公开(公告)号：US20110061913A1

公开(公告)日：2011-03-17

申请号：US12992306

申请日：2009-03-23

申请人： Takayuki Higuchi ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Kentaro Kumazawa

发明人： Takayuki Higuchi ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Kentaro Kumazawa

IPC分类号： H05K1/02 ,  H05K3/30

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K2201/0187 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A method of manufacturing a mounting structure includes: an insulating resin arranging step of forming, on a circuit board, two kinds of insulating resin including first insulating resin cured at first curing temperature and second insulating resin cured at second curing temperature higher than the first curing temperature; a mounting step of aligning the bumps formed on an electronic component such that the bumps are opposed to counter electrodes of the circuit board; and a full-scale pressing step of performing, after the mounting step, full-scale pressing to join the electronic component and the circuit board. The insulating resin is heated to reach the first curing temperature before the full-scale pressing, and the insulating resin is heated to reach the second temperature during the full-scale pressing after the curing of the first insulating resin.

摘要翻译： 一种制造安装结构的方法包括：绝缘树脂布置步骤，在电路板上形成两种绝缘树脂，所述绝缘树脂包括在第一固化温度下固化的第一绝缘树脂和在比第一固化的第二固化温度下固化的第二绝缘树脂 温度; 将形成在电子部件上的凸块对准使得凸块与电路板的对置电极相对的安装步骤; 以及全尺寸按压步骤，在安装步骤之后进行全尺寸按压以连接电子部件和电路板。 在全压制之前，将绝缘树脂加热到达第一固化温度，并且在固化第一绝缘树脂之后，在全压制期间将绝缘树脂加热到达第二温度。

公开(公告)号：US20100032832A1

公开(公告)日：2010-02-11

申请号：US12531819

申请日：2008-05-09

申请人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

发明人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

IPC分类号： H01L23/488

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05076 ,  H01L2224/05554 ,  H01L2224/05576 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.

摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。

公开(公告)号：US5640051A

公开(公告)日：1997-06-17

申请号：US353438

申请日：1994-12-09

申请人： Yoshihiro Tomura ,  Yoshihiro Bessho ,  Yasuhiko Hakotani

发明人： Yoshihiro Tomura ,  Yoshihiro Bessho ,  Yasuhiko Hakotani

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/485 ,  H01L23/498 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/40 ,  H01L23/02 ,  H01L23/12 ,  H01L23/50

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H05K3/321 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/181 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10568 ,  H05K2201/10719 ,  H05K2201/10984 ,  H05K2203/0577 ,  H05K2203/167 ,  H05K3/243

摘要： A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.

摘要翻译： 根据本发明的芯片载体包括：载体，其包括上表面，下表面和内导体; 以及形成在所述载体主体的上表面上的多个端子电极，所述多个端子电极将LSI芯片电连接到所述内部导体。 多个用于将电路基板上的多个电极电连接到内部导体的凹部设置在载体主体的下表面上，凹部电连接到内部导体。

公开(公告)号：US5485949A

公开(公告)日：1996-01-23

申请号：US233829

申请日：1994-04-26

申请人： Yoshihiro Tomura ,  Yoshihiro Bessho

发明人： Yoshihiro Tomura ,  Yoshihiro Bessho

IPC分类号： B23K20/00 ,  H01L21/60 ,  H01L21/603

CPC分类号： H01L24/81 ,  B23K20/007 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78703 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14

摘要： The capillary for ball bonding for forming a bump on the electrode pad of a semiconductor device includes a pressing member having a bore therein for supplying a metal wire, and a leveling member. The pressing member presses the ball-like end of the metal wire against the electrode pad in order to secure the ball-like end to the electrode pad under pressure. The leveling member makes the bump formed on the electrode pad to a predetermined height. According to the method of forming a bump using the capillary, first, a ball is formed at the end of the metal wire supplied from the bore. A first portion of the bump is formed by moving the capillary downwards and by securing the ball-like end to the electrode pad under pressure by the pressing member. A second portion of the bump is formed on the first portion by supplying the metal wire while the capillary is moved. When the capillary is moved downwards, a portion of the metal wire constituting the second portion is cut from the remaining portion of the metal wire in the bore by an edge of the pressing member, and simultaneously the bump is leveled by the leveling member.

