公开(公告)号：US20190091786A1

公开(公告)日：2019-03-28

申请号：US15719451

申请日：2017-09-28

Applicant: International Business Machines Corporation

Inventor： Jae-Woong Nah ,  John U. Knickerbocker ,  Eric P. Lewandowski

IPC: B23K3/06 ,  B23K3/08

Abstract: An improved molten solder injection head having a vacuum filter and differential gauge system is provided. In one aspect, an injection head is provided. The injection head includes: a reservoir; an injection port on a bottom of the injection head connected to the reservoir; a vacuum port adjacent to the injection port on the bottom of the injection head connected to a vacuum source; and a filter disposed between the bottom of the injection head and the vacuum source. A method for molten solder injection using the present injection head is provided.

公开(公告)号：US20160137548A1

公开(公告)日：2016-05-19

申请号：US14700877

申请日：2015-04-30

Applicant: International Business Machines Corporation

Inventor： Cyril Cabral, JR. ,  Fuad E. Doany ,  Gregory M. Fritz ,  Michael S. Gordon ,  Qiang Huang ,  Eric P. Lewandowski ,  Xiao Hu Liu ,  Kenneth P. Rodbell ,  Thomas M. Shaw

IPC: C03C15/00 ,  G03F7/20 ,  C03B23/203 ,  C03C17/06 ,  C03C23/00

CPC classification number: C03C17/06 ,  C03B23/203 ,  C03C15/00 ,  C03C17/34 ,  C03C21/002 ,  C03C23/0055 ,  C03C27/06 ,  C03C2217/252 ,  C03C2217/261 ,  C03C2218/32 ,  C03C2218/328 ,  C03C2218/34 ,  G03F7/20

Abstract: A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.

Abstract translation: 公开了通过蚀刻和填充玻璃衬底中的沟槽来制造玻璃衬底以控制碎裂特性的方法。 可以确定蚀刻图案。 蚀刻图案可以概括将沟槽蚀刻到玻璃基板的表面中的位置。 蚀刻图案可以被配置为使得玻璃基板在断裂时具有比未被蚀刻的化学强化玻璃更小的碎裂尺寸。 可以根据蚀刻图案形成掩模，并且可以将掩模施加到玻璃基板的表面。 然后可以蚀刻玻璃基板的表面以产生沟槽。 填充材料可以沉积到沟槽中。

公开(公告)号：US20150288023A1

公开(公告)日：2015-10-08

申请号：US14340304

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Eric P. Lewandowski ,  Yu Luo ,  Adinath S. Narasgond

IPC: H01M10/04 ,  H01M4/139 ,  H01M4/38 ,  H01M4/66 ,  H01M4/50

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.

Abstract translation: 包括阳极的电池，阳极包括与金属阳极集电器接触的阳极材料。 电池还包括阴极，其包括与包括透明导电氧化物（TCO）的阴极集电器接触的阴极材料。 电池还包括pH在3至7范围内的电解质。

公开(公告)号：US20150137366A1

公开(公告)日：2015-05-21

申请号：US14610002

申请日：2015-01-30

Applicant: International Business Machines Corporation

Inventor： Gregory M. Fritz ,  Eric P. Lewandowski

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/17 ,  H01L23/49811 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13179 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16501 ,  H01L2224/1713 ,  H01L2224/17163 ,  H01L2224/7525 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/8146 ,  H01L2224/81466 ,  H01L2224/818 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/0541 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2224/81121 ,  H01L2924/00012 ,  H01L2224/757 ,  H01L2924/014 ,  H01L2224/05552

Abstract: An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by time-dependent magnetic field. The magnetic heating can be eddy current heating, hysteresis heating, and/or heating by magnetic relaxation processes. An array of solder balls on a second substrate is brought to contact with the array of bonding pads. A reaction is initiated in the set of magnetic materials by an applied magnetic field. Rapid release of heat during a resulting reaction of the set of reactive materials to form a reacted material melts the solder balls and provides boding between the first substrate and the second substrate. Since the magnetic heating can be localized, the heating and warpage of the substrate can be minimized during the bonding process.

Abstract translation: 包括一组反应性材料的焊盘阵列设置在第一衬底上。 通过由时间依赖磁场引起的磁加热，可以选择一组反应性材料。 磁加热可以是涡流加热，滞后加热和/或通过磁弛豫过程加热。 使第二基板上的焊球的阵列与焊盘的阵列接触。 通过施加的磁场在一组磁性材料中引发反应。 在一组反应性材料的反应期间，在形成反应的材料的反应中快速释放热量，熔化焊球并在第一基板和第二基板之间提供粘结。 由于磁加热可以被定位，所以在接合过程中可以最小化衬底的加热和翘曲。

公开(公告)号：US20140203427A1

公开(公告)日：2014-07-24

申请号：US13744468

申请日：2013-01-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Michael S. Gordon ,  Eric P. Lewandowski

IPC: C09D5/24

CPC classification number: C09D5/24 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  Y10T428/1372

Abstract: An electrically conductive paste providing low alpha particle emission is provided. A resin and conductive particles are mixed, and a curing agent is added. A solvent is subsequently added. The electrically conductive paste including a resin compound is formed by mixing the mixture in a high shear mixer. The electrically conductive paste can be applied to a surface of an article to form a coating, or can be molded into an article. The solvent is evaporated, and the electrically conductive paste is cured to provide a graphite-containing resin compound. The graphite-containing resin compound is electrically conductive, and provides low alpha particle emission at a level suitable for a low alpha particle emissivity coating.

