公开(公告)号：US5387905A

公开(公告)日：1995-02-07

申请号：US956237

申请日：1992-10-05

Applicant: Gary Grube ,  Richard Comroe ,  Robert Furtaw ,  Mark Shaughnessy

Inventor： Gary Grube ,  Richard Comroe ,  Robert Furtaw ,  Mark Shaughnessy

IPC: H04W84/08 ,  H04Q1/00

CPC classification number: H04W84/08

Abstract: Processing of dispatch calls in a multi-site communication system begins when a source communication unit initiates a request for a dispatch call. The request is routed to a controller which assigns a controlled device to support the request. In addition, the controller identifies the destination communication units, which site each of the destination units are in, and what controlled devices are needed to support the dispatch call. Having identified the controlled devices, the controller assigns all of the controlled devices needed the same temporary network address. With all the controlled devices having the same temporary network address, the controlled device assigned to support the request can transmit the messages generated by the source communication unit to other controlled devices using the temporary network address. Thus only one representation of a message produced by the source communication unit is transmitted from the assigned controlled device.

Abstract translation: 当源通信单元启动对调度呼叫的请求时，多站点通信系统中的调度呼叫的处理开始。 请求被路由到控制器，该控制器分配受控设备来支持请求。 此外，控制器识别目的地通信单元，每个目的地单元所在的站点以及支持调度呼叫所需的受控设备。 在识别出受控设备后，控制器分配所有受控设备所需的相同临时网络地址。 在所有受控设备具有相同的临时网络地址的情况下，分配用于支持请求的受控设备可以使用临时网络地址将由源通信单元生成的消息发送到其他受控设备。 因此，从分配的受控设备仅发送由源通信单元产生的消息的一个表示。

公开(公告)号：US5371898A

公开(公告)日：1994-12-06

申请号：US724282

申请日：1991-07-01

Applicant: Gary Grube ,  Jaime A. Borras ,  Richard Comroe

Inventor： Gary Grube ,  Jaime A. Borras ,  Richard Comroe

IPC: H04W4/06 ,  H04W84/08 ,  H04W92/02 ,  H04Q7/00 ,  H04B1/38 ,  H04B17/00

CPC classification number: H04W84/08 ,  H04W4/06 ,  H04W92/02

Abstract: A communication unit may operate in either a trunking communication system and a cellular communication system when the coverage areas of each system overlap. Typically, the communication unit is affiliated with the trunking communication system and operates normally therein. When a call is received or being placed via the cellular communication system, the communication unit transfers its affiliation to the cellular communication system and operates therein. The communication unit is prompted by the trunking communication system to transfer its affiliation for incoming calls and does so automatically for outgoing calls. Once the communication ends, the communication unit transfers its affiliation back to the trunking communication system within a predetermined period of time.

Abstract translation: 当每个系统的覆盖区域重叠时，通信单元可以在集群通信系统和蜂窝通信系统中操作。 通常，通信单元与集群通信系统相关联，并且其中正常工作。 当通过蜂窝通信系统接收或放置呼叫时，通信单元将其隶属关系传送到蜂窝通信系统并在其中操作。 通信单元由集群通信系统提示，以传送其来电的隶属关系，并自动执行呼出呼叫。 一旦通信结束，通信单元在预定时间段内将其归属返回到中继通信系统。

公开(公告)号：US20080020227A1

公开(公告)日：2008-01-24

申请号：US11835136

申请日：2007-08-07

Applicant: Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

Inventor： Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

IPC: B32B15/092

CPC classification number: G01R3/00 ,  G01R1/06716 ,  G01R1/06744 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T156/10 ,  Y10T428/12347 ,  Y10T428/12375 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Abstract translation: 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

公开(公告)号：US20070228110A1

公开(公告)日：2007-10-04

申请号：US11758479

申请日：2007-06-05

Applicant: Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

Inventor： Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC: B23K20/00

CPC classification number: H01L24/72 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/12 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/81901 ,  H01L2224/85 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01048 ,  H01L2224/72 ,  H01L2924/00012

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

公开(公告)号：US20060223345A1

公开(公告)日：2006-10-05

申请号：US11423767

申请日：2006-06-13

Applicant: Thomas Dozier ,  Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu ,  David Pedersen ,  Michael Stadt

Inventor： Thomas Dozier ,  Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu ,  David Pedersen ,  Michael Stadt

IPC: H01R12/00

CPC classification number: G01R1/0408 ,  B23K3/087 ,  G01R1/0416 ,  G01R1/0466 ,  G01R31/2886 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81901 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/119 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2201/09827 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00014 ,  H01L2224/72

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract translation: 从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接是通过推动电子部件，因此弹簧接触元件的端部垂直地抵靠互连基板的端子，或者通过水平推动互连基板的端子 抵抗弹簧接触元件的端部。 公开了各种终端配置。

公开(公告)号：US20050255408A1

公开(公告)日：2005-11-17

申请号：US10831870

申请日：2004-04-26

Applicant: Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

Inventor： Gary Grube ,  Gaetan Mathieu ,  Benjamin Eldridge ,  Chadwick Sofield

IPC: B32B9/00 ,  B32B15/04

CPC classification number: G01R3/00 ,  G01R1/06716 ,  G01R1/06744 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T156/10 ,  Y10T428/12347 ,  Y10T428/12375 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Abstract translation: 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

