公开(公告)号：US08755180B2

公开(公告)日：2014-06-17

申请号：US13431235

申请日：2012-03-27

Applicant: Shu-Hua Yeh ,  Chi-Fu Chen ,  Fang-Hsiang Tseng ,  Chun-Cheng Lin

Inventor： Shu-Hua Yeh ,  Chi-Fu Chen ,  Fang-Hsiang Tseng ,  Chun-Cheng Lin

IPC: G06F1/16

CPC classification number: G06F1/1679 ,  G06F1/1618 ,  G06F1/1675

Abstract: A foldable electric device comprises a first member, a second member and a pivot portion. The pivot portion is used to pivot the first member and the second member. The first member comprises a first cushion pad and a first magnetic component. The first cushion pad is retractably disposed on a surface of the first member. The first magnetic component is installed in the first member, and synchronously moves with the first cushion pad. The second member comprises a second magnetic component. When the first member and the second member are covered together, with the magnetic effect between the first magnetic component and the second magnetic component, the first cushion pad is linked by the first magnetic unit to protrude from or retract into the first member.

Abstract translation: 可折叠电气装置包括第一构件，第二构件和枢转部分。 枢转部分用于枢转第一构件和第二构件。 第一构件包括第一缓冲垫和第一磁性部件。 第一缓冲垫可收缩地设置在第一构件的表面上。 第一磁性部件安装在第一部件中，与第一缓冲垫同步移动。 第二构件包括第二磁性部件。 当第一构件和第二构件被覆盖在一起时，利用第一磁性构件和第二磁性构件之间的磁效应，第一缓冲垫通过第一磁性单元连接以从第一构件和第二构件突出或缩回到第一构件中。

公开(公告)号：US20130234317A1

公开(公告)日：2013-09-12

申请号：US13416805

申请日：2012-03-09

Applicant: Meng-Tse Chen ,  Wei-Hung Lin ,  Yu-Peng Tsai ,  Chun-Cheng Lin ,  Chih-Wei Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Wei-Hung Lin ,  Yu-Peng Tsai ,  Chun-Cheng Lin ,  Chih-Wei Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L25/07 ,  H01L21/60

CPC classification number: H01L24/32 ,  B23K35/24 ,  B23K35/3612 ,  H01L23/49816 ,  H01L24/17 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die.

Abstract translation: 公开了封装方法和封装的半导体器件。 在一个实施例中，包装方法包括提供第一模具，部分地包装第一模具，以及在部分封装的第一模具的表面上形成多个焊球。 环氧助焊剂设置在多个焊球上。 提供第二模具，并且第二模具被部分包装。 多个焊球与部分封装的第二管连接。

公开(公告)号：US20130187268A1

公开(公告)日：2013-07-25

申请号：US13357379

申请日：2012-01-24

Applicant: Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

Inventor： Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/0273 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0239 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/1131 ,  H01L2224/11424 ,  H01L2224/1152 ,  H01L2224/1162 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13611 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15747 ,  H01L2924/18161 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.

Abstract translation: 提供一种用于封装半导体管芯的系统和方法。 实施例包括具有第一触点和第二触点的第一封装。 在第一接触件上形成接触后材料，以便调节接触垫之间的接头的高度，导体凸块。 在另一个实施例中，使用导电柱来控制接触垫和外部连接之间的接头的高度。

公开(公告)号：US20130154086A1

公开(公告)日：2013-06-20

申请号：US13331061

申请日：2011-12-20

Applicant: Chen-Hua Yu ,  Chung-Shi Liu ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng

Inventor： Chen-Hua Yu ,  Chung-Shi Liu ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng

IPC: H01L23/48 ,  H01L21/50

CPC classification number: H01L23/31 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A method includes performing an etching step on a package. The package includes a package component, a connector on a top surface of the package component, a die bonded to the top surface of the package component, and a molding material molded over the top surface of the package component. The molding material covers the connector, wherein a portion of the molding material covering the connector is removed by the etching step, and the connector is exposed.

