公开(公告)号：US20240304462A1

公开(公告)日：2024-09-12

申请号：US18569217

申请日：2022-06-15

申请人： Resonac Corporation

发明人： Masaya TOBA ,  Masaki YAMAGUCHI

IPC分类号： H01L21/48 ,  C23C18/16 ,  C23C18/38 ,  C23C28/02 ,  C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  H01L23/12 ,  H05K1/03 ,  H05K3/18

CPC分类号： H01L21/4857 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/38 ,  C23C28/023 ,  C25D3/38 ,  C25D5/022 ,  C25D7/123 ,  H01L23/12 ,  H05K1/0366 ,  H05K3/188 ,  H05K2203/107

摘要： A method for manufacturing a wiring board includes steps of: (I) forming an insulation material layer on a surface of a support substrate; (II) forming a first conductive layer on a surface of the insulation material layer by electroless copper plating; (III) forming a first opening passing through the first conductive layer and the insulation material layer; (IV) forming a second conductive layer on a surface of the first conductive layer and on a bottom surface and a side surface of the first opening by electroless copper plating; (V) forming a resist pattern having a second opening communicating with the first opening on a surface of the second conductive layer; and (VI) filling the first opening and the second opening with a conductive material including copper by electrolytic copper plating.

公开(公告)号：US12087341B2

公开(公告)日：2024-09-10

申请号：US16862809

申请日：2020-04-30

申请人： SHOWA DENKO K.K.

发明人： Chen Xu ,  Lei Zhang ,  Takayuki Fukushima ,  Hisato Shibata ,  Takehiro Yamaguchi ,  Kazuya Niwa ,  Tomoo Shige ,  Hiroaki Nemoto ,  Yuji Umemoto ,  Hiroshi Koyanagi

IPC分类号： G11B5/66 ,  G11B5/65 ,  G11B5/73

CPC分类号： G11B5/73919 ,  G11B5/657 ,  G11B5/658

摘要： A magnetic recording medium includes a substrate, an underlayer formed on the substrate, and a magnetic layer formed on the underlayer. The magnetic layer includes an alloy having a L10 structure. The underlayer includes a first underlayer and a second underlayer. The first underlayer includes Mo and Ru, the content of Ru in the first underlayer is in a range of 5 atom % to 30 atom %, and the second underlayer includes a material having a body-centered cubic (BCC) structure. The second underlayer is formed between the first underlayer and the substrate.

公开(公告)号：US12077666B2

公开(公告)日：2024-09-03

申请号：US16759630

申请日：2018-09-28

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Yasunori Kawabata ,  Kasumi Nakamura ,  Tatsuhito Fukuhara ,  Takahide Iwaya

IPC分类号： C08L63/00 ,  C08K3/04 ,  C08K3/22 ,  C08K3/36 ,  C08K5/3492 ,  C08K7/22 ,  H01G4/224 ,  C08L63/10

CPC分类号： C08L63/00 ,  H01G4/224 ,  C08K3/042 ,  C08K2003/2227 ,  C08K3/36 ,  C08K5/34922 ,  C08K7/22 ,  C08K2201/005 ,  C08L63/10

摘要： A resin composition for casting, containing a curable component and expandable graphite. A molded body including an element and a sealing portion that seals the element, in which the sealing portion contains the resin composition or a cured product thereof.

公开(公告)号：US20240282583A1

公开(公告)日：2024-08-22

申请号：US18568637

申请日：2022-06-02

申请人： RESONAC CORPORATION

发明人： Jumpei IWASAKI ,  Kazuma MATSUI

IPC分类号： H01L21/311

CPC分类号： H01L21/31122

摘要： Provided is a dry etching method capable of selectively etching an etching object containing lanthanum as compared with a non-etching object at a sufficient etching rate without plasma. The dry etching method includes a dry etching step of bringing an etching gas containing nitrosyl fluoride into contact with a member to be etched (12) having an etching object that is to be etched by the etching gas and having a non-etching object that is not to be etched by the etching gas, to selectively etch the etching object as compared with the non-etching object without plasma. The etching object contains lanthanum.

公开(公告)号：US20240279478A1

公开(公告)日：2024-08-22

申请号：US18566877

申请日：2022-07-07

申请人： Resonac Corporation

发明人： Hiroki KUZUOKA ,  Tomohiko KOTAKE

IPC分类号： C08L101/12 ,  C08J5/18 ,  C08K3/013

CPC分类号： C08L101/12 ,  C08J5/18 ,  C08K3/013 ,  C08J2399/00 ,  C08K2201/001 ,  C08L2203/206 ,  C08L2205/02

摘要： Provided are a resin composition containing (A) a thermosetting resin. (B) a compound that is in a liquid state at 25° C. has a reactive group, and has a molecular weight of 1,000 or less, and (C) an inorganic filler, a resin film using the resin composition, a printed wiring board, and a semiconductor package.

公开(公告)号：US20240279395A1

公开(公告)日：2024-08-22

申请号：US18285609

申请日：2022-04-07

申请人： Resonac Corporation

发明人： Natsumi SHIBATA ,  Naoya FUKUMOTO ,  Ayano ASANO ,  Tsuyoshi KATO ,  Takuma KURODA ,  Daisuke YAGYU ,  Chizuru KASAHARA ,  Yutaka TANJI

IPC分类号： C08G65/22 ,  C10M107/38 ,  C10N40/18

CPC分类号： C08G65/226 ,  C10M107/38 ,  C10N2040/18

摘要： The present invention provides a fluorine-containing ether compound represented by following formula.


R1—CH2—R2—CH2—R3—CH2—R4—CH2—R5—CH2—R6—CH2—R7

(R2, R4, and R6 are perfluoropolyether chains having the structure R3 and R5 are each independently a linking group containing one or more hydroxyl groups, and R1 and R7 are each independently Formula (2).)


