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    Microelectronic spring contact repair
    22.
    发明申请
    Microelectronic spring contact repair 有权
    微电子弹簧接触维修

    公开(公告)号：US20030113990A1

    公开(公告)日：2003-06-19

    申请号：US10028500

    申请日：2001-12-19

    Applicant: FormFactor, Inc.

    Inventor： Gary W. Grube ,  Gaetan L. Mathieu

    IPC: H01L021/00 ,  H01L021/44

    CPC classification number: G01R1/06744 ,  G01R3/00 ,  H01L24/11 ,  H01L2224/05023 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/48

    Abstract: A method for replacing a microelectronic spring contact bonded to a terminal of a substrate is disclosed. The method comprises removing the microelectronic spring contact from the terminal, such as by cutting the microelectronic spring contact in two adjacent to the terminal. Then, a bonding material, such as a solder paste, is applied to the terminal and a replacement spring contact is positioned on the bonding material. The bonding material is then cured to fix the replacement spring contact in place. The replacement spring contact includes a base configured to fit on or over any protruding material left on the terminal, and at least one resilient cantilever arm extending from the base. In an embodiment of the invention, the base comprises at least two legs extending from the base in a direction opposite to the cantilever arm. In an alternative embodiment, the base of the replacement spring contact has a flat bottom, or one or more recesses to receive protrusions on the terminal. The replacement spring contact is positioned with its base opposite to the terminal and the resilient cantilever arm extending away from the substrate. A method for forming a suitable replacement spring contact is also disclosed.

    Abstract translation: 公开了一种用于替换接合到衬底的端子的微电子弹簧触点的方法。 该方法包括从端子移除微电子弹簧触点，例如通过在与端子相邻的两个中切割微电子弹簧触点。 然后，将诸如焊膏的接合材料施加到端子上，并且将更换的弹簧接触件定位在接合材料上。 然后固化接合材料以将替换弹簧接触件固定就位。 所述更换弹簧触头包括构造成装配在所述端子上留下的任何突起材料上或上方的底座以及从所述基座延伸的至少一个弹性悬臂。 在本发明的一个实施例中，底座包括至少两个从底座延伸到与悬臂相对的方向的腿。 在替代实施例中，替换弹簧触头的底部具有平坦的底部或一个或多个凹部，以在端子上容纳突起。 替换弹簧触点定位成其基座与端子相对，并且弹性悬臂臂远离基板延伸。 还公开了一种用于形成合适的替换弹簧触点的方法。

    Electrical contractor, especially wafer level contactor, using fluid pressure
    23.
    发明申请
    Electrical contractor, especially wafer level contactor, using fluid pressure 失效
    电气承包商，特别是晶圆级接触器，使用流体压力

    公开(公告)号：US20020197895A1

    公开(公告)日：2002-12-26

    申请号：US10222114

    申请日：2002-08-15

    Applicant: FormFactor, Inc.

    Inventor： Benjamin N. Eldridge

    IPC: H01R013/44

    CPC classification number: G01R31/2887 ,  G01R1/0735 ,  G01R31/2886

    Abstract: An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. The fluid, when contained in the fluid containing structure, presses the flexible wiring layer towards a device under test to form electrical interconnections between the first contact elements and corresponding second contact elements on the device under test. In a further embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact terminals and a semiconductor substrate which includes a plurality of second contact terminals. A plurality of freestanding, resilient contact elements, in one embodiment, are mechanically coupled to one of the flexible wiring layers or the semiconductor substrate and make electrical contacts between corresponding ones of the first contact terminals and the second contact terminals. In another embodiment, a method of making electrical interconnections includes joining a flexible wiring layer and a substrate together in proximity and causing a pressure differential between a first side and a second side of the flexible wiring layer. The pressure differential deforms the flexible wiring layer and causes a plurality of first contact terminals on the flexible wiring layer to electrically connect with a corresponding plurality of second contact terminals on the substrate.

    Abstract translation: 电互连组件和用于制造电互连组件的方法。 在一个实施例中，互连组件包括具有多个第一接触元件和耦合到柔性布线层的流体容纳结构的柔性布线层。 当容纳在流体容纳结构中时，流体将柔性布线层压向被测器件，以在被测器件上的第一接触元件和对应的第二接触元件之间形成电互连。 在另一实施例中，互连组件包括具有多个第一接触端子的柔性布线层和包括多个第二接触端子的半导体衬底。 在一个实施例中，多个独立的弹性接触元件机械耦合到柔性布线层或半导体衬底中的一个，并且在对应的第一接触端子和第二接触端子之间形成电接触。 在另一个实施例中，制造电互连的方法包括将柔性布线层和基板接合在一起并在柔性布线层的第一侧和第二侧之间形成压差。 压差使柔性布线层变形，使柔性布线层上的多个第一接触端子与基板上的对应的多个第二接触端子电连接。

    Electronic component overlapping dice of unsingulated semiconductor wafer
    24.
    发明申请
    Electronic component overlapping dice of unsingulated semiconductor wafer 失效
    电子元件重叠的半导体晶片的重叠芯片

    公开(公告)号：US20020074653A1

    公开(公告)日：2002-06-20

    申请号：US09971981

    申请日：2001-10-04

    Applicant: FormFactor, Inc.

