公开(公告)号：US08003897B2

公开(公告)日：2011-08-23

申请号：US12713274

申请日：2010-02-26

申请人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K1/11

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board includes a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 μm or less.

摘要翻译： 一种印刷电路板，包括设置有至少一个导体电路的布线基板，形成在所述布线基板的表面上的阻焊层，覆盖所述至少一个导体电路，形成在所述至少一个导体电路的一部分上的导体焊盘 从设置在用于安装电子部件的阻焊层中的各个开口露出，以及形成在各个导体焊盘上的焊料凸块。 通过使窄阻抗层的高度H与焊锡凸块的比例（H / D）在开口直径大约0.55至1.0左右，在窄间距结构下，在距离 设置在阻焊层上的开口约为200μm以下。

公开(公告)号：US20080107863A1

公开(公告)日：2008-05-08

申请号：US11935207

申请日：2007-11-05

申请人： Tomoyuki Ikeda ,  Naoaki Fujii ,  Seiji Izawa

发明人： Tomoyuki Ikeda ,  Naoaki Fujii ,  Seiji Izawa

IPC分类号： H05K1/00 ,  B32B3/10 ,  H05K3/00

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multilayered printed wiring board includes a multilayered core substrate having multiple insulation layers and one or more stacked via structure formed through the multiple insulation layers, and a build-up structure formed over the multilayered core substrate and including multiple interlaminar insulation layers and multiple conductor circuits. The stacked via structure has multiple vias formed in the multiple insulation layers, respectively. Each of the interlaminar insulation layers includes a resin material without a core material. The multiple insulation layers in the multilayered core substrate have three or more insulation layers and each of the insulation layers in the multilayered core substrate includes a core material impregnated with a resin.

摘要翻译： 多层印刷电路板包括具有多个绝缘层的多层芯基板和通过多个绝缘层形成的一个或多个堆叠的通孔结构，以及形成在多层芯基板上的堆积结构，并且包括多个层间绝缘层和多个导体电路 。 堆叠的通孔结构分别在多个绝缘层中形成多个通孔。 每个层间绝缘层包括没有芯材的树脂材料。 多层核心基板中的多个绝缘层具有三层以上的绝缘层，多层核心基板中的各绝缘层包含浸渍有树脂的芯材。

公开(公告)号：US07217706B2

公开(公告)日：2007-05-15

申请号：US10074020

申请日：2002-02-14

申请人： Kiyoshi Taniguchi ,  Minoru Sakurai ,  Naoaki Fujii ,  Kumi Hosoi ,  Yasuyo Tomishima ,  Hisashi Takasugi ,  Hajime Sogabe ,  Hirofumi Ishikawa ,  Naomi Hanioka

发明人： Kiyoshi Taniguchi ,  Minoru Sakurai ,  Naoaki Fujii ,  Kumi Hosoi ,  Yasuyo Tomishima ,  Hisashi Takasugi ,  Hajime Sogabe ,  Hirofumi Ishikawa ,  Naomi Hanioka

IPC分类号： A61K31/54 ,  A61K31/24 ,  C09D211/06 ,  C09D211/70 ,  C07C233/00

CPC分类号： C07D213/40 ,  A61K31/165 ,  A61K31/223 ,  A61K31/404 ,  A61K31/4045 ,  A61K31/426 ,  A61K31/44 ,  A61K31/4402 ,  A61K31/4406 ,  A61K31/4409 ,  A61K31/4468 ,  A61K31/495 ,  A61K31/501 ,  A61K31/5375 ,  C07C215/46 ,  C07C217/30 ,  C07C217/74 ,  C07C219/24 ,  C07C229/18 ,  C07C229/50 ,  C07C233/25 ,  C07C233/43 ,  C07C233/80 ,  C07C235/20 ,  C07C235/24 ,  C07C237/48 ,  C07C271/24 ,  C07C271/30 ,  C07C271/58 ,  C07C275/22 ,  C07C279/22 ,  C07C307/02 ,  C07C307/10 ,  C07C311/08 ,  C07C311/18 ,  C07C317/32 ,  C07C323/25 ,  C07C323/41 ,  C07C2601/06 ,  C07C2601/14 ,  C07C2602/12 ,  C07D209/08 ,  C07D209/16 ,  C07D211/26 ,  C07D213/73 ,  C07D213/85 ,  C07D233/60 ,  C07D235/26 ,  C07D277/46 ,  C07D295/185 ,  C07D401/04 ,  C07D417/14

