公开(公告)号：US08907459B2

公开(公告)日：2014-12-09

申请号：US12523118

申请日：2007-01-15

申请人： Manabu Bonkohara

发明人： Manabu Bonkohara

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L25/00 ,  H01L23/00

CPC分类号： H01L21/561 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A three-dimensional semiconductor integrated circuit device is provided. A first semiconductor chip includes a solid-state circuit and is smaller than a base, and is stacked on the base. The first chip is buried by a first filling material having approximately the same contour as the base. Buried electrodes that penetrate through the first chip along its thickness direction are formed in the first chip. A second semiconductor chip includes a solid-state circuit and is smaller than the base, and is stacked on the first chip. The second chip is buried by a second filling material having approximately the same contour as the base. Buried electrodes that penetrate through the second chip along its thickness direction are formed in the second chip. The first and second filling materials have processibilities required for forming the buried electrodes and thermal expansion coefficients equivalent to those of the first and second chips, respectively.

摘要翻译： 提供一种三维半导体集成电路器件。 第一半导体芯片包括固态电路并且小于基极，并且堆叠在基底上。 第一芯片被具有与基座大致相同轮廓的第一填充材料掩埋。 在第一芯片中形成有沿其厚度方向穿过第一芯片的埋入电极。 第二半导体芯片包括固态电路并且小于基极，并且堆叠在第一芯片上。 第二芯片被第二填充材料掩埋，其具有与基座大致相同的轮廓。 在第二芯片中形成有沿其厚度方向穿过第二芯片的埋入电极。 第一和第二填充材料分别具有形成埋入电极所需的处理能力和与第一和第二芯片的热膨胀系数相当的热膨胀系数。

公开(公告)号：US20140016270A1

公开(公告)日：2014-01-16

申请号：US13977908

申请日：2011-12-28

申请人： Manabu Bonkohara

发明人： Manabu Bonkohara

IPC分类号： H05K1/02 ,  H05K7/20

CPC分类号： H05K1/0203 ,  H01L23/34 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K7/20218 ,  H05K7/2039 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An interposer is provided that suppresses heat conduction more effectively between two heat sources when the interposer is placed between the heat sources.An interposer 24 comprises a body having a cavity 23 maintained in vacuum; insulating layers 22a and 22b formed respectively on upper and lower walls 20a and 20b of the body; and heat reflecting layers 21a and 21b formed respectively on the insulating layers 22a and 22b. The interposer 24 thermally insulates semiconductor devices 11a and 21a mounted respectively on upper and lower sides of the interposer 24.

摘要翻译： 提供了一种插入器，当插入器位于热源之间时，可以更有效地抑制两个热源之间的热传导。 插入器24包括具有保持在真空中的空腔23的本体; 绝缘层22a和22b分别形成在主体的上壁20a和下壁20b上; 以及分别形成在绝缘层22a和22b上的热反射层21a和21b。 插入器24使分别安装在插入件24的上侧和下侧上的半导体器件11a和21a热绝缘。

公开(公告)号：US5834338A

公开(公告)日：1998-11-10

申请号：US717455

申请日：1996-09-20

申请人： Hidetoshi Takeda ,  Manabu Bonkohara

发明人： Hidetoshi Takeda ,  Manabu Bonkohara

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L21/60

CPC分类号： H01L24/50 ,  H01L23/3107 ,  H01L23/49572 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： A chip carrier semiconductor device comprises a semiconductor chip having a surface on which a plurality of contact pads, a tape carrier overlying the semiconductor chip and a plurality of leads provided on the tape carrier to overly the semiconductor chip, each of the leads having an inside end being provided with at last one bump for bonding a board, the bump being positioned on an inside area of the contact pads.

摘要翻译： 一种芯片载体半导体器件包括半导体芯片，其具有表面，多个接触焊盘，覆盖半导体芯片的载带和多个引线设置在带载体上以覆盖半导体芯片，每个引线具有内部 端部设置有用于接合板的最后一个凸块，凸块位于接触垫的内部区域上。

公开(公告)号：US5763295A

公开(公告)日：1998-06-09

申请号：US857822

申请日：1997-05-16

申请人： Kenichi Tokuno ,  Manabu Bonkohara

发明人： Kenichi Tokuno ,  Manabu Bonkohara

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14

摘要： A device module with a circuit chip and a print-circuit substrate on which a pattern of grooves is formed by selective etching. A liquid sealing material is in the space between the circuit chip and the surface of the substrate, fixing the circuit chip on the surface of the substrate. The circuit chip has a plurality of electrodes arranged in a first pattern, and the substrate has a plurality of connection terminals arranged in the first pattern within a chip mounting area on a surface thereof. Each of the grooves passes between two adjacent connection terminals through the chip mounting area, and both ends of each groove protrudes from the periphery of the chip mounting area. After the circuit chip is placed on the chip mounting area with the respective electrodes corresponding to the connection terminals, a liquid sealing material may be spread more easily into the space between the circuit chip and the substrate by the use of capillary action to provide a more reliable and efficient seal.

