公开(公告)号：US20060223345A1

公开(公告)日：2006-10-05

申请号：US11423767

申请日：2006-06-13

申请人： Thomas Dozier ,  Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu ,  David Pedersen ,  Michael Stadt

发明人： Thomas Dozier ,  Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu ,  David Pedersen ,  Michael Stadt

IPC分类号： H01R12/00

CPC分类号： G01R1/0408 ,  B23K3/087 ,  G01R1/0416 ,  G01R1/0466 ,  G01R31/2886 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81901 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/119 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2201/09827 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00014 ,  H01L2224/72

摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

摘要翻译： 从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接是通过推动电子部件，因此弹簧接触元件的端部垂直地抵靠互连基板的端子，或者通过水平推动互连基板的端子 抵抗弹簧接触元件的端部。 公开了各种终端配置。

公开(公告)号：US20050146339A1

公开(公告)日：2005-07-07

申请号：US11073187

申请日：2005-03-04

申请人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

发明人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

IPC分类号： G01R31/26 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R31/2886 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49126

摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

公开(公告)号：US20070228110A1

公开(公告)日：2007-10-04

申请号：US11758479

申请日：2007-06-05

申请人： Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

发明人： Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC分类号： B23K20/00

CPC分类号： H01L24/72 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/12 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/81901 ,  H01L2224/85 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01048 ,  H01L2224/72 ,  H01L2924/00012

摘要： Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

公开(公告)号：US20070126443A1

公开(公告)日：2007-06-07

申请号：US11669010

申请日：2007-01-30

申请人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu

发明人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  G01R31/2889 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49453

摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。

公开(公告)号：US20080116927A1

公开(公告)日：2008-05-22

申请号：US12020380

申请日：2008-01-25

申请人： Thomas Dozier ,  Benjamin Eldridge ,  Igor Khandros ,  Gaetan Mathieu ,  Sheldon Taylor

发明人： Thomas Dozier ,  Benjamin Eldridge ,  Igor Khandros ,  Gaetan Mathieu ,  Sheldon Taylor

IPC分类号： G01R1/067 ,  G01R31/02

CPC分类号： G01R1/06727 ,  G01R1/07342 ,  H01L2924/01074 ,  H01L2924/01078

摘要： Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contact bumps of membrane probes, and the like. The spatial relationship between the tip structures can lithographically be defined to very close tolerances. The metallurgy of the tip structures is independent of that of the interconnection element to which they are attached, by brazing, plating or the like. The contact tip structures are readily provided with topological (small, precise, projecting, non-planar) contact features, such as in the form of truncated pyramids, to optimize electrical pressure connections subsequently being made to terminals of electronic components. Elongate contact tip structures, adapted in use to function as spring contact elements without the necessity of being joined to resilient contact elements are described. Generally, the invention is directed to making (pre-fabricating) relatively ‘perfect’ contact tip structures (“tips”) and joining them to relatively ‘imperfect’ interconnection elements to improve the overall capabilities of resulting “tipped” interconnection elements.

摘要翻译： 接触尖端结构被制造在牺牲衬底上，用于随后连接到包括复合互连元件，单片互连元件，探针卡的钨针，膜探针的接触凸块等的互连元件。 尖端结构之间的空间关系可以光刻地定义为非常接近的公差。 尖端结构的冶金独立于它们所连接的互连元件的冶金，通过钎焊，电镀等。 接触尖端结构容易地具有拓扑（小的，精确的，突出的，非平面的）接触特征，例如呈截锥形的形式，以优化随后对电子部件的端子进行的电压连接。 描述了适于用作弹簧接触元件而不需要接合到弹性接触元件的细长接触尖端结构。 通常，本发明旨在制造（预制）相对“完美”的接触尖端结构（“尖端”）并将它们连接到相对“不完美”的互连元件，以改善所产生的“尖端”互连元件的整体能力。

公开(公告)号：US20070075715A1

公开(公告)日：2007-04-05

申请号：US11561297

申请日：2006-11-17

申请人： Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Thomas Dozier ,  William Smith

发明人： Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Thomas Dozier ,  William Smith

IPC分类号： G01R31/02

CPC分类号： H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

摘要： An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

摘要翻译： 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US20070247176A1

公开(公告)日：2007-10-25

申请号：US11692035

申请日：2007-03-27

申请人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

发明人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

IPC分类号： G01R31/26 ,  G01R31/04

CPC分类号： G01R31/2886 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49126

摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。

公开(公告)号：US20060237856A1

公开(公告)日：2006-10-26

申请号：US11456568

申请日：2006-07-11

申请人： Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

发明人： Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC分类号： H01L23/52

CPC分类号： G01R3/00 ,  B23K2101/38 ,  G01R1/06727 ,  G01R1/06744 ,  H01L21/6835 ,  H01L23/4951 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/57 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00

摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

摘要翻译： 通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。 开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。 每个弹簧接触元件具有基端部分，接触端部分和中心体部分。 接触端部在与中心体部分相同的z轴（不同高度）偏移。 基端部优选地沿着与中心主体部分的z轴相反的方向偏移。 以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸 的电子元件。 在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

公开(公告)号：US5414298A

公开(公告)日：1995-05-09

申请号：US38178

申请日：1993-03-26

申请人： Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

发明人： Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC分类号： H01L23/48 ,  H01L39/02

CPC分类号： H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/49004 ,  Y10T29/4913

摘要： A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.

摘要翻译： 半导体芯片组件包括芯片，通过柔性引线永久地电连接到芯片的芯片和用于将端子偏压离开芯片的弹性元件或元件。 芯片与具有接触焊盘的基板永久地接合，使得端子设置在芯片和基板之间，并且端子在由弹性元件施加的力的影响下接合接触焊盘。 端子通常设置在柔性片状电介质插入件上，并且弹性元件设置在插入件和芯片之间。 可以在与基板接合之前测试芯片和端子的组件。 由于该组件与衬底的接合不涉及焊接或其它复杂的结合工艺，所以是可靠的。 组件可以非常紧凑，并且可以占据仅比芯片本身的面积稍大的区域。

公开(公告)号：US5525545A

公开(公告)日：1996-06-11

申请号：US306208

申请日：1994-11-03

申请人： Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

发明人： Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/49004 ,  Y10T29/4913

摘要： A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.