摘要： This invention relates to new propanolamine derivatives or salts thereof represented by the following formula [I]: Wherein each symbol is as defined in the specification or salts thereof which have gut selective sympathomimetic, anti-ulcerous, anti-pancreatitis, lipolytic, anti-urinary incontinence and anti-pollakiuria activities, to processes for the preparation thereof, to a pharmaceutical composition comprising the same and to a method for the prevention and/or treatment diseases indicated in the specification to a human being or an animal.

摘要翻译： 本发明涉及由下式[I]表示的新的丙醇胺衍生物或其盐：其中每个符号如说明书中所定义或其盐，其具有肠选择性交感神经兴奋剂，抗溃疡性，抗胰腺炎，脂肪分解，抗尿液 失禁和抗尿频活动，其制备方法，包含其的药物组合物，以及用于预防和/或治疗本说明书中对人或动物表示的疾病的方法。

公开(公告)号：US06826033B2

公开(公告)日：2004-11-30

申请号：US10380627

申请日：2003-03-21

申请人： Minoru Sakurai ,  Kenichi Washizuka ,  Hitoshi Hamashima ,  Yasuyo Tomishima ,  Masashi Imanishi ,  Yutaka Nakajima ,  Hiroaki Ohtake ,  Satoru Kuroda ,  Masayoshi Murata ,  Hiroshi Kayakiri ,  Naoaki Fujii ,  Kiyoshi Taniguchi

发明人： Minoru Sakurai ,  Kenichi Washizuka ,  Hitoshi Hamashima ,  Yasuyo Tomishima ,  Masashi Imanishi ,  Yutaka Nakajima ,  Hiroaki Ohtake ,  Satoru Kuroda ,  Masayoshi Murata ,  Hiroshi Kayakiri ,  Naoaki Fujii ,  Kiyoshi Taniguchi

IPC分类号： H01G902

CPC分类号： C07D207/416 ,  C07C233/43 ,  C07C233/62 ,  C07C233/80 ,  C07C235/56 ,  C07C275/40 ,  C07C275/42 ,  C07C275/54 ,  C07C311/08 ,  C07C2601/10 ,  C07C2601/14 ,  C07C2602/10 ,  C07D207/34 ,  C07D209/08 ,  C07D209/18 ,  C07D209/40 ,  C07D209/42 ,  C07D209/88 ,  C07D213/40 ,  C07D213/56 ,  C07D213/75 ,  C07D213/81 ,  C07D213/82 ,  C07D215/38 ,  C07D215/40 ,  C07D215/48 ,  C07D215/50 ,  C07D217/22 ,  C07D217/26 ,  C07D231/14 ,  C07D231/56 ,  C07D233/90 ,  C07D235/06 ,  C07D235/08 ,  C07D235/16 ,  C07D237/28 ,  C07D241/20 ,  C07D241/42 ,  C07D241/44 ,  C07D249/08 ,  C07D261/14 ,  C07D261/18 ,  C07D261/20 ,  C07D263/34 ,  C07D277/28 ,  C07D277/56 ,  C07D295/215 ,  C07D307/54 ,  C07D307/66 ,  C07D307/68 ,  C07D307/82 ,  C07D333/36 ,  C07D333/38 ,  C07D333/66 ,  C07D333/70 ,  C07D487/04 ,  Y02P20/55

