公开(公告)号：US08674502B2

公开(公告)日：2014-03-18

申请号：US12838291

申请日：2010-07-16

申请人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

发明人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L21/563 ,  C08G59/42 ,  C08L63/00 ,  C09J163/00 ,  C09J163/04 ,  C09J179/08 ,  H01L23/293 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81805 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

摘要翻译： 本发明涉及半导体封装胶粘剂，半导体封装膜状粘合剂，半导体装置的制造方法以及半导体装置。 本发明提供了包含（a）环氧树脂和（b）由与环氧树脂反应的有机酸和固化促进剂形成的化合物的半导体封装粘合剂。

公开(公告)号：US08034659B2

公开(公告)日：2011-10-11

申请号：US12306285

申请日：2007-06-20

申请人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

发明人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67092 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.

摘要翻译： 为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。 依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。 通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。 将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是 通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

公开(公告)号：US07907232B2

公开(公告)日：2011-03-15

申请号：US12253266

申请日：2008-10-17

申请人： Tetsuya Enomoto

发明人： Tetsuya Enomoto

IPC分类号： G02F1/1333

CPC分类号： G02F1/133308 ,  G02B6/0093 ,  G02F2001/133311 ,  G02F2001/133317 ,  G02F2201/36

摘要： A liquid crystal display device which prevents the occurrence of an abnormal display on a screen by interrupting the intrusion of a foreign material to a backlight portion arranged inside of a liquid crystal display panel is provided. By adopting the constitution which blocks the intrusion of a foreign material from a gap formed in a liquid crystal display panel by means of a spacer arranged between the liquid crystal display panel and a middle frame, the intrusion of the foreign material to a sheet portion of a backlight can be prevented.

摘要翻译： 提供一种液晶显示装置，其通过中断异物侵入到布置在液晶显示面板内部的背光源部分来防止在屏幕上发生异常显示。 通过采用通过布置在液晶显示面板和中间框架之间的隔离物从形成在液晶显示面板上的间隙阻止异物侵入的结构，异物侵入到 可以防止背光。

公开(公告)号：US20080289868A1

公开(公告)日：2008-11-27

申请号：US12182908

申请日：2008-07-30

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K1/11 ,  H05K1/16

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

公开(公告)号：US20110291260A1

公开(公告)日：2011-12-01

申请号：US12788110

申请日：2010-05-26

申请人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

发明人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

IPC分类号： H01L23/498 ,  C09J163/00 ,  H01L21/56

CPC分类号： H01L23/293 ,  C08K3/014 ,  C08K5/13 ,  C08L79/08 ,  C09J163/00 ,  H01L21/563 ,  H01L2224/73204 ,  H01L2224/83192 ,  C08K3/0041

摘要： A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

摘要翻译： 一种半导体封装胶粘剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）抗氧化剂。

公开(公告)号：US08028402B2

公开(公告)日：2011-10-04

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/36 ,  H01R9/00 ,  H01K3/10

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.

摘要翻译： 公开了一种多层布线板的制造方法，该方法包括：准备连接板，连接板分别具有绝缘树脂组合物层，形成为穿过绝缘树脂组合物层的连接导体和导体电路 形成在绝缘树脂组合物层上并连接到连接导体; 对准连接板; 并且通过加热和压制层叠对准的连接板，使得连接导体或连接导体和导体电路彼此导电连接，并且连接板通过绝缘树脂组合物层彼此机械连接。 连接板通过特定的加工形成，包括使用三层复合金属层。

公开(公告)号：US20100003771A1

公开(公告)日：2010-01-07

申请号：US12306285

申请日：2007-06-20

申请人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

发明人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

IPC分类号： H01L21/60 ,  H01L21/301 ,  H01L21/683 ,  C08L63/00

CPC分类号： H01L21/6835 ,  H01L21/67092 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.

