公开(公告)号：US5938452A

公开(公告)日：1999-08-17

申请号：US922018

申请日：1997-09-02

Applicant: Robert John Wojnarowski

Inventor： Robert John Wojnarowski

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/32 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K1/14 ,  H05K3/10

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T428/24917

Abstract: A flexible film interface includes a flexible film; flexible material attached to a portion of the flexible film; surface metallization on the flexible material, the flexible film having at least one via extending therethrough to the surface metallization; and a floating pad structure including floating pad metallization patterned over the flexible material and the surface metallization, a first portion of the floating pad metallization forming a central pad and a second portion of the floating pad metallization forming at least one extension from the central pad and extending into the at least one via.

公开(公告)号：US11904073B2

公开(公告)日：2024-02-20

申请号：US17975245

申请日：2022-10-27

Applicant: Verily Life Sciences LLC

Inventor： Alexander Loo ,  Damiano Patron ,  Matthew Page

IPC: A61N1/02 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H01G4/005 ,  H01G4/018 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01G4/224 ,  H01G4/228 ,  H01G4/236 ,  A61L31/02 ,  H01R4/02 ,  H01R4/60 ,  H01R43/02 ,  H05K3/32 ,  H01R4/04 ,  H01Q1/27 ,  H01Q23/00 ,  H01R12/53

CPC classification number: A61L31/026 ,  H01Q1/273 ,  H01Q23/00 ,  H01R4/029 ,  H01R4/04 ,  H01R4/60 ,  H01R12/53 ,  H01R43/0256 ,  H05K1/18 ,  H05K3/0047 ,  H05K3/321 ,  H05K3/328 ,  H05K2201/10257 ,  H05K2201/10295 ,  H05K2203/049

Abstract: A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.

公开(公告)号：US11728555B2

公开(公告)日：2023-08-15

申请号：US17461539

申请日：2021-08-30

Applicant: Micron Technology, Inc.

Inventor： Yoshihito Koya

IPC: G06F3/12 ,  H01P3/12 ,  H01P1/24 ,  H05K1/18 ,  H05K1/02 ,  G06F13/16 ,  G06F13/40 ,  H01P5/08

CPC classification number: H01P3/12 ,  G06F13/1668 ,  G06F13/4068 ,  H01P1/24 ,  H05K1/0243 ,  H05K1/181 ,  H01P5/085 ,  H05K2201/10159 ,  H05K2201/10257 ,  H05K2201/10515 ,  H05K2201/10522

Abstract: Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.

公开(公告)号：US20180081481A1

公开(公告)日：2018-03-22

申请号：US15712070

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： Douglas G. FOURNIER ,  James R. KROGDAHL ,  Daniel W. JARVIS ,  Edward S. HUO ,  Lee E. HOOTON ,  Srikanth V. THIRUPPUKUZHI ,  Garrett R. OWOC ,  Michael NGO ,  David A. PAKULA ,  Robert F. MEYER

IPC: G06F3/041 ,  G02F1/1333 ,  G02F1/1343

CPC classification number: H05K7/20481 ,  B32B2307/302 ,  B32B2457/20 ,  G06F1/1637 ,  G06F1/1643 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04112 ,  H01M2/08 ,  H01M2/1016 ,  H01M2/1022 ,  H01M2220/30 ,  H02J7/0042 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/148 ,  H05K7/20963 ,  H05K9/0033 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10257

Abstract: An electronic device having a display assembly is disclosed. Several layers may combine to form the display assembly. For example, the display assembly may include a touch sensitive layer (or touch detection layer), a display layer that present visual information, and a force sensitive layer (or force detection layer). The display layer may include a bend or curve that allows a portion of the display layer to bend around the force sensitive layer. Also, the connectors (that provide electrical and mechanical connections) may be positioned at different locations of the layers. For example, the display layer may include a connector on a first edge region, and the force sensitive layer may include a connector on a second edge region that is perpendicular, or at least substantially perpendicular, to the first edge region. By positioning the connectors on perpendicular edge regions, the display assembly may reduce its footprint.

公开(公告)号：US20170359896A1

公开(公告)日：2017-12-14

申请号：US15618256

申请日：2017-06-09

Applicant: Board of Regents, The University of Texas System

Inventor： Chi Yen Kim ,  Ryan Wicker ,  Eric MacDonald ,  David Espalin

IPC: H05K1/11 ,  H01R12/57 ,  H05K3/40 ,  H05K3/10

CPC classification number: H05K1/113 ,  H05K3/103 ,  H05K3/381 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10303 ,  H05K2203/0228 ,  H05K2203/0271 ,  H05K2203/1105 ,  H05K2203/1189 ,  H05K2203/1446

Abstract: A 3D printed circuit apparatus includes a 3D printed circuit having a surface layer and one or more wires embedded under the surface layer, and a conductive metal pin that is cut to a desired length and inserted into the 3D printed circuit in order to attain contact with the wire or wires embedded under the surface layer.