摘要： The present invention relates to a compound formula (I) wherein X1 is bond or —O—CH2—, (II) or (III) R1 is hydrogen or an amino protective group, a is phenyl, indolyl or carbazolyl, each of which may be substituted with one or two substituent(s), and B is hydrogen; halogen; lower alkyl; lower alkoxycarbonyl; cyclo(lower)alkyl; or a heterocyclic group, naphthyl, 1,2,3,4-tetrahydronaphthyl, benzyl or phenyl, each of which may be substituted with one or two substituent(s), or a salt thereof. The compound (I) of the present invention and pharmaceutically acceptable salts thereof are useful for the prophylactic and/or the therapeutic treatment of pollakiures or urinary incontinence.

摘要翻译： 本发明涉及其中X 1为键或-O-CH 2 - ，（II）或（III）R 1为氢或氨基保护基的化合物式（I），a为苯基，吲哚基或咔唑基，各自为 可以被一个或两个取代基取代，B是氢; 卤素; 低级烷基 低级烷氧基羰基; 环（低级）烷基; 或杂环基，萘基，1,2,3,4-四氢萘基，苄基或苯基，其各自可以被一个或两个取代基取代，或其盐。 本发明的化合物（I）及其药学上可接受的盐可用于预防和/或治疗感染或尿失禁。

公开(公告)号：US06495546B1

公开(公告)日：2002-12-17

申请号：US09646878

申请日：2000-11-22

申请人： Kiyoshi Taniguchi ,  Minoru Sakurai ,  Naoaki Fujii ,  Kumi Hosoi ,  Yasuyo Tomishima ,  Hisashi Takasugi ,  Hajime Sogabe ,  Hirofumi Ishikawa ,  Naomi Hanioka

发明人： Kiyoshi Taniguchi ,  Minoru Sakurai ,  Naoaki Fujii ,  Kumi Hosoi ,  Yasuyo Tomishima ,  Hisashi Takasugi ,  Hajime Sogabe ,  Hirofumi Ishikawa ,  Naomi Hanioka

IPC分类号： A61K3154

CPC分类号： C07D213/40 ,  A61K31/165 ,  A61K31/223 ,  A61K31/404 ,  A61K31/4045 ,  A61K31/426 ,  A61K31/44 ,  A61K31/4402 ,  A61K31/4406 ,  A61K31/4409 ,  A61K31/4468 ,  A61K31/495 ,  A61K31/501 ,  A61K31/5375 ,  C07C215/46 ,  C07C217/30 ,  C07C217/74 ,  C07C219/24 ,  C07C229/18 ,  C07C229/50 ,  C07C233/25 ,  C07C233/43 ,  C07C233/80 ,  C07C235/20 ,  C07C235/24 ,  C07C237/48 ,  C07C271/24 ,  C07C271/30 ,  C07C271/58 ,  C07C275/22 ,  C07C279/22 ,  C07C307/02 ,  C07C307/10 ,  C07C311/08 ,  C07C311/18 ,  C07C317/32 ,  C07C323/25 ,  C07C323/41 ,  C07C2601/06 ,  C07C2601/14 ,  C07C2602/12 ,  C07D209/08 ,  C07D209/16 ,  C07D211/26 ,  C07D213/73 ,  C07D213/85 ,  C07D233/60 ,  C07D235/26 ,  C07D277/46 ,  C07D295/185 ,  C07D401/04 ,  C07D417/14

摘要： Propanolamine derivatives represented by the following formula (I): These derivatives may be &bgr;3 agonists and exert sympathomimetic, anti-ulcerous, anti-pancreatitis, lipolytic and anti-urinary incontinence and anti-pollakiuria activities. Pharmaceutical compositions containing such propanolamine derivatives, methods for the prevention and/or treatment diseases using these propanolamine derivatives, and processes for their preparation are also described.