摘要翻译： 用于在半导体器件的电极焊盘上形成凸块的用于球形焊接的毛细管包括其中具有用于供应金属丝的孔的按压构件和调平构件。 按压构件将金属丝的球状的一端压在电极垫上，以便在压力下将球状端固定到电极垫上。 调平构件将形成在电极垫上的凸块制成预定高度。 根据使用毛细管形成凸块的方法，首先，在从孔提供的金属线的端部形成球。 凸起的第一部分是通过向下移动毛细管并且通过按压构件在压力下将球状端固定到电极垫而形成的。 凸起的第二部分通过在毛细管移动时供给金属丝而形成在第一部分上。 当毛细管向下移动时，构成第二部分的金属线的一部分通过加压构件的边缘从孔中的金属丝的剩余部分切割，并且同时由平整构件平整凸起。

公开(公告)号：US4202641A

公开(公告)日：1980-05-13

申请号：US841434

申请日：1977-10-12

申请人： Yoshihiro Tomura

发明人： Yoshihiro Tomura

IPC分类号： B43K24/18 ,  B43K27/02 ,  B43K24/10

CPC分类号： B43K27/02

摘要： A mechanical pencil unit of the pushbutton-action type and a ballpoint pen unit are housed in a common holder having top and bottom sections which are rotatable in oppposite directions relative to each other. Mounted within the holder and substantially secured to its bottom section only is a cradle which supports and constrains the two writing units for independent longitudinal motion with respect to the holder. The writing units are spring-biased into sliding engagement with an overhanging, downward-facing cam ledge on the inside surface of the holder top section, such that the writing units are selectively moved from a retracted to a writing position upon manual rotation of the holder top section in either direction relative to its bottom section. Upon movement of the mechanical pencil unit to the writing position, an offset pusher finger extending downwardly from a pushbutton on the holder is moved into alignment with the pencil unit for actuating and making the same ready for writing or marking.

摘要翻译： 按钮动作型的自动铅笔单元和圆珠笔单元容纳在具有可相对于彼此的相反方向旋转的顶部和底部的公共保持器中。 安装在保持器内并且基本上固定到其底部部分的仅是支架，其支撑和约束两个书写单元，用于相对于保持器的独立纵向运动。 书写单元被弹簧偏置成与保持器顶部的内表面上的悬垂的朝下的凸轮凸缘滑动接合，使得当手柄旋转时，书写单元被选择性地从缩回位置移动到书写位置 顶部相对于底部的任一方向。 当自动铅笔单元移动到书写位置时，从保持器上的按钮向下延伸的偏移推动手指移动成与铅笔单元对齐，用于致动并使其准备好书写或标记。

公开(公告)号：US08436253B2

公开(公告)日：2013-05-07

申请号：US12992306

申请日：2009-03-23

申请人： Takayuki Higuchi ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Kentaro Kumazawa

发明人： Takayuki Higuchi ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Kentaro Kumazawa

IPC分类号： H05K1/00

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K2201/0187 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.

摘要翻译： 提供一种安装结构，其包括电子部件; 电路板; 第一绝缘树脂和第二绝缘树脂，其被放置在电子部件和电路板之间用于密封; 在电子部件或电路基板上形成多个凸块; 连接到所述多个凸块的所述电路板或所述电子部件的多个对置电极; 和多个接合区域。 多个连接区域由第二绝缘树脂形成，多个第一绝缘树脂区域设置在接合区域周围，使得接合区域被多个第一绝缘树脂区域夹持，第一绝缘树脂和第二绝缘树脂区域 树脂各自含有填料，第二绝缘树脂的固化温度比第一绝缘树脂的固化温度高。

公开(公告)号：US08163599B2

公开(公告)日：2012-04-24

申请号：US12933819

申请日：2009-03-30

申请人： Yoshihiro Tomura ,  Kentaro Kumazawa ,  Takayuki Higuchi ,  Koujiro Nakamura

发明人： Yoshihiro Tomura ,  Kentaro Kumazawa ,  Takayuki Higuchi ,  Koujiro Nakamura

IPC分类号： H01L21/44

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L21/568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75304 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  Y10T428/249954 ,  H01L2924/00

摘要： A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.

