公开(公告)号：US6130116A

公开(公告)日：2000-10-10

申请号：US984933

申请日：1997-12-04

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L21/56 ,  H01L23/31

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/4024 ,  H01L2224/92122

摘要： A method of encapsulating a microelectronic assembly includes providing one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at the exterior surfaces, the one or more elements defining one or more apertures through the exterior surfaces. A layer of a curable barrier material is then provided on a supporting element. The barrier layer has openings therein in a pattern corresponding to the array of terminals on the one or more microelectronic assemblies. The supporting element and the one or more microelectronic elements are then assembled together so that the layer of barrier material contacts the exterior surfaces and covers the apertures and so that the openings in the layer of barrier material are aligned with the terminals. The barrier material is then cured while in contact with the exterior surfaces to thereby form a barrier layer covering the apertures. Next, a curable liquid encapsulant is applied to the microelectronic assemblies, whereby the barrier layer prevents the curable liquid encapsulant from flowing through the apertures, and the encapsulant is cured. The barrier layer and the supporting element cooperatively surround the terminals exposed at the exterior surfaces to protect the terminals from contaminants.

摘要翻译： 封装微电子组件的方法包括提供一个或多个微电子组件，其具有限定外表面的一个或多个元件和暴露在外表面处的端子阵列，所述一个或多个元件限定通过外表面的一个或多个孔。 然后在支撑元件上设置一层可固化阻挡材料。 阻挡层在其中具有对应于一个或多个微电子组件上的端子阵列的图案中的开口。 然后将支撑元件和一个或多个微电子元件组装在一起，使得阻挡层的层与外表面接触并覆盖孔，使得阻挡材料层中的开口与端子对准。 然后在与外表面接触的同时固化阻挡材料，从而形成覆盖孔的阻挡层。 接下来，将可固化液体密封剂施加到微电子组件，由此阻挡层防止可固化液体密封剂流过孔，并且密封剂固化。 阻挡层和支撑元件协同地围绕暴露在外表面处的端子以保护端子免受污染物的影响。

公开(公告)号：US6104087A

公开(公告)日：2000-08-15

申请号：US138858

申请日：1998-08-24

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

摘要翻译： 微电子连接部件包括具有细长带状引线的区域阵列的电介质片。 每个引线具有紧固到片材的终端和从片材可拆卸的尖端。 每个引线从其终端到其尖端水平平行地延伸。 尖端附接到第二元件，例如另一个电介质片或半导体晶片。 然后，第一和第二元件相对于彼此移动，以使每个引线的尖端垂直远离电介质片，并将引线变形成弯曲的垂直广泛配置。 优选的结构提供半导体芯片组件，其具有在芯片上的平面区域阵列的触点，片材上的端子阵列被定位成使得每个端子基本上在相应的触点上方，以及连接在端子之间的金属S形带阵列 和联系人。 柔性电介质材料可以设置在片和芯片之间，基本上围绕S形带。

公开(公告)号：US6080932A

公开(公告)日：2000-06-27

申请号：US59662

申请日：1998-04-14

申请人： John W. Smith ,  Christopher M. Pickett

发明人： John W. Smith ,  Christopher M. Pickett

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02

CPC分类号： H01L23/564 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor chip package includes a semiconductor chip having surfaces and contacts, a layer of a moisture-permeable material bonded to one surface of the chip and a moisture-impermeable encapsulant overlying the moisture-permeable material and at least partially surrounding the chip. The package has exposed exterior surfaces and terminals on at least one of the exposed exterior surfaces which are electrically connected to the contacts. The moisture-permeable material extends to at least one of the exposed exterior surfaces so that moisture may be vented through the moisture-permeable material and out of the package. In certain embodiments, the moisture-permeable material includes a compliant layer having silicone and the moisture-impermeable material includes an epoxy.

摘要翻译： 半导体芯片封装包括具有表面和触点的半导体芯片，结合到芯片的一个表面的透湿材料层和覆盖透湿材料并且至少部分地围绕芯片的不透水密封剂。 该封装在暴露的外表面中的至少一个电连接到触点的外表面和端子上。 透湿材料延伸到暴露的外表面中的至少一个，使得水分可以通过透湿材料排出并且脱离包装。 在某些实施例中，透湿材料包括具有硅树脂的柔顺层，并且不透水材料包括环氧树脂。

公开(公告)号：US6044548A

公开(公告)日：2000-04-04

申请号：US038366

申请日：1998-03-10

申请人： Thomas H. Distefano ,  John W. Smith, Jr.