Abstract translation: 一种方法包括对包装进行蚀刻步骤。 该包装包括包装部件，在包装部件的顶表面上的连接器，结合到包装部件的顶表面的管芯，以及模制在包装部件的顶表面上的模制材料。 成型材料覆盖连接器，其中通过蚀刻步骤去除覆盖连接器的成型材料的一部分，并且连接器被暴露。

公开(公告)号：US20130095608A1

公开(公告)日：2013-04-18

申请号：US13272032

申请日：2011-10-12

Applicant: Meng-Tse Chen ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Wei-Hung Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Wei-Hung Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/50 ,  H01L21/00

CPC classification number: B23Q3/18 ,  H01L21/50 ,  H01L21/561 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75733 ,  H01L2224/75744 ,  H01L2224/75754 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/97 ,  H01L2924/3511 ,  Y10T29/41 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.

Abstract translation: 一种方法包括在第一包装部件和第二包装部件之间分配底部填充物，其中第一包装部件被放置在下部夹具上，并且第二包装部件结合到第一包装部件上。 通孔位于下夹具中并在第一包装部件下方。 底部填充物被固化，其中在固化底部填充物的步骤期间，施加力以使第一包装部件变平。 通过执行从通过通孔的抽真空和空气吹扫的组中选择的动作来施加力。

公开(公告)号：US20130075921A1

公开(公告)日：2013-03-28

申请号：US13240629

申请日：2011-09-22

Applicant: Meng-Tse Chen ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/498 ,  H01L21/60 ,  H01L21/50

CPC classification number: H01L23/49816 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method includes applying a polymer-comprising material over a carrier, and forming a via over the carrier. The via is located inside the polymer-comprising material, and substantially penetrates through the polymer-comprising material. A first redistribution line is formed on a first side of the polymer-comprising material. A second redistribution line is formed on a second side of the polymer-comprising material opposite to the first side. The first redistribution line is electrically coupled to the second redistribution line through the via.

Abstract translation: 一种方法包括在载体上涂覆含聚合物的材料，并在载体上形成通孔。 通孔位于含聚合物的材料的内部，并且基本上穿透包含聚合物的材料。 在包含聚合物的材料的第一面上形成第一再分配线。 第二再分配线形成在与第一侧相对的含聚合物材料的第二侧上。 第一再分配线通过通孔电耦合到第二再分配线。

公开(公告)号：US08383767B2

公开(公告)日：2013-02-26

申请号：US12491521

申请日：2009-06-25

Applicant: Jaulang Hwang ,  Chun-Cheng Lin ,  Hsiao-Ling Chiang ,  Fan-Dan Jan ,  Chiao-En Chen ,  Chia-Tse Shu

Inventor： Jaulang Hwang ,  Chun-Cheng Lin ,  Hsiao-Ling Chiang ,  Fan-Dan Jan ,  Chiao-En Chen ,  Chia-Tse Shu

IPC: A61K38/00 ,  A61K39/00 ,  A61K39/38 ,  A61K45/00 ,  A61K47/00 ,  C07K2/00 ,  C07K4/00 ,  C07K5/00 ,  C07K7/00 ,  C07K14/00 ,  C07K16/00

CPC classification number: C07K14/21 ,  A61K39/00 ,  A61K39/0011 ,  C07K14/28 ,  C07K14/33 ,  C07K16/3076 ,  C07K16/3084 ,  C07K2319/30 ,  C07K2319/55 ,  Y02A50/472

Abstract: A protein carrier containing an antigen presenting cell binding domain and a cysteine-rich domain. Also described herein is an immunoconjugate containing the protein carrier with an antigen conjugated to multiple cysteine residues in the cysteine-rich domain, and an immune composition containing the immunoconjugate and an adjuvant, as well as their uses in eliciting immune responses.

