公开(公告)号：US20170317017A1

公开(公告)日：2017-11-02

申请号：US15581253

申请日：2017-04-28

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Haiying MEI ,  Hiroyuki BAN

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/18 ,  H01L21/52 ,  H01L23/00

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/52 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81005 ,  H01L2224/81444 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15313 ,  H01L2924/1533 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/37001 ,  H05K1/181 ,  H05K3/243 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2201/10378 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface of the build-up wiring layer. The resin insulating layers in the build-up wiring layer include a first resin insulating layer that forms the second surface of the build-up wiring layer, and the build-up wiring layer includes first conductor pads embedded in the first resin insulating layer such that each of the first conductor pads has an exposed surface exposed from the second surface of the build-up wiring layer.

公开(公告)号：US20170127517A1

公开(公告)日：2017-05-04

申请号：US15339057

申请日：2016-10-31

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K1/05 ,  H05K3/46

Abstract: A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.

公开(公告)号：US20170064835A1

公开(公告)日：2017-03-02

申请号：US15252286

申请日：2016-08-31

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Haiying MEI ,  Hiroyuki BAN

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/183 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1533 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/09127 ,  H01L2924/00014

Abstract: A printed wiring board includes a first circuit substrate having a first surface and a second surface on the opposite side, and a second circuit substrate having a third surface and a fourth surface on the opposite side such that the first circuit substrate is laminated on the third surface and that the first surface and the third surface are opposing each other. The second circuit substrate has a mounting area on the third surface and includes pads positioned to mount an electronic component in the mounting area and a connection wire structure connected to the pads, and the first circuit substrate includes through-hole conductors extending from the first surface to the second surface and connected to the pads through the connection wire structure and has an opening portion formed through the first circuit substrate such that the opening portion is exposing the pads formed in the mounting area.

Abstract translation: 一种印刷电路板包括具有第一表面和相对侧的第二表面的第一电路基板，以及第二电路基板，其具有在相对侧上的第三表面和第四表面，使得第一电路基板层叠在第三 并且第一表面和第三表面彼此相对。 第二电路基板在第三表面上具有安装区域，并且包括定位成将电子部件安装在安装区域中的焊盘和连接到焊盘的连接线结构，并且第一电路基板包括从第一表面延伸的通孔导体 通过所述连接线结构连接到所述焊盘，并且具有通过所述第一电路基板形成的开口部，使得所述开口部露出形成在所述安装区域中的焊盘。

公开(公告)号：US20170033036A1

公开(公告)日：2017-02-02

申请号：US15223247

申请日：2016-07-29

Applicant: IBIDEN CO., LTD.

Inventor： Kazuki KAJIHARA ,  Takema ADACHI ,  Teruyuki ISHIHARA

IPC: H01L23/498 ,  H05K3/34 ,  H01L25/065 ,  H05K3/24

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/5389 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1533 ,  H01L2924/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/424 ,  H05K3/4658 ,  H05K3/4682 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0156 ,  H05K2203/0723 ,  H01L2924/00012

Abstract: A printed wiring board includes a buildup wiring layer including resin insulation layers and conductive layers such that the conductive layers are laminated on the resin insulation layers, respectively, first pads formed in a center portion of a first surface of the buildup wiring layer and positioned to connect an electronic component, second pads formed on a periphery portion of the first surface of the buildup wiring layer and positioned to connect an external wiring board, a solder layer including a plating material and formed on the first pads such that the solder layer is formed on each of the first pads, conductive posts including a plating material and formed on the second pads, respectively, and a seed layer including first seed layer portions formed between the first pads and the solder layer and second seed layer portions formed between the second pads and the conductive posts.

Abstract translation: 印刷电路板包括：积层布线层，包括树脂绝缘层和导电层，使得导电层分别层压在树脂绝缘层上的第一焊盘，其形成在堆积布线层的第一表面的中心部分并且定位成 连接形成在积层布线层的第一表面的周边部分上并定位成连接外部布线板的电子部件，第二焊盘，包括电镀材料的焊料层，并形成在第一焊盘上，使得形成焊料层 在每个第一焊盘上，分别包括电镀材料并形成在第二焊盘上的导电柱，以及种子层，其包括形成在第一焊盘和焊料层之间的第一种子层部分和形成在第二焊盘之间的第二种子层部分 和导电柱。

公开(公告)号：US20150114689A1

公开(公告)日：2015-04-30

申请号：US14522742

申请日：2014-10-24

Applicant: IBIDEN Co., Ltd.