公开(公告)号：US20100068466A1

公开(公告)日：2010-03-18

申请号：US12210920

申请日：2008-09-15

Applicant: Hau NGUYEN

Inventor： Hau NGUYEN

IPC: B32B3/22 ,  B23K35/14 ,  B23K1/20

CPC classification number: B23K3/0623 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/40 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T428/24612

Abstract: The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

Abstract translation: 本发明涉及形成焊点连接的方法和装置。 一个实施例涉及一种改进的焊球。 焊球包括具有内部开口的穿孔金属外壳。 焊接材料包住外壳并填充其内部开口。 焊球可以被施加到诸如集成电路管芯的电气装置上，以在器件上形成焊料凸块。 焊料凸点又可用于在器件和合适的衬底（例如印刷电路板）之间形成改进的焊点连接。 在一些应用中，形成焊接接头，而不需要向衬底的表面施加额外的焊料。 本发明还包括不同的焊料凸块布置和使用这种布置来形成器件和衬底之间的焊接连接的方法。

公开(公告)号：US20070123067A1

公开(公告)日：2007-05-31

申请号：US11657995

申请日：2007-01-25

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

公开(公告)号：US07189079B2

公开(公告)日：2007-03-13

申请号：US11140195

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环被焊接到基板和装置两者，并且在制造期间通过柔性非导电膜保持在适当的位置，其中形成有H形的切口并且插入导电环。 H形切口的内部部分延伸到导电环中，并在制造过程中将环保持在适当位置。 每个环的侧壁的一部分不被焊接，从而确保环的至少一部分保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US06963033B2

公开(公告)日：2005-11-08

申请号：US10032478

申请日：2002-01-02

Applicant: Sang-Young Kim ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Seung-Kon Mok

Inventor： Sang-Young Kim ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Seung-Kon Mok

IPC: B23K33/00 ,  B23K1/00 ,  B23K35/02 ,  B23K35/14 ,  H01L21/60 ,  H01L23/12 ,  H01L23/485 ,  H05K1/11 ,  H05K3/34 ,  H05K1/16

CPC classification number: H01L24/10 ,  B23K1/0008 ,  B23K35/0222 ,  B23K35/0244 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12014 ,  Y10T428/12222 ,  H01L2224/29099 ,  H01L2924/00

Abstract: An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an array of annular conductive pads and the other planar element having either a corresponding array of annular or circular conductive pads, separated by an array of spherical solder balls comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Abstract translation: 一种焊料结构的阵列，包括多个径向弯曲的外表面，每个包围预定尺寸的空腔，其可以用于在预定的导电接触点处将两个具有不同特性的平面元件柔性地接合在一起。 通过以分层布置组装两个平面元件，一个平面元件具有环形导电焊盘的阵列，另一个平面元件具有相应的环形或圆形导电焊盘阵列，由阵列的球形焊球组成，焊球包括焊料和 可以在焊料化合物的熔化和随后的冷却期间产生助熔剂，中空焊料结构。 所得中空焊料结构的可塑性/弹性特性吸收两个平面元件相对于彼此的横向移动，而不会降低焊接接头。

公开(公告)号：US06793116B2

公开(公告)日：2004-09-21

申请号：US10255373

申请日：2002-09-26

Applicant: Tomoko Harada

Inventor： Tomoko Harada

IPC: B23K3514

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K2201/0116 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  H01L2924/00

Abstract: A solder ball achieves a desired quantity of solder material for a solder joint easily without increasing the thickness of a solder layer formed to cover a core. The solder ball comprises a conductive core having depressions on its outer surface, and a solder layer formed to cover the outer surface of the core in such a way as to fill the depressions of the core. Thus, the quantity of the solder material included in the ball is supplemented by the solder material filled into the depressions. Preferably, the core has a higher melting point than the solder layer and wettability to the solder layer. The core may have a cavity in its inside, thereby forming a shell-shaped core. The core may be made of a porous metal body having pores, in which part of the pores reaches the outer surface of the core, thereby forming the depressions.

Abstract translation: 焊球容易获得所需量的用于焊接接头的焊料材料，而不增加形成覆盖芯的焊料层的厚度。 焊球包括在其外表面上具有凹陷的导电芯，以及形成为以填充芯的凹陷的方式覆盖芯的外表面的焊料层。 因此，包含在球中的焊料材料的量由填充到凹部中的焊料材料补充。 优选地，芯具有比焊料层更高的熔点和对焊料层的润湿性。 芯可以在其内部具有空腔，从而形成壳形芯。 芯可以由具有孔的多孔金属体制成，其中一部分孔到达芯的外表面，从而形成凹陷。