—O—CH2—CH(OH)—([D]—CH(OH))s-[E]-CH2OH  (2)

(s is 0 or 1, [D] and [E] each independently is a chain structure consisting of a combination of 2 to 5 methylene groups and 1 oxygen atom or a chain structure consisting of 1 to 4 methylene groups, provided that, in case where s is 0 and [E] contains an oxygen atom, the number of methy ne groups contained in [E] is 3 or more).

公开(公告)号：US12060628B2

公开(公告)日：2024-08-13

申请号：US16971821

申请日：2019-02-22

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Daisuke Fukae ,  Hideaki Kawata

IPC分类号： B22F3/10 ,  B22F5/00 ,  C22C33/02 ,  F01L3/08

CPC分类号： C22C33/0264 ,  B22F3/1003 ,  B22F5/00 ,  F01L3/08 ,  B22F2301/35 ,  B22F2998/10 ,  B22F1/10 ,  B22F3/02 ,  B22F3/1007 ,  B22F3/1003

摘要： A sintered valve guide having a metallic structure that has a matrix composed of a martensite phase dispersed in a pearlite single phase structure or a mixed structure of ferrite and pearlite, and a pore dispersed within the matrix, wherein the martensite phase exists in a proportion such that an area ratio of the martensite phase in a structure cross-section is within a range from 1 to 10% of the matrix is provided. A method for producing a sintered valve guide is provided, the method includes preparing a mixed powder by adding a copper-phosphorous alloy powder, a nickel powder and a graphite powder to an iron powder, molding the mixed powder into a molded body having a density of 6.8 to 7.2 Mg/m3, and sintering the obtained molded body at a temperature of 950 to 1,200° C.

公开(公告)号：US20240247120A1

公开(公告)日：2024-07-25

申请号：US18562166

申请日：2022-05-30

申请人： Resonac Corporation

发明人： Shunsuke TONOUCHI ,  Takayo KITAJIMA ,  Seiya MAGOTA ,  Kazuki AOYAMA ,  Shinji SHIMAOKA ,  Yuji TOSAKA ,  Takeshi SAITOH ,  Ryohta SASAKI ,  Kota NAKANISHI

IPC分类号： C08J5/24 ,  H05K1/03

CPC分类号： C08J5/244 ,  H05K1/0366 ,  C08J2333/24 ,  C08J2363/04 ,  C08J2461/06 ,  C08J2463/00

摘要： Provided is a prepreg including a fiber substrate having a thickness of 40 μm or more impregnated with a thermosetting resin composition, the prepreg having in the fiber substrate an impregnated region and a non-impregnated region with the thermosetting resin composition, having a surface waviness (Wa) of 5.0 μm or less. Also provided are a laminate, a metal-clad laminate, a printed wiring board, and a semiconductor package, which are obtained by using the prepreg, a method of producing the prepreg, and a method of producing the metal-clad laminate.

公开(公告)号：US12031213B2

公开(公告)日：2024-07-09

申请号：US17595570

申请日：2020-07-09

申请人： SHOWA DENKO K.K.

发明人： Akira Furuya ,  Tadaaki Kojima ,  Hiroshi Suzuki ,  Fumiaki Naka

IPC分类号： B32B15/01 ,  B32B3/10 ,  B32B3/26 ,  B32B3/30 ,  B32B15/04 ,  B32B15/18 ,  B32B15/20 ,  C23C8/12 ,  C23C8/14 ,  C23C18/16 ,  C23C18/18 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/42 ,  C23C18/44 ,  C23C18/52 ,  C23C18/54 ,  C23C28/00 ,  C23C28/02 ,  C23C30/00 ,  C25D3/12 ,  H01J37/32 ,  C22C38/44 ,  C23C16/44

CPC分类号： C23C28/322 ,  B32B3/10 ,  B32B3/266 ,  B32B3/30 ,  B32B15/01 ,  B32B15/015 ,  B32B15/017 ,  B32B15/018 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  B32B15/20 ,  C23C8/12 ,  C23C8/14 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/1696 ,  C23C18/1848 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/42 ,  C23C18/44 ,  C23C18/52 ,  C23C18/54 ,  C23C28/02 ,  C23C28/021 ,  C23C28/023 ,  C23C28/028 ,  C23C28/321 ,  C23C28/345 ,  C23C30/00 ,  C23C30/005 ,  C25D3/12 ,  H01J37/32477 ,  C22C38/44 ,  C23C16/4404 ,  C23C18/1824 ,  Y10T428/1259 ,  Y10T428/12597 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/12972 ,  Y10T428/12979 ,  Y10T428/12993 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/249953 ,  Y10T428/26 ,  Y10T428/265

摘要： A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

公开(公告)号：US20240224413A1

公开(公告)日：2024-07-04

申请号：US18555866

申请日：2021-11-16

申请人： Resonac Corporation

发明人： Kosuke URASHIMA ,  Motoki YONEKURA ,  Motohiro ARIFUKU ,  Tomohiko KOTAKE ,  Etsuo MIZUSHIMA

IPC分类号： H05K1/02 ,  H05K3/06 ,  H05K3/28

CPC分类号： H05K1/0237 ,  H05K3/06 ,  H05K3/28 ,  H05K2201/0753 ,  H05K2201/083 ,  H05K2201/10287 ,  H05K2203/063

摘要： A wiring substrate includes a substrate, conductor wiring provided on the substrate, and an insulator positioned on at least a part of the periphery of the conductor wiring, in which the insulator contains a magnetic material. The wiring substrate ensures little loss in transmission even in high-frequency band.