Inventor： Teruyuki ISHIHARA ,  Michimasa TAKAHASHI ,  Takashi KARIYA

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K2201/0187 ,  H05K2203/308

Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates.

Abstract translation: 挠性刚性布线板包括柔性基板，非柔性基板，定位成使得非柔性基板在柔性基板的水平方向上延伸;形成在柔性和非柔性基板的第一表面上的第一布线层 嵌入在所述柔性和非柔性基板的第二表面中的第二布线层，覆盖所述柔性和非柔性基板的所述第一表面的第一绝缘层，并且具有暴露柔性基板的第一表面的一部分的开口， 以及覆盖所述柔性和非柔性基板的第二表面的第二绝缘层，并且具有露出柔性基板的第二表面的一部分的开口。 第一布线层包括在柔性和非柔性基板的第一表面上的非嵌入布线，并且第二布线层包括在柔性和非柔性基板的第二表面中的嵌入布线。

公开(公告)号：US20180054891A1

公开(公告)日：2018-02-22

申请号：US15682770

申请日：2017-08-22

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/02 ,  H05K3/06 ,  H05K3/46 ,  H05K3/40

CPC classification number: H05K1/113 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/181 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K3/007 ,  H05K3/025 ,  H05K3/06 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/10674 ,  H01L2924/00012

Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer interposed between the support plate and laminate and having openings formed such that the openings are exposing the first pads. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side, and a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via structure includes via conductors formed in the insulating layer and tapering from the first surface side toward second surface side of the laminate, and the second pads are protruding from the second surface of the laminate.

公开(公告)号：US20180054890A1

公开(公告)日：2018-02-22

申请号：US15682721

申请日：2017-08-22

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/02 ,  H05K3/06 ,  H05K3/46 ,  H05K3/40

CPC classification number: H05K1/113 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K3/025 ,  H05K3/06 ,  H05K3/243 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2201/10378 ,  Y02P70/611

Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.

公开(公告)号：US20150366102A1

公开(公告)日：2015-12-17

申请号：US14737943

申请日：2015-06-12

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Haruhiko MORITA ,  Takashi KARIYA

IPC: H05K7/20 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/429 ,  H01L23/367 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0209 ,  H05K3/4608 ,  H05K2201/09127 ,  Y10T29/49126 ,  Y10T29/49167 ,  H01L2924/00

Abstract: An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit substrate and protruding from a side surface of the circuit substrate such that the metal plate has an exposed portion exposed to outside the circuit substrate, and an external component connected to the exposed portion of the metal plate and including one of an external heat dissipation component and an external cooling component.

Abstract translation: 电子电路装置包括电路基板，位于电路基板上的发热部件，形成电路基板的内层的一部分的金属板，从电路基板的侧面突出，使得金属板具有 露出部分暴露于电路基板外部，外部部件连接到金属板的暴露部分，并且包括外部散热部件和外部冷却部件之一。

公开(公告)号：US20150085461A1

公开(公告)日：2015-03-26

申请号：US14492424

申请日：2014-09-22

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Michimasa TAKAHASHI

IPC: H05K7/10 ,  H05K3/36

CPC classification number: H05K3/368 ,  H05K3/0097 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/1484 ,  Y10T29/49126

Abstract: A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.

Abstract translation: 一种组合布线板的制造方法，包括：准备多个布线基板，分别准备具有容纳基板的开口部的金属框架，将所述基板分别放置在所述框架的开口部中，并在所述框架内形成多个压接部， 塑性变形使得板的侧壁结合到框架中的开口部分的侧壁。 板的制备包括形成板的侧壁，使得当板被定位在框架的开口部分中时，板的侧壁相对于开口的侧壁形成宽空间部分和窄空间部分 框架中的部分和卷曲部分的形成包括产生变形，使得框架中的开口部分的侧壁在板的宽空间部分之前邻接板的窄空间部分。

公开(公告)号：US20150055313A1

公开(公告)日：2015-02-26

申请号：US14465127

申请日：2014-08-21

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Michimasa Takahashi

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/0097 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/3494 ,  H05K2201/0909 ,  H05K2201/10424 ,  Y10T29/49126

Abstract: A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.

Abstract translation: 一种组合布线板的制造方法，其特征在于，准备配线基板，分别配置形成为容纳布线基板的开口部的金属框架，将布线基板定位在金属框架的开口部，在金属框架内形成卷曲部 通过塑性变形使得开口部分中的金属框架的侧壁粘合每个布线板的侧壁。 卷边部分形成为使得金属框架中的卷曲部分具有对于金属框架中的卷曲部分的位置设定的塑性变形量。