Abstract translation: 提供了提供低α粒子发射的导电膏。 混合树脂和导电颗粒，并加入固化剂。 随后加入溶剂。 通过在高剪切混合器中混合该混合物来形成包含树脂化合物的导电糊料。 导电性糊料可以施加到制品的表面以形成涂层，或者可以模制成制品。 蒸发溶剂，使导电糊固化，得到含石墨的树脂化合物。 含石墨的树脂化合物是导电的，并且在适于低α粒子​​发射率涂层的水平下提供低的α粒子发射。

公开(公告)号：US11766729B2

公开(公告)日：2023-09-26

申请号：US15719451

申请日：2017-09-28

Applicant: International Business Machines Corporation

Inventor： Jae-Woong Nah ,  John U. Knickerbocker ,  Eric P. Lewandowski

IPC: B23K3/06 ,  B23K3/08

CPC classification number: B23K3/0615 ,  B23K3/08

Abstract: An improved molten solder injection head having a vacuum filter and differential gauge system is provided. In one aspect, an injection head is provided. The injection head includes: a reservoir; an injection port on a bottom of the injection head connected to the reservoir; a vacuum port adjacent to the injection port on the bottom of the injection head connected to a vacuum source; and a filter disposed between the bottom of the injection head and the vacuum source. A method for molten solder injection using the present injection head is provided.

公开(公告)号：US11158781B2

公开(公告)日：2021-10-26

申请号：US16698171

申请日：2019-11-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jae-Woong Nah ,  Li-Wen Hung ,  Eric P. Lewandowski ,  Adinath S. Narasgond

IPC: H01L39/06 ,  G06N10/00 ,  H01L27/18 ,  H01L39/04 ,  H01L39/24

Abstract: A quantum device includes a qubit chip having a plurality of qubits and an interposer attached to and electrically connected to the qubit chip. The device also includes a substrate handler attached to one side of the qubit chip or to one side of the interposer, or both so as to be thermally in contact with the qubit chip or the interposer, or both. The substrate handler includes a plurality of vias, at least a portion of plurality of vias being filled with a non-superconducting material, the non-superconducting material being selected to dissipate heat generated in the qubit chip, the interposer or both.

公开(公告)号：US10686164B2

公开(公告)日：2020-06-16

申请号：US16028085

申请日：2018-07-05

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Eric P. Lewandowski ,  Yu Luo ,  Adinath S. Narasgond

IPC: H01M2/02 ,  G02C7/08 ,  A61B5/145 ,  H01M4/66 ,  C25D1/04 ,  C25D1/22 ,  H01M4/38 ,  H01M4/50 ,  H01M10/04 ,  C25D5/02 ,  H01M4/42 ,  H01M4/48 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/50 ,  H01M4/139 ,  H01M4/02

Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.

公开(公告)号：US09953908B2

公开(公告)日：2018-04-24

申请号：US14928263

申请日：2015-10-30

Applicant: International Business Machines Corporation

Inventor： Eric P. Lewandowski ,  Jae-Woong Nah ,  Peter J. Sorce

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/027 ,  H01L21/3205 ,  H01L21/3213 ,  H05K3/06 ,  H05K3/12

CPC classification number: H01L23/49816 ,  H01L21/0273 ,  H01L21/32051 ,  H01L21/32133 ,  H01L21/4853 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2224/11 ,  H05K3/064 ,  H05K3/12 ,  H05K3/3457 ,  H05K3/4007 ,  H05K2203/04

Abstract: A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and openings in the photoresist layer are filled with solder to form solder bumps. The barrier layer may be removed from within the openings prior to filling the openings with solder. The process is applicable to fine pitch architectures and chip size packaging substrates. The photoresist layer and portions of the barrier layer outside of the openings are removed following solder fill.

公开(公告)号：US20170125329A1

公开(公告)日：2017-05-04

申请号：US14928263

申请日：2015-10-30

Applicant: International Business Machines Corporation

Inventor： Eric P. Lewandowski ,  Jae-Woong Nah ,  Peter J. Sorce

IPC: H01L23/498 ,  H01L21/027 ,  H05K3/12 ,  H01L21/3213 ,  H05K3/06 ,  H01L21/48 ,  H01L21/3205

CPC classification number: H01L23/49816 ,  H01L21/0273 ,  H01L21/32051 ,  H01L21/32133 ,  H01L21/4853 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2224/11 ,  H05K3/064 ,  H05K3/12 ,  H05K3/3457 ,  H05K3/4007 ,  H05K2203/04

Abstract: A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and openings in the photoresist layer are filled with solder to form solder bumps. The barrier layer may be removed from within the openings prior to filling the openings with solder. The process is applicable to fine pitch architectures and chip size packaging substrates. The photoresist layer and portions of the barrier layer outside of the openings are removed following solder fill.