摘要翻译： 具有电路芯片和印刷电路基板的器件模块，通过选择性蚀刻在其上形成凹槽图案。 液体密封材料位于电路芯片和基板表面之间的空间中，将电路芯片固定在基板的表面上。 电路芯片具有以第一图案布置的多个电极，并且基板在其表面上的芯片安装区域内具有以第一图案布置的多个连接端子。 每个槽通过芯片安装区域在两个相邻的连接端子之间通过，并且每个槽的两端从芯片安装区域的周边突出。 在将电路芯片放置在具有对应于连接端子的相应电极的芯片安装区域之后，通过使用毛细管作用，液体密封材料可以更容易地扩散到电路芯片和基板之间的空间中，以提供更多 可靠高效的密封。

公开(公告)号：US4138691A

公开(公告)日：1979-02-06

申请号：US804228

申请日：1977-06-07

申请人： Manabu Bonkohara ,  Hisao Kasuga

发明人： Manabu Bonkohara ,  Hisao Kasuga

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L29/48 ,  H01L29/44 ,  H01L29/52

CPC分类号： H01L23/3107 ,  H01L23/49562 ,  H01L2224/16 ,  H01L2924/01079

摘要： In a framed lead assembly for a semiconductor element, conductive lead strips comprising inward end portions for connection to electrode areas of the semiconductor element are supported to a frame by reinforcing strips of an insulating material made integral with at least center portions of the respective lead strips and a connection arrangement connecting the reinforcing strips with the frame. The connection arrangement may comprise those outward end regions of the respective reinforcing strips which are made integral with the frame of the insulating material and those outward end areas of the respective lead strips which are attached to the frame. The reinforcing strips may be connected together by bridge members of either the insulating material or another insulating material. Alternatively, the connection arrangement may comprise bridge members connecting the reinforcing strips together and supporting members connecting the bridge members with the frame with outward end portions of the lead strips either separated from the frame or having outward end areas extended further outwardly of the respective outward end portions and attached to the frame. Preferably, the frame and the bridge and supporting members are of the insulating material and made integral with one another with the outward end portions being not made integral with the reinforcing strips. Also preferably, the inward end portions are not made integral with the reinforcing strips in whichever structure of the connection arrangement.

摘要翻译： 在用于半导体元件的框架引线组件中，包括用于连接到半导体元件的电极区域的内部端部的导电引线条通过加强绝缘材料的条带而被支撑在框架上，所述绝缘材料条与至少中心部分形成一体， 以及将加强条与框架连接的连接装置。 连接装置可以包括与绝缘材料的框架一体制成的各个加强条的那些外端区域，以及连接到框架的相应引线条的那些外端部区域。 加强条可以通过绝缘材料或另一绝缘材料的桥构件连接在一起。 或者，连接装置可以包括将加强条连接在一起的桥接构件和将桥构件与框架连接的支撑构件，其中引线条的外端部与框架分离，或者具有向外延伸的向外端部区域， 部分并附接到框架。 优选地，框架和桥梁和支撑构件是绝缘材料并且彼此一体地形成，而外侧端部不与加强条形成一体。 还优选地，内端部不与连接装置的任何结构的加强条制成一体。

公开(公告)号：US08300143B2

公开(公告)日：2012-10-30

申请号：US12521690

申请日：2007-12-29

申请人： Manabu Bonkohara

发明人： Manabu Bonkohara

IPC分类号： H04N5/225

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/3025

摘要： Image quality degradation due to external light irradiated to an edge section of a transparent cover of a solid-state imaging device and external light propagating in the cover is prevented with a simple structure.A glass cover 60 formed to cover the whole surface of an imaging region 26 of a solid-state imaging element 10 is constituted by a transmission section 60a corresponding to the imaging region 26, and an edge section 60b that surrounds the transmission section 60a outside the transmission section 60a. The edge section 60b of the cover 60 is selectively removed around a periphery of the edge section 60b, thereby forming a frustum-shaped part whose cross-sectional area decreases monotonously from its exit side to its incidence side in the cover 60. An optical function film 63 having an optical absorption, reflection, or scattering action is formed on an outer face of the frustum-shaped part.

摘要翻译： 由于照射到固态成像装置的透明盖的边缘部分的外部光以及在盖中传播的外部光的图像质量劣化被以简单的结构来防止。 形成为覆盖固态成像元件10的成像区域26的整个表面的玻璃盖60由对应于成像区域26的透射部分60a和围绕发射部分60a的边缘部分60b构成 发送部60a。 盖60的边缘部60b围绕边缘部60b的周边被选择性地去除，从而形成截面积从盖体60的出射侧到其入射侧单调减小的截头圆锥形部。光学功能 在截头圆锥形部分的外表面上形成具有光吸收，反射或散射作用的薄膜63。

公开(公告)号：US5892271A

公开(公告)日：1999-04-06

申请号：US634411

申请日：1996-04-18

申请人： Hidetoshi Takeda ,  Manabu Bonkohara

发明人： Hidetoshi Takeda ,  Manabu Bonkohara

IPC分类号： H01L23/14 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L21/563 ,  H01L23/4951 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/3511

摘要： A first bump is arranged on an electrode of a semiconductor chip. An opening portion formed at a position corresponding to an electrode on the semiconductor chip, a conductive lead subjected to patterning and arranged in the opening portion, and a second bump for being connected to the outside of the device are formed on a flexible substrate, and the conductive lead and the first bump are connected to each other in the opening portion. An external shape of the flexible substrate is approximately the same as that of the semiconductor chip.