发明人： Thomas H. Distefano ,  John W. Smith, Jr.

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/10 ,  H01L21/486 ,  H01L21/4885 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19042 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49208

摘要： A method of making connections to a microelectronic unit includes the steps of providing a connection component having a flexible dielectric top sheet, a plurality of terminals on the top sheet and a plurality of electrically conductive, elongated flexible leads connected to the terminals and extending side-by-side downwardly from the terminals away from the top sheet to bottom ends remote from the top sheet. The connection component is then engaged with a front surface of a microelectronic unit having an array of contacts thereon while subjecting the connection component and the microelectronic unit to heat and pressure so that bottom ends of the leads remote from the top sheet bond with the contacts on the microelectronic unit to form electrical connections therewith.

摘要翻译： 制造与微电子单元的连接的方法包括以下步骤：提供具有柔性电介质顶片的连接部件，顶片上的多个端子和连接到端子的多个导电细长柔性引线， 从端子向上离开顶片到远离顶片的底端。 然后，连接部件与具有触点阵列的微电子单元的前表面接合，同时对连接部件和微电子单元进行加热和压力，使得远离顶片的引线的底端与触点接合在一起 微电子单元与其形成电连接。

公开(公告)号：US6012224A

公开(公告)日：2000-01-11

申请号：US936887

申请日：1997-09-25

申请人： Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

发明人： Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/64 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/4839 ,  H01L21/563 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/3025 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

摘要： The present invention provides an interconnection scheme having compliant contacts arranged in an array to connect conductive surfaces on a microelectronic device and a supporting substrate, such as a printed circuit board. This invention accommodates for the difference in thermal coefficients of expansion between the device and the supporting substrate. Typically, an area array of conductive contact pads are connected into rows by conductive leads on a flexible, intermediate substrate. Each of the conductive leads bridges a bonding hole in the intermediate substrate which is situated between successive contact pads. Each of the conductive leads further has a frangible portion within or near each bonding hole. A stand-off between the intermediate substrate and the device is create by compliant dielectric pads, typically composed of an elastomer material, positioned under each contact pad. The frangible portions allow the leads to be cleanly broken, bent and secured into electrical contact with mating contact pads on the device. Each of these connections may be supported by a compliant layer, typically an uncured elastomer which fills the area around the dielectric pads and is then cured.

摘要翻译： 本发明提供了一种互连方案，其具有排列成阵列中的柔性触点，以连接微电子器件上的导电表面和诸如印刷电路板的支撑衬底。 本发明适用于器件和支撑衬底之间的热膨胀系数的差异。 通常，导电接触焊盘的区域阵列通过柔性中间衬底上的导电引线连接成行。 每个导电引线桥接位于连续接触焊盘之间的中间衬底中的结合孔。 每个导电引线还在每个结合孔内或附近还具有易碎部分。 中间基板和器件之间的间隔是通过位于每个接触垫下方的通常由弹性体材料组成的柔性介电垫产生的。 易碎部分允许引线被干净地折断，弯曲并固定成与设备上的配合接触垫电接触。 这些连接中的每一个可以由柔性层（通常是填充介电垫周围区域的未固化的弹性体）支撑，然后固化。

公开(公告)号：US6002168A

公开(公告)日：1999-12-14

申请号：US978082

申请日：1997-11-25

申请人： Pieter H. Bellaar ,  Thomas H. DiStefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

发明人： Pieter H. Bellaar ,  Thomas H. DiStefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

IPC分类号： H01L23/498 ,  H05K3/28 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H01L23/06 ,  H01L23/52

CPC分类号： H01L23/49816 ,  H01L23/4985 ,  H05K3/3436 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K3/284 ,  H05K3/4084 ,  Y02P70/613

摘要： A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.

摘要翻译： 一种微电子部件，用于将诸如混合电路的刚性基板安装到刚性支撑基板，例如印刷电路板。 微电子部件包括可以在其第一表面上安装芯片的刚性插入器; 刚性插入件上的接触图案; 位于刚性插入件的第二表面上的柔性插入件; 柔性插入器上的端子图案; 柔性线 以及安装在柔性插入件上的焊接铜球。 微电子部件可以具有安装在刚性插入件的第一表面上的插座组件。 微电子部件可以安装在刚性支撑基板上。

公开(公告)号：US5929517A

公开(公告)日：1999-07-27

申请号：US365749

申请日：1994-12-29

申请人： Thomas H. Distefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

发明人： Thomas H. Distefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/04 ,  H05K13/04

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/50 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49146

摘要： Semiconductor chip packages and methods of fabricating the same. The package includes a thermally conductive protective structure having an indentation open to a front side and a flange surface at least partially surrounding the indentation and facing to the front of the structure. A chip is disposed in the indentation so that the front surface of the chip, with contacts thereon, faces toward the front of the structure. A flexible dielectric film having terminals thereon is placed on the flange surface, and a compliant material is disposed between the film and the flange surface. The terminals on the film are connected to the contacts on the chip. The individual terminals on the film are movable with respect to the protective structure, which facilitates mounting and compensation for thermal expansion.