公开(公告)号：US06947773B2

公开(公告)日：2005-09-20

申请号：US10818150

申请日：2004-04-05

Applicant: Robert Novorita ,  Eric Ziolko ,  Gary Grube

Inventor： Robert Novorita ,  Eric Ziolko ,  Gary Grube

IPC: H04B7/14 ,  H04M9/08 ,  H04Q7/20 ,  H04Q7/32

CPC classification number: H04M9/082

Abstract: A method and apparatus for reducing echo feedback in a wireless communication system (10) is accomplished when a receiving communication unit (24) senses a feedback signal, or echo, via an ancillary communication path. The receiving communication unit is a targeted recipient of an original audio signal generated by a transmitting communication unit (22), where the original audio signal (42) is conveyed to the receiving communication unit. Upon detecting the feedback signal and determining that it exceeds a feedback threshold, the receiving communication unit attenuates an audible output of the original signal to reduce echo to the transmitting communication unit. In addition, the receiving communication unit, and/or the transmitting communication unit include echo canceller to further minimize the echo within the digital communication system.

Abstract translation: 当接收通信单元（24）经由辅助通信路径感测到反馈信号或回波时，实现用于减少无线通信系统（10）中的回波反馈的方法和装置。 接收通信单元是由发送通信单元（22）生成的原始音频信号的目标接收者，其中原始音频信号（42）被传送到接收通信单元。 在检测到反馈信号并确定其超过反馈阈值时，接收通信单元衰减原始信号的可听输出，以减少对发送通信单元的回波。 此外，接收通信单元和/或发送通信单元包括回波消除器，以进一步最小化数字通信系统内的回波。

公开(公告)号：US06741874B1

公开(公告)日：2004-05-25

申请号：US09552466

申请日：2000-04-18

Applicant: Robert Novorita ,  Eric Ziolko ,  Gary Grube

Inventor： Robert Novorita ,  Eric Ziolko ,  Gary Grube

IPC: H04Q720

CPC classification number: H04M9/082

Abstract: A method and apparatus for reducing echo feedback in a wireless communication system (10) is accomplished when a receiving communication unit (24) senses a feedback signal, or echo, via an ancillary communication path. The receiving communication unit is a targeted recipient of an original audio signal generated by a transmitting communication unit (22), where the original audio signal (42) is conveyed to the receiving communication unit. Upon detecting the feedback signal and determining that it exceeds a feedback threshold, the receiving communication unit attenuates an audible output of the original signal to reduce echo to the transmitting communication unit. In addition, the receiving communication unit, and/or the transmitting communication unit include echo canceller to further minimize the echo within the digital communication system.

公开(公告)号：US6104925A

公开(公告)日：2000-08-15

申请号：US14524

申请日：1998-01-28

Applicant: Gary Grube ,  Eric Ziolko ,  Paul Bocci

Inventor： Gary Grube ,  Eric Ziolko ,  Paul Bocci

IPC: H04B7/185 ,  H04W4/06 ,  H04W4/08 ,  H04W92/02 ,  H04Q7/20 ,  H04B1/38 ,  H04M1/00

CPC classification number: H04W4/06 ,  H04B7/18563 ,  H04W4/08 ,  H04W92/02

Abstract: Group communications between subscribers (20, 22) affiliated with a terrestrial communication system (12, 14) and subscribers (46, 48) affiliated with a satellite communication system (10) is begun when a subscriber has initiated a group communication request. The request is provided, via a controller (i.e., a terrestrial system controller or satellite system controller depending on which communication system the requesting subscriber is affiliated with), to a systems interface (36). Upon receiving the request, the systems interface determines whether subscribers that are identified to participate in the group communication are located in the terrestrial system and/or the satellite system. If the group of subscribers have members in both communication systems, the systems interface establishes satellite communication links for each subscriber affiliated with the satellite communication system and establishes a terrestrial communication link for subscribers affiliated with a terrestrial communication system. Once the communication links are established, the systems interface arbitrates transmissions of the group of subscribers. The arbitration of transmissions insures that each subscriber in the group of subscribers receives the transmission.

Abstract translation: 当用户已经发起组通信请求时，开始与地面通信系统（12,14）相关联的用户（20,22）和附属于卫星通信系统（10）的用户（46,48）之间的群组通信。 经由控制器（即，地面系统控制器或卫星系统控制器取决于请求用户所属的通信系统）向系统接口（36）提供该请求。 在接收到请求后，系统接口确定被识别参与组通信的用户是否位于地面系统和/或卫星系统中。 如果用户组在两个通信系统中都有成员，则系统接口为与卫星通信系统相关联的每个用户建立卫星通信链路，并为与陆地通信系统相关的用户建立地面通信链路。 一旦建立了通信链路，系统接口将对订户组的传输进行仲裁。 传输的仲裁确保了用户组中的每个用户接收到传输。

公开(公告)号：US5525545A

公开(公告)日：1996-06-11

申请号：US306208

申请日：1994-11-03

Applicant: Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

Inventor： Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.