摘要翻译： 第一凸块布置在半导体芯片的电极上。 形成在与半导体芯片上的电极相对应的位置处的开口部分，经过图案化并布置在开口部分中的导电引线和用于连接到器件外部的第二凸起形成在柔性基板上，并且 导电引线和第一凸块在开口部分彼此连接。 柔性基板的外形与半导体芯片大致相同。

公开(公告)号：US5805422A

公开(公告)日：1998-09-08

申请号：US912001

申请日：1997-08-15

申请人： Kenichi Otake ,  Manabu Bonkohara

发明人： Kenichi Otake ,  Manabu Bonkohara

IPC分类号： H01L23/28 ,  H01L21/60 ,  H01L23/02 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/02

CPC分类号： H01L23/4985 ,  H05K1/141 ,  H05K1/147 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2201/056 ,  H05K2201/10734 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/368

摘要： Solder balls are attached to a flexible printed-circuit board which is shaped so as to be able to cover at least an upper surface, a side surface, and a lower surface of an IC chip, and the flexible printed-circuit board is placed on the IC chip. Then, the flexible printed-circuit board is folded over edges of the IC chip, and bonded to outer surfaces of the IC chip by an adhesive sheet. Thereafter, a sealing resin is poured into a gap between the upper surface of the IC chip and the flexible printed-circuit board, and cured, thereby completing a semiconductor package.

摘要翻译： 焊球附接到柔性印刷电路板，其形状为能够覆盖IC芯片的至少上表面，侧表面和下表面，并且将柔性印刷电路板放置在 IC芯片。 然后，将柔性印刷电路板折叠在IC芯片的边缘上，并通过粘合片结合到IC芯片的外表面。 此后，将密封树脂注入到IC芯片的上表面和柔性印刷电路板之间的间隙中并固化，从而完成半导体封装。

公开(公告)号：US5602419A

公开(公告)日：1997-02-11

申请号：US358005

申请日：1994-12-16

申请人： Hidetoshi Takeda ,  Manabu Bonkohara

发明人： Hidetoshi Takeda ,  Manabu Bonkohara

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L24/50 ,  H01L23/3107 ,  H01L23/49572 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： A chip carrier semiconductor device comprises a semiconductor chip having a surface on which a plurality of contact pads, a tape carrier overlying the semiconductor chip and a plurality of leads provided on the tape carrier to overly the semiconductor chip, each of the leads having an inside end being provided with at last one bump for bonding a board, the bump being positioned on an inside area of the contact pads.

摘要翻译： 一种芯片载体半导体器件包括半导体芯片，其具有表面，多个接触焊盘，覆盖半导体芯片的载带和多个引线设置在带载体上以覆盖半导体芯片，每个引线具有内部 端部设置有用于接合板的最后一个凸块，凸块位于接触垫的内部区域上。

公开(公告)号：US5570274A

公开(公告)日：1996-10-29

申请号：US350122

申请日：1994-11-29

申请人： Masaru Saito ,  Manabu Bonkohara

发明人： Masaru Saito ,  Manabu Bonkohara

IPC分类号： H01L25/00 ,  H01L23/053 ,  H01L23/10 ,  H01L23/24 ,  H01L25/065 ,  H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K1/11

CPC分类号： H01L25/105 ,  H01L23/053 ,  H01L23/10 ,  H01L23/24 ,  H01L25/0652 ,  H05K1/141 ,  H05K3/3436 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/1627 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K3/284 ,  H05K3/3426 ,  H05K3/3442 ,  H05K3/368 ,  Y02P70/613

摘要： A multichip module packaging structure provided over a mother board. A multichip module substrate is mounted over the mother board through a frame member. The frame member is provided to extend successively on a peripheral region of a bottom surface of the substrate and further extend downward from the bottom surface of the substrate. The frame member also has a top portion bonded with the bottom surface of the substrate and a bottom portion bonded with the top surface of the mother substrate so as to form a three dimensional space surrounded by the frame member, the substrate and the mother board. A plurality of semiconductor integrated circuit chips are provided on the bottom surface of the substrate so that the chips are accommodated within the three dimensional space.

摘要翻译： 在母板上提供的多芯片模块封装结构。 多芯片模块基板通过框架构件安装在母板上。 框架构件被设置成在衬底的底表面的周边区域上连续地延伸，并且进一步从衬底的底表面向下延伸。 框架构件还具有与基板的底面接合的顶部部分和与母体基板的顶表面接合的底部，以便形成被框架构件，基板和母板包围的三维空间。 在基板的底面上设置多个半导体集成电路芯片，使得芯片容纳在三维空间内。