公开(公告)号：US09721864B2

公开(公告)日：2017-08-01

申请号：US14984227

申请日：2015-12-30

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Jae-Woong Nah ,  Robert John Polastre

IPC: H01L23/15 ,  H01L23/31 ,  H01L21/786

CPC classification number: H05K5/0095 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3121 ,  H05K5/0247 ,  H05K5/04

Abstract: A hermetically sealed electronic device and method of fabrication are provided. A base layer of a wafer is created using a substrate formed from ultra-thin glass or ceramic using panel or roll to roll processing. One or more layers are bonded to the base layer. The wafer is singulated into a plurality of electronic devices having a top surface and a plurality of sides. A hermetic sealant is applied to each electronic device to completely encase the top surface and the sides while bonding to the base layer. At least one of the layers is a metallization layer formed by metal deposition. Full metallization may be applied over the entire wafer and a pattern subsequently transferred to the full metallization by one of laser and chemical etching. The electronic device may further include at least one electronic component attached to one of the layers and encased by the hermetic sealant.

公开(公告)号：US09691747B1

公开(公告)日：2017-06-27

申请号：US14977068

申请日：2015-12-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  John Knickerbocker

IPC: H01L21/78 ,  H01L25/00 ,  H01L25/065 ,  H01L21/66 ,  H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L25/075 ,  H01L25/11 ,  H01L25/04 ,  H01L25/07

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/20 ,  H01L24/32 ,  H01L24/81 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/043 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/0756 ,  H01L25/117 ,  H01L25/167 ,  H01L25/18 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/80121 ,  H01L2224/80143 ,  H01L2224/81005 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014

Abstract: Disclosed is a process, structure, equipment and apparatus directed to a low cost, high volume approach for the assembly of ultra small die to three-dimensional (3D) or 2.5D semiconductor packages.

公开(公告)号：US20170172445A1

公开(公告)日：2017-06-22

申请号：US14975913

申请日：2015-12-21

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Yang Liu ,  Steven L. Wright

IPC: A61B5/0478 ,  A61N1/04 ,  H01L23/498 ,  H01L23/367 ,  A61B5/0476 ,  A61B5/00

CPC classification number: A61B5/0478 ,  A61B5/0022 ,  A61B5/0408 ,  A61B5/6833 ,  A61B5/6839 ,  A61B2562/0215 ,  A61B2562/028 ,  A61B2562/125 ,  A61N1/0492 ,  A61N1/0502 ,  C25D1/003 ,  G16H40/67

Abstract: An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

公开(公告)号：US20170011223A1

公开(公告)日：2017-01-12

申请号：US14794399

申请日：2015-07-08

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Joana Sofia Branquinho Teresa Maria ,  Sufi Zafar

IPC: G06F21/60 ,  H04W12/02

CPC classification number: G06F21/606 ,  H04W4/38 ,  H04W4/80 ,  H04W12/02

Abstract: Methods, devices, systems, and computer program products for implementing a bio-medical sensing platform are provided herein. A method includes receiving one or more items of sensed biological data and/or sensor-related information from one or more sensor devices via a communication link established with the one or more sensor devices, wherein the one or more sensor devices are associated with a given user; analyzing the one or more items of sensed biological data and/or sensor-related information to perform one or more characterization functions pertaining to the one or more items of biological data and/or the given user; and transferring the one or more items of sensed biological data and/or sensor-related information and/or a result of the one or more characterization functions to a private storage component via a communication link established with the private storage component, wherein said transferring comprises implementing one or more security functions in conjunction with said transferring.

Abstract translation: 本文提供了用于实现生物医学感测平台的方法，设备，系统和计算机程序产品。 一种方法包括经由与所述一个或多个传感器设备建立的通信链路从一个或多个传感器设备接收感测的生物数据和/或传感器相关信息的一个或多个项目，其中所述一个或多个传感器设备与给定的 用户; 分析感测到的生物数据和/或传感器相关信息的一个或多个项目以执行与生物数据的一个或多个项目和/或给定用户有关的一个或多个表征功能; 以及经由与所述专用存储组件建立的通信链路将所感测的生物数据和/或传感器相关信息的一个或多个项目和/或所述一个或多个表征功能的结果传送到专用存储组件，其中所述传送包括 结合所述传送实现一个或多个安全功能。

公开(公告)号：US20160352023A1

公开(公告)日：2016-12-01

申请号：US15233628

申请日：2016-08-10

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Peter Jerome Sorce ,  Cornelia Kang-I Tsang