摘要翻译： 半导体芯片封装及其制造方法。 该封装包括导热保护结构，其具有向前侧开口的凹口和至少部分地围绕凹口并面向结构前部的凸缘表面。 芯片设置在凹陷中，使得具有触点的芯片的前表面朝向结构的前部。 其上具有端子的柔性电介质膜放置在凸缘表面上，并且柔性材料设置在膜和凸缘表面之间。 胶片上的端子连接到芯片上的触点。 胶片上的各个端子相对于保护结构是可移动的，这有助于热膨胀的安装和补偿。

公开(公告)号：US5913109A

公开(公告)日：1999-06-15

申请号：US690532

申请日：1996-07-31

申请人： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

发明人： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. The assembly is then cooled, and the expansion ring is cut away. In another embodiment, a method is provided for bonding bond pads on a sheet-like microelectronic element to terminal pads on a microelectronic component. The microelectronic element is first placed on a rigid plate and the sheet-like element, which has been bonded to a frame ring, is placed over the microelectronic component. A disk is then placed on the sheet-like element, and force is applied to the disk, bringing the bond pads on the sheet-like element into contact with the terminal pads on the microelectronic element. Heat is then applied, forming the bonds.

摘要翻译： 在用于安装用于制造微电子部件的片状多层元件的方法中，首先将片状元件接合到膨胀环。 然后将膨胀环加热以拉伸片状元件。 然后将具有小于膨胀环内径的外径的框架环结合到片状元件。 然后将组件冷却，并将膨胀环切掉。 在另一个实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的端子焊盘的方法。 首先将微电子元件放置在刚性板上，将已经结合到框架环的片状元件放置在微电子元件上。 然后将盘放置在片状元件上，并且将力施加到盘上，使得片状元件上的接合焊盘与微电子元件上的端子焊盘接触。 然后施加热量，形成粘结。

公开(公告)号：US5821609A

公开(公告)日：1998-10-13

申请号：US807470

申请日：1997-02-27

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine Karavakis ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine Karavakis ,  Joseph Fjelstad

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K1/02

CPC分类号： H01L24/86 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/49861 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10T29/49121

摘要： A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads. The process avoids the need for especially fine etching to form notches in the lateral edges of the leads.

摘要翻译： 一种半导体芯片连接部件，其具有多个引线，跨越支撑结构中的间隙并排延伸，每个引线具有易碎部分，以允许引线的一端在接合过程中从支撑结构脱离。 通过在延伸的处理区域中处理引线形成材料形成脆性部分，该处理区域延伸穿过由许多引线占据的区域。 该工艺避免了在引线的侧边缘上特别细蚀刻形成凹口的需要。

公开(公告)号：US5821608A

公开(公告)日：1998-10-13

申请号：US709127

申请日：1996-09-06

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/02

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor chip package includes a substrate having a first surface and a second surface and a gap extending from the first surface to the second surface. The substrate defines a plane which is substantially parallel to the first and second surfaces. The substrate has conductive terminals accessible and the second surface and bond pads. Conductive leads extend across the gap whereby each lead electrically interconnects one of the conductive terminals and one of the bond pads. Each lead includes an expansion section within the gap which is laterally curved with respect to the plane. A semiconductor chip having a back surface and a face surface is assembled to the substrate. The face surface includes a plurality of contacts on the periphery of the face surface of the chip whereby the chip contracts are electrically connected to the bond pads on the substrate.

摘要翻译： 半导体芯片封装包括具有第一表面和第二表面的衬底以及从第一表面延伸到第二表面的间隙。 衬底限定基本上平行于第一表面和第二表面的平面。 衬底具有可接触的导电端子和第二表面和接合焊盘。 导电引线延伸穿过间隙，由此每个引线将导电端子中的一个导电互连，并且其中一个接合焊盘。 每个引线包括在间隙内的相对于平面横向弯曲的膨胀部分。 将具有背面和表面的半导体芯片组装到基板上。 面表面包括在芯片的表面的周边上的多个触点，由此芯片收缩电连接到衬底上的接合焊盘。