摘要翻译： 由下式（I）表示的丙醇胺衍生物：这些衍生物可以是β3激动剂，并且发挥拟交感神经，抗溃疡，抗胰腺炎，脂肪分解和抗尿失禁和抗尿频活性。 还描述了含有这种丙醇胺衍生物的药物组合物，使用这些丙醇胺衍生物预防和/或治疗疾病的方法及其制备方法。

公开(公告)号：US08966750B2

公开(公告)日：2015-03-03

申请号：US13167305

申请日：2011-06-23

申请人： Tomoyuki Ikeda ,  Naoaki Fujii ,  Seiji Izawa

发明人： Tomoyuki Ikeda ,  Naoaki Fujii ,  Seiji Izawa

IPC分类号： H01K3/10 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46 ,  H05K1/11

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.

摘要翻译： 一种制造多层印刷布线板的方法，包括形成包括绝缘层和通过绝缘层形成的一个或多个堆叠的通孔结构的多层芯基板，分别形成在绝缘层中的通孔的堆叠通孔结构分别包括在绝缘层中的绝缘层 所述多层芯基板包括至少三个绝缘层，所述多层芯基板中的每个所述绝缘层包括浸渍有树脂的芯材，并且在所述多层芯基板上形成堆积结构，并且包括层间绝缘层和导体电路， 每个层间绝缘层包括没有芯材的树脂材料。

公开(公告)号：US08613136B2

公开(公告)日：2013-12-24

申请号：US12614576

申请日：2009-11-09

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H01K3/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US20110214915A1

公开(公告)日：2011-09-08

申请号：US13109745

申请日：2011-05-17

申请人： Yoichiro KAWAMURA ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro KAWAMURA ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K1/11

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad.In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.

摘要翻译： 一种印刷电路板，包括配置有至少一个导体电路的布线基板，设置在布线基板的表面上的阻焊层，至少一个导体焊盘，由导体电路的一部分露出， 抗蚀剂层和用于将电子部件安装在导体焊盘上的至少一个焊料凸块。 在印刷电路板中，由于至少一个导体焊盘以约200μm以下的间距排列，并且焊料凸块的直径W与形成的开口的开口直径D的比（W / D） 在阻焊层中约1.05〜约1.7，可以容易地提高连接可靠性和绝缘可靠性。

公开(公告)号：US20110061232A1

公开(公告)日：2011-03-17

申请号：US12952537

申请日：2010-11-23

申请人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K3/30

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method for manufacturing a printed wiring board including providing a structure having a wiring substrate having a conductor circuit, a build-up multilayer structure formed over the wiring substrate and having an outermost conductor circuit and an outermost insulative resin layer, and a solder resist layer formed over the outermost conductor circuit and outermost insulative resin layer and having openings with an opening diameter D for mounting electronic elements, forming conductor pads with a pitch of about 200 pm or less on the outermost conductor circuit in the openings of the solder resist layer, respectively, and forming solder bumps with a height H from a surface of the solder resist layer on the conductor pads on the conductor pads, respectively, such that a ratio H/D is about 0.55 to about 1.0.

摘要翻译： 一种印刷布线板的制造方法，其特征在于，具备具有布线基板的结构的布线基板，所述布线基板具有导体电路，在所述布线基板上形成的具有最外侧导体电路和最外层绝缘性树脂层的积层叠层结构，以及阻焊层 形成在最外导体电路和最外绝缘树脂层上，具有用于安装电子元件的开口直径D的开口，在阻焊层的开口中的最外导体电路上形成具有约200μm以下间距的导体焊盘， 并且分别在导体焊盘上的导体焊盘上形成具有高度H的阻焊层的焊料凸块，使得H / D的比率为约0.55至约1.0。

公开(公告)号：US20100043942A1

公开(公告)日：2010-02-25

申请号：US12614576

申请日：2009-11-09

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： B32B38/00 ,  B32B38/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。