IPC: H01Q21/06 ,  H01Q1/48 ,  H01Q1/22

CPC classification number: H01Q21/065 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2924/15192 ,  H01Q1/2208 ,  H01Q1/2283 ,  H01Q1/48 ,  H01Q21/0075

Abstract: Package structures are provided for integrally packaging antennas with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an RFIC chip, and an antenna package bonded to the RFIC chip. The antenna package includes a glass substrate, at least one planar antenna element formed on a first surface of the glass substrate, a ground plane formed on a second surface of the glass substrate, opposite the first surface, and an antenna feed line formed through the glass substrate and connected to the at least one planar antenna element. The antenna package is bonded to a surface of the RFIC chip using a layer of adhesive material.

公开(公告)号：US09508566B2

公开(公告)日：2016-11-29

申请号：US14460671

申请日：2014-08-15

Applicant: International Business Machines Corporation

Inventor： Paul S Andry ,  Bing Dang ,  Eric P Lewandowski ,  Jae-Woong Nah ,  Bucknell C Webb

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/82 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L21/565 ,  H01L21/56 ,  H01L21/561 ,  H01L21/82 ,  H01L23/3121 ,  H01L23/5387 ,  H01L23/564 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature.

Abstract translation: 本发明的实施例包括一种用于将柔性集成电路成形为曲率的方法以及所得到的结构。 提供了一个灵活的电路。 环氧树脂和胺组合物沉积在柔性集成电路上。 沉积的环氧树脂和胺组合物是B阶段的。 柔性集成电路放置在曲率的模具内。 在将柔性集成电路放置在曲率的模具中之后，B阶环氧树脂和胺组合物被固化。

公开(公告)号：US20160284583A1

公开(公告)日：2016-09-29

申请号：US14747670

申请日：2015-06-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  C08G59/063 ,  C08G2650/56 ,  C08K3/04 ,  C08L63/00 ,  C08L71/00 ,  C09J9/00 ,  C09J163/00 ,  C09J171/00 ,  C09J171/12 ,  H01L21/02052 ,  H01L21/02057 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

Abstract translation: 包括苯氧基树脂热塑性组分和炭黑填料组分的粘合材料。 炭黑填料组分的存在量大于1wt。 ％。 炭黑填料将苯氧基树脂热塑性组分从传播红外（IR）波长的材料转变为吸收大部分红外（IR）波长的材料。

公开(公告)号：US20160276727A1

公开(公告)日：2016-09-22

申请号：US14662610

申请日：2015-03-19

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P3/16

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract translation: 实施例包括具有集成波导的封装结构，以实现封装组件之间的高数据速率通信。 例如，封装结构包括具有集成波导的封装衬底和安装到封装衬底的第一和第二集成电路芯片。 第一集成电路芯片使用第一传输线到波导过渡耦合到集成波导，并且第二集成电路芯片使用第二传输线到波导转换耦合到集成波导。 第一和第二集成电路芯片被配置为通过在封装载体内使用集成波导发送信号进行通信。

公开(公告)号：US20160133486A1

公开(公告)日：2016-05-12

申请号：US14535822

申请日：2014-11-07

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Russell A. Budd ,  Bing Dang ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: H01L21/56

CPC classification number: H01L21/6835 ,  B23K26/57 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.

Abstract translation: 粘合结构包含含有至少一个特征的基底，所述基底具有顶表面; 所述第一释放层覆盖所述基板的顶表面，所述第一释放层吸收具有第一波长的光以被所述光分解; 覆盖第一释放层的粘合剂层和覆盖粘合剂层的第二剥离层。 第二释放层吸收具有第二波长的光，以被具有第二波长的光分解。 接合结构还包含覆盖第二释放层的手柄衬底，其中手柄衬底对于具有第一波长和第二波长的光基本上是透明的。 还公开了一种脱粘方法，用于处理粘合结构以除去和回收用于再次使用的粘合剂层。 在另一个实施方案中，多步法可光学地切割和剥离键合结构。

公开(公告)号：US20160111387A1

公开(公告)日：2016-04-21

申请号：US14516963

申请日：2014-10-17

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Yang Liu ,  Yu Luo ,  Steven L. Wright

IPC: H01L23/00 ,  H01L25/00 ,  H01L21/66 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/3178 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49894 ,  H01L23/50 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11334 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/17104 ,  H01L2224/1712 ,  H01L2224/1751 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06565

Abstract: A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.