    Inventor： Igor Y. Khandros ,  David V. Pedersen ,  Benjamin N. Eldridge ,  Richard S. Roy ,  Gaetan Mathieu

    IPC: H01L023/52

    CPC classification number: H01L24/06 ,  H01L23/50 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00

    Abstract: The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In a preferred embodiments a terminal is provided on the semiconductor device such that the capacitor can be electrically connected directly to the terminals, as by soldering or with conductive epoxy. Connecting the capacitor between terminals of a power loop provides superior noise and transient suppression. The very short path between the capacitor and the active circuit provides for extremely low inductance, allowing for the use of relatively small capacitors. The semiconductor device then is connected to an electronic device such as a PC board for further connection to other circuitry. One particularly preferred mode of connection is by incorporating resilient, free-standing contact structures on the same semiconductor device, with the structures standing farther away from the semiconductor and the capacitor. Other useful connectors include providing similar resilient, free-standing contact structures on the other device, then positioning the semiconductor over the resilient contacts and securing the two devices together. A socket with such resilient structures is particularly useful for this application. In an alternative preferred embodiment, the capacitor and resilient contacts all are incorporated in the second device, such as a socket. In one aspect of the invention, the ancillary electrical component may include a travel stop structure which defines a minimum separation between the semiconductor and a substrate such as a printed circuit board.

    Abstract translation: 本发明提供了非常接近半导体器件的辅助电气部件，优选地直接安装在半导体器件上。 在一个优选实施例中，辅助电气部件是电容器。 在优选实施例中，端子设置在半导体器件上，使得电容器可以通过焊接或与导电环氧树脂直接电连接到端子。 在电源回路端子之间连接电容器可提供卓越的噪声和瞬态抑制。 电容器和有源电路之间的非常短的路径提供极低的电感，允许使用相对较小的电容器。 然后，半导体器件连接到诸如PC板的电子设备，用于进一步连接到其它电路。 一个特别优选的连接方式是通过在相同的半导体器件上并入弹性，独立的接触结构，其结构远离半导体和电容器。 其他有用的连接器包括在另一装置上提供类似的弹性，独立的接触结构，然后将半导体定位在弹性触点上并将两个装置固定在一起。 具有这种弹性结构的插座对于该应用特别有用。 在替代的优选实施例中，电容器和弹性触点都被并入第二装置，例如插座。 在本发明的一个方面，辅助电气部件可以包括限定半导体和诸如印刷电路板的基板之间的最小间隔的行进止动结构。

    Special contact points for accessing internal circuitry of an integrated circuit
    27.
    发明申请
    Special contact points for accessing internal circuitry of an integrated circuit 失效
    用于访问集成电路内部电路的特殊接点

    公开(公告)号：US20010020747A1

    公开(公告)日：2001-09-13

    申请号：US09753309

    申请日：2000-12-29

    Applicant: FormFactor, Inc.

    Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  David V. Pedersen ,  Ralph G. Whitten

    IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

    CPC classification number: G01R1/07307 ,  G01R31/2884 ,  G01R31/31723 ,  H01L22/32 ,  H01L23/50 ,  H01L23/60 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2224/29099 ,  H01L2924/00

    Abstract: One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e.g., nonvolatile circuits) at the die or package level. The special contact points may also be used to select redundant circuits for faulty circuits.

    Abstract translation: 本发明的一个实施例涉及包括接合焊盘和特殊接触焊盘或点的集成电路。 接合焊盘用于将集成电路作为整体与外部电路接口，并且将被连接到封装或电路板。 接合焊盘以预定的对准方式设置在管芯上，例如外围，栅格或中心对准。 特殊接触焊盘用于向内部电路提供外部测试模式和/或外部监测测试内部电路的结果。 特别的接触垫可以有利地以高度的位置自由度位于集成电路上。 对于一个实施例，特殊接触焊盘可以在与焊盘不同于对准的位置处设置在管芯上。 特殊的接触焊盘可以小于接合焊盘，以便不会由于特殊的接触垫而增加管芯的尺寸。 特殊接触点也可以用于在芯片或封装级别外部编程内部电路（例如非易失性电路）。 特殊接触点也可用于选择故障电路的冗余电路。

    FLEXIBLE, RADIO-FREQUENCY TRANSITIONS AND ELECTRONIC SYSTEMS THAT INCLUDE THE FLEXIBLE, RADIO-FREQUENCY TRANSITIONS
    30.
    发明申请
    FLEXIBLE, RADIO-FREQUENCY TRANSITIONS AND ELECTRONIC SYSTEMS THAT INCLUDE THE FLEXIBLE, RADIO-FREQUENCY TRANSITIONS 有权

    公开(公告)号：US20240396221A1

    公开(公告)日：2024-11-28

    申请号：US18649797

    申请日：2024-04-29

    Applicant: FormFactor, Inc.

    Inventor： Pratik Bakul Ghate ,  Ernest Gammon McReynolds ,  Shean Thomas McMahon ,  Timothy E. Lesher ,  Bryan Willis

    IPC: H01Q13/20 ,  H01Q1/42 ,  H01Q13/26

    Abstract: Flexible, radio-frequency transitions and electronic systems that include the flexible, radio-frequency transitions are disclosed herein. The flexible, radio-frequency transitions are configured to electrically interconnect a first electronic component and a second electronic component to facilitate radio-frequency electrical communication therebetween and include a flexible dielectric membrane and a microstrip transmission line. The microstrip transmission line is formed on the flexible dielectric membrane and includes an electrically conductive signal trace and an electrically conductive ground plane for the electrically conductive signal trace. The transition is configured to electrically interconnect the first electronic component and the second electronic component, and to permit radio-frequency electrical communication therebetween, throughout a range of transition angles. The electronic systems utilize radio-frequency communication and include the first electronic component, the second electronic component, and the transitions.

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