Abstract translation: 含有抗原呈递细胞结合结构域和富含半胱氨酸的结构域的蛋白质载体。 本文还描述了含有具有与富含半胱氨酸的结构域中的多个半胱氨酸残基缀合的抗原的蛋白质载体的免疫缀合物，以及含有免疫缀合物和佐剂的免疫组合物，以及它们在引发免疫应答中的用途。

公开(公告)号：US08365716B2

公开(公告)日：2013-02-05

申请号：US12711245

申请日：2010-02-23

Applicant: Chun-Cheng Lin

Inventor： Chun-Cheng Lin

IPC: F24L3/00 ,  A47J37/00

CPC classification number: A47J37/0781 ,  A47J37/0786

Abstract: A barbecue grill assembly is provided. The barbecue grill assembly comprises a barbecue unit, at least one pedestal, at least one bolt and a plate construction. The pedestal supports said barbecue unit and includes at least one hole. The bolt is disposed corresponding to said hole, and includes at least one body fitted to said hole so as to fasten said bolt. The plate construction includes four leg units pivotally disposed on one face of said plate construction and at least one slot disposed on the side of said plate construction. Wherein said slot is corresponding to said bolt and might be separate from or linked up with said body, so that said plate construction is combinable or detachable to said pedestal. Said leg unit might be received when rotated parallel to said plate construction; said leg unit might be unfolded when rotated perpendicular to said plate construction.

Abstract translation: 酒店提供烧烤架。 烧烤架组件包括烧烤单元，至少一个基座，至少一个螺栓和板结构。 基座支撑所述烧烤单元并且至少包括一个孔。 所述螺栓对应于所述孔布置，并且包括装配到所述孔的至少一个主体，以便紧固所述螺栓。 板结构包括枢转地设置在所述板结构的一个面上的四个腿单元和设置在所述板结构的侧面上的至少一个槽。 其中所述狭槽对应于所述螺栓并且可以与所述主体分离或与所述主体连接，使得所述板结构可组合或可拆卸到所述基座。 当平行于所述板结构旋转时可以接收所述腿单元; 当垂直于所述板结构旋转时，所述腿单元可能会展开。

公开(公告)号：US20130016460A1

公开(公告)日：2013-01-17

申请号：US13431235

申请日：2012-03-27

Applicant: Shu-Hua YEH ,  Chi-Fu Chen ,  Fang-Hsiang Tseng ,  Chun-Cheng Lin

Inventor： Shu-Hua YEH ,  Chi-Fu Chen ,  Fang-Hsiang Tseng ,  Chun-Cheng Lin

IPC: H05K5/00

CPC classification number: G06F1/1679 ,  G06F1/1618 ,  G06F1/1675

Abstract: A foldable electric device comprises a first member, a second member and a pivot portion. The pivot portion is used to pivot the first member and the second member. The first member comprises a first cushion pad and a first magnetic component. The first cushion pad is retractably disposed on a surface of the first member. The first magnetic component is installed in the first member, and synchronously moves with the first cushion pad. The second member comprises a second magnetic component. When the first member and the second member are covered together, with the magnetic effect between the first magnetic component and the second magnetic component, the first cushion pad is linked by the first magnetic unit to protrude from or retract into the first member.

Abstract translation: 可折叠电气装置包括第一构件，第二构件和枢转部分。 枢转部分用于枢转第一构件和第二构件。 第一构件包括第一缓冲垫和第一磁性部件。 第一缓冲垫可收缩地设置在第一构件的表面上。 第一磁性部件安装在第一部件中，与第一缓冲垫同步移动。 第二构件包括第二磁性部件。 当第一构件和第二构件被覆盖在一起时，具有第一磁性构件和第二磁性构件之间的磁效应，第一缓冲垫通过第一磁性单元连接以从第一构件和第二构件突出或缩回到第一构件。

公开(公告)号：US20120299181A1

公开(公告)日：2012-11-29

申请号：US13118108

申请日：2011-05-27

Applicant: Meng-Tse Chen ,  Wei-Hung Lin ,  Sheng-Yu Wu ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Wei-Hung Lin ,  Sheng-Yu Wu ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/488 ,  H01L21/56

CPC classification number: H01L24/17 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16055 ,  H01L2224/16113 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00

Abstract: A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.

Abstract translation: 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。