摘要:
A coated metal component includes an aluminum alloy substrate and a protective aluminum coating on a substrate. An interfacial boundary layer between the coating and substrate enhances coating adhesion. The boundary layer includes isolated regions of copper or tin produced by a double zincating process. The protective aluminum coating exhibits improved adhesion and is formed by electrodeposition in an ionic liquid.
摘要:
A non-line-of-sight (NLOS) coating process is provided for a substrate having first and second transverse surfaces where the second surface lacks a LOS for depositional processing. The NLOS coating process includes electroplating or electroless plating a crack-resistant interlayer coating to at least the second surface and applying a wear-resistant coating to the crack-resistant interlayer coating by electrolytic or electroless plating.
摘要:
Ionic liquid aluminum electroplating solutions are provided. The ionic liquid aluminum electroplating solution comprises an ionic liquid, an aluminum salt, and an effective amount of propylene carbonate. Methods for producing an aluminum coating on a substrate are also provided. Processes for electroplating aluminum or an aluminum alloy from an ionic liquid aluminum electroplating solution are also provided.
摘要:
An object of the present invention is to provide an electrolytic aluminum foil having no significant difference in properties between one surface and the other surface thereof, and also a method for producing the same. Another object is to provide a current collector for an electrical storage device using the electrolytic aluminum foil, an electrode for an electrical storage device, and an electrical storage device. An electrolytic aluminum foil of the present invention as a means for achieving the object is characterized in that both surfaces of the foil have L* values of 86.00 or more in the L*a*b* color space (SCI method). The electrolytic aluminum foil of the present invention can be produced, for example, employing a method for producing an electrolytic aluminum foil, which comprises applying a current between a cathode drum partially immersed in a plating solution and an anode plate immersed in the plating solution to form an aluminum film on the surface of the cathode drum, and then separating, from the cathode drum, the aluminum film raised from the liquid surface by rotating the cathode drum, and in which the dew point of a treatment atmosphere at the time of the separation of the aluminum film from the cathode drum to give an electrolytic aluminum foil is controlled to be −50.0° C. or less.
摘要:
Provided is a method of forming a complex plating film using multi-layer graphene metal particles. The method of forming the plating film may include preparing a powder with a metal particle structure coated with multi-layer graphene, and forming a plating film by adding the powder to a plating solution through electric plating.
摘要:
In some examples, the disclosure describes a technique that includes covering a joint surface of a first part including a titanium aluminum (TiAl) alloy with a braze material including aluminum, where covering the joint surface includes at least one of electroplating the braze material on the joint surface, hot dipping the braze material on the joint surface, or positioning a foil of the braze material adjacent to the joint surface, positioning a second part including a titanium alloy in contact with the first part to define a joint region, where the joint region includes the braze material interposed between the second part and the joint surface of the first part, and heating the joint region to at least partially melt the braze material to form a braze joint connecting the first part to the second part.
摘要:
An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.
摘要:
Electroplating of aluminum may be utilized to form electrodes for solar cells. In contrast to expensive silver electrodes, aluminum allows for reduced cell cost and addresses the problem of material scarcity. In contrast to copper electrodes which typically require barrier layers, aluminum allows for simplified cell structures and fabrication steps. In the solar cells, point contacts may be utilized in the backside electrodes for increased efficiency. Solar cells formed in accordance with the present disclosure enable large-scale and cost-effective deployment of solar photovoltaic systems.
摘要:
An object of the present invention is to provide a method for preparing a plating solution for aluminum electroplating useful for the production of a high-ductility, high-purity aluminum foil at a high film formation rate, etc., which is an easy-to-handle plating solution that does not solidify and allows for an electroplating treatment even at 25° C. The present invention as a means for achieving the object is characterized in that in a preparation of a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, the blending proportions of the dialkyl sulfone, the aluminum halide, and the nitrogen-containing compound are such that per 10 mol of the dialkyl sulfone, the aluminum halide is 3.5+n to 4.2+n mol, and the nitrogen-containing compound is n mol (wherein n is 0.001 to 2.0 mol). In addition, a plating solution for aluminum electroplating prepared by the method of the present invention allows for an electroplating treatment with high aluminum deposition efficiency relative to the current flow, and is thus advantageous in that electricity usage can be reduced, resulting in excellent economic efficiency.
摘要:
A process for the electrochemical deposition of a semiconductor material, which process comprises: (i) providing a non-aqueous solvent; (ii) providing at least one precursor salt which forms a source of the constituent elements within the semiconductor material to be deposited; and (iii) electrodepositing the semiconductor material onto an electrode substrate using the precursor salt in the non-aqueous solvent, characterized in that: (iv) the semiconductor material is a p-block or a post-transition metal semiconductor material containing at least one p-block element or post-transition metal; and (v) the non-aqueous solvent is a halocarbon non-aqueous solvent.