摘要翻译： 倒装芯片安装装置在工具保护片（10）的加压膜（10b）侧具有屏蔽膜（18）。 当通过工具保护片（10）对半导体芯片（1）加热加压时，加压膜（10b）通过片材固定夹具（9）从模具中释放，并通过加压/加热工具 11）抵靠从半导体芯片（1）的周围突出的绝缘树脂膜（5），并施加外部压力使绝缘树脂膜（5）固化。

公开(公告)号：US08050049B2

公开(公告)日：2011-11-01

申请号：US12427056

申请日：2009-04-21

申请人： Teppei Iwase ,  Kazuhiro Nobori ,  Yoshihiro Tomura ,  Koujiro Nakamura ,  Kentaro Kumazawa

发明人： Teppei Iwase ,  Kazuhiro Nobori ,  Yoshihiro Tomura ,  Koujiro Nakamura ,  Kentaro Kumazawa

IPC分类号： H05K7/00

CPC分类号： H05K1/181 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/09036 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/611

摘要： The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip 31 mounted on the top surface of the circuit board 2 overlaps with the semiconductor chip 32 mounted on the bottom surface of the circuit board 2, a recess portion 21 (or a protruding portion 22) is formed in the surfaces of the circuit board 2.

摘要翻译： 本发明提供了一种双面安装结构的半导体器件，其包括在电路板的相对表面上布置和接合在一起的电路板和多个半导体芯片，其中在安装在电路板上的半导体芯片31的区域中 电路板2的顶面与安装在电路基板2的底面的半导体芯片32重叠，在电路基板2的表面形成有凹部21（或突出部22）。

公开(公告)号：US07994638B2

公开(公告)日：2011-08-09

申请号：US12531819

申请日：2008-05-09

申请人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

发明人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

IPC分类号： H01L23/488

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05076 ,  H01L2224/05554 ,  H01L2224/05576 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.

摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。

公开(公告)号：US20110042808A1

公开(公告)日：2011-02-24

申请号：US12989777

申请日：2009-04-14

申请人： Kentaro Kumazawa ,  Yoshihiro Tomura

发明人： Kentaro Kumazawa ,  Yoshihiro Tomura

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L24/05 ,  B33Y80/00 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0501 ,  H01L2224/0502 ,  H01L2224/05099 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/06051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor device includes a semiconductor element having a plurality of element electrodes formed thereon, a circuit board having board electrodes respectively corresponding to the element electrodes formed thereon and having the semiconductor element mounted thereon, and bumps each of which is provided on at least one of the element electrode and the board electrode, and connects together the element electrode and the board electrode corresponding to each other when the semiconductor element is mounted on the circuit board. Furthermore, at least one of a dielectric layer and a resistive layer is provided between at least one of the bumps and the element or board electrode on which the at least one of the bumps is provided, so that the element or board electrode, the dielectric layer or the resistive layer, and the bump form a parallel-plate capacitor or electrical resistance.

摘要翻译： 半导体器件包括其上形成有多个元件电极的半导体元件，具有分别对应于其上形成有元件电极并且具有安装有半导体元件的基板电极的电路板，以及设置在其上的至少一个上的凸块 元件电极和基板电极，并且当将半导体元件安装在电路板上时，将元件电极和板电极彼此对应连接在一起。 此外，在至少一个凸块和设置有至少一个凸块的元件或电路板电极之间提供电介质层和电阻层中的至少一个，使得元件或基板电极，电介质 层或电阻层，并且凸起形成平行板电容器或电阻。