摘要翻译： 为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。 依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。 通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。 将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是 通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

公开(公告)号：US07488521B2

公开(公告)日：2009-02-10

申请号：US10980313

申请日：2004-11-04

申请人： Katsumi Morohoshi ,  Hiroshi Kumagai ,  Tetsuya Enomoto

发明人： Katsumi Morohoshi ,  Hiroshi Kumagai ,  Tetsuya Enomoto

IPC分类号： B29D22/00 ,  B29D23/00 ,  B32B1/08

CPC分类号： B32B1/08 ,  B32B27/36 ,  B32B2597/00 ,  F16L9/133 ,  Y10T428/1352 ,  Y10T428/1359 ,  Y10T428/139 ,  Y10T428/1393 ,  Y10T428/2933

摘要： A resinous tube which has a low permeability for alcohol-contained fuel in addition to usual gasoline and is sufficiently high in adhesiveness between a barrier layer (permeation-interrupting layer) and a protecting layer (layer covering the permeation-interrupting layer), is easy in reuse of marginal materials and the like, and is a low cost material arrangement is furnished. This resinous tube is formed by laminating pipe-shaped resin layers, in which a main component of at least one layer of layers constituting the tube is a resin such as PBT, PBN, PET, PEN or the like, and a main component of a layer other than the above-mentioned layer is PBT copolymer. The PBT copolymer contains an acid component and a glycol component.

摘要翻译： 除了通常的汽油之外，对于含醇燃料具有低渗透性并且在阻挡层（渗透阻断层）和保护层（覆盖渗透阻断层的层）之间的粘合性足够高的树脂管是容易的 在边缘材料的再利用等方面，是一种低成本的材料安排。 该树脂管通过层叠管状树脂层而形成，其中构成管的至少一层的主要成分是诸如PBT，PBN，PET，PEN等的树脂，以及主要成分 上述层以外的层是PBT共聚物。 PBT共聚物含有酸组分和二醇组分。

公开(公告)号：US07205645B2

公开(公告)日：2007-04-17

申请号：US10203652

申请日：2001-02-21

申请人： Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

发明人： Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

摘要翻译： 布线基板（1）包括具有连接孔（11）的绝缘基座（10），设置在连接孔（11）中的埋入导体（12），而不到达绝缘基座（10）的后表面，并且布线层14 连接到埋地导体（12）。 掩埋导体（12）使布线层（14）变厚，并且可以在用于三维安装结构的连接孔（11）的后表面上形成对准部分（110）。 每个布线层（14）包括薄端子（14A），布线（14B）和厚电极（14C）。 不仅端子（14A）和布线（14B）以及埋地导体（12）都通过相同的制造工艺升高。 半导体元件（2）附着到布线基板（1）的电极（14C）上。

公开(公告)号：US5825997A

公开(公告)日：1998-10-20

申请号：US561422

申请日：1995-11-21

申请人： Teruhiro Yamada ,  Takahisa Ando ,  Tetsuya Enomoto

发明人： Teruhiro Yamada ,  Takahisa Ando ,  Tetsuya Enomoto

IPC分类号： H04N13/02 ,  H04N13/00

CPC分类号： H04N13/0221 ,  H04N13/0055 ,  H04N13/026 ,  H04N13/0296 ,  H04N13/0003 ,  H04N13/0059 ,  H04N13/0239

摘要： Rotating image data of a subject which is composed of two-dimensional image data for each predetermined angle of rotation of the subject is stored in storing device. Reference image data and image data delayed from the reference image data are selected out of the two-dimensional image data for each predetermined angle of rotation of the subject which are stored in the storing device, and are successively read out. One of the reference image data and the delayed image data which are read out is output as a left eye image signal, and the other image data is output as a right eye image signal.

摘要翻译： 存储装置中存储了由对象的每个预定旋转角度的由二维图像数据构成的被摄体的旋转图像数据。 从存储在存储装置中的被摄体的每个预定旋转角度的二维图像数据中，从参考图像数据延迟的参考图像数据和图像数据被选择，并被连续地读出。 将读出的参考图像数据和延迟图像数据中的一个作为左眼图像信号输出，另一个图像数据作为右眼图像信号输出。