, so as to be electrically connected to the individual electrodes, respectively; coating a surface of the printed wiring board with an uncured synthetic resin to form an uncured synthetic-resin layer covering the conductive leads of the printed wiring board; bringing the bumps and the terminal portions of the conductive leads into contact with one another by pressing the bumps onto the uncured synthetic-resin layer such that the bumps penetrate the uncured synthetic-resin layer; and curing the uncured synthetic-resin layer.

Abstract translation: 一种制造记录头单元的方法，包括：（A）记录头，包括：多个记录元件; 以及致动器单元，其包括分别对应于所述记录元件的多个单独电极; 和（B）印刷布线板，其包括分别具有电连接到各个电极的端子部分的导电引线，并且用于操作记录元件的操作信号通过该导体引导到各个电极，该方法包括：形成 多个导电凸块在致动器单元的表面上，使得凸块从致动器单元的表面突出，以便分别电连接到各个电极; 用未固化的合成树脂涂布印刷线路板的表面以形成覆盖印刷线路板的导电引线的未固化的合成树脂层; 通过将凸块按压到未固化的合成树脂层上，使凸块穿过未固化的合成树脂层，使导电引线的凸块和端子部彼此接触; 并固化未固化的合成树脂层。