公开(公告)号：US20120077317A1

公开(公告)日：2012-03-29

申请号：US13312093

申请日：2011-12-06

Applicant: Sotaro ITO ,  Michimasa Takahashi ,  Yukinobu Mikado

Inventor： Sotaro ITO ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC: H01L21/56

CPC classification number: H01L24/83 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/10477 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

公开(公告)号：US20120047727A1

公开(公告)日：2012-03-01

申请号：US13291134

申请日：2011-11-08

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/028 ,  H05K1/142 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/055 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/09509 ,  H05K2201/096

Abstract: A method for manufacturing a flex-rigid wiring board, including preparing a flexible wiring board having a flexible base material and having a conductive layer over the flexible base material, making a cut in the flexible wiring board to form a cut portion, and folding at least one portion of the flexible wiring board using the cut portion to form one or more folding portions such that the flexible wiring board is extended in length, and connecting the flexible wiring board to a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material.

Abstract translation: 一种柔性刚性布线板的制造方法，其特征在于，在柔性基材上形成具有柔性基材的柔性布线基板，并且在柔性基材上形成导电层，在柔性布线基板上切断，形成切断部， 使用所述切割部分的所述柔性布线板的至少一部分形成一个或多个折叠部分，使得所述柔性布线板的长度延伸，并且将所述柔性布线板连接到包括刚性基底材料并具有导电性的刚性布线板 层叠在刚性基材上。

公开(公告)号：US20110283532A1

公开(公告)日：2011-11-24

申请号：US13195139

申请日：2011-08-01

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.

Abstract translation: 柔性布线板包括：形成有导体图案的第一柔性基底材料，邻近第一柔性基底材料设置的第二柔性基底材料和覆盖第一柔性基底材料和第二柔性基底材料的绝缘层。 绝缘层暴露第一柔性基材的至少一部分。 在绝缘层上形成导体图案，并且在绝缘层上连接第一柔性基底材料的导体图形和导体图案的镀层。

公开(公告)号：US08035983B2

公开(公告)日：2011-10-11

申请号：US12144691

申请日：2008-06-24

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/11

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0035 ,  H05K3/0052 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.

Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的至少一个边缘。 基底衬底，第一衬底或第二衬底中的至少一个包括柔韧树脂，并且基底衬底，第一衬底或第二衬底中的至少一个包括无机填料。

公开(公告)号：US20100132980A1

公开(公告)日：2010-06-03

申请号：US12537607

申请日：2009-08-07

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/142 ,  H05K1/115 ,  H05K3/10 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/2018 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A wiring board includes an insulating board, a wiring sub board having a wiring layer, and an insulating layer. The insulating layer has a via hole in which a conductor is formed by plating. The insulating board and the wiring sub board are horizontally laid out. The insulating layer is laid out to cover a boundary portion between the insulating board and the wiring sub board and continuously extends from the insulating board to the wiring sub board. A resin which constitutes the insulating layer is filled in the boundary portion. The conductor is electrically connected to the wiring layer.

Abstract translation: 布线板包括绝缘板，具有布线层的布线子板和绝缘层。 绝缘层具有通孔，导电体通过电镀形成。 绝缘板和布线子板水平布置。 绝缘层布置成覆盖绝缘板和布线子板之间的边界部分，并且从绝缘板连续延伸到布线子板。 构成绝缘层的树脂填充在边界部分中。 导体电连接到布线层。

公开(公告)号：US20100025087A1

公开(公告)日：2010-02-04

申请号：US12489864

申请日：2009-06-23

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/4697 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T29/49158 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A flex-rigid wiring board including a rigid substrate including a rigid base material and a conductor layer, and a flexible substrate having a conductor layer. The conductor layer of the flexible substrate is electrically connected to the conductor layer of the rigid substrate. The rigid substrate has a recessed portion which is formed on a surface of the rigid substrate and which accommodates an electronic component.

Abstract translation: 一种柔性刚性布线板，包括刚性基板，其包括刚性基材和导体层，以及柔性基板，具有导体层。 柔性基板的导体层电连接到刚性基板的导体层。 刚性基板具有形成在刚性基板的表面上并且容纳电子部件的凹部。

公开(公告)号：US20100021627A1

公开(公告)日：2010-01-28

申请号：US12574287

申请日：2009-10-06

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Hiroyuki Yanagisawa

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Hiroyuki Yanagisawa

IPC: B05D5/12

CPC classification number: H05K1/167 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09736 ,  H05K2203/1453

Abstract: A manufacturing method of a printed wiring board, including forming a plurality of electrodes on a conductive layer formed on a substrate by a plating method, forming an insulation layer on the electrodes and the conductive layer, removing the substrate from the conductive layer, patterning the conductive layer except for a resistor forming region reserved for forming a resistor, thereby forming an external connection conductive pattern, and forming a resistor in the resistor forming region such that the resistor is separated by a space from the external connection conductive pattern.

Abstract translation: 一种印刷电路板的制造方法，其特征在于，在电镀形成于基板上的导电层上形成多个电极，在所述电极和所述导电层上形成绝缘层，从所述导电层除去所述基板， 导电层除了保留用于形成电阻器的电阻器形成区域，从而形成外部连接导电图案，并且在电阻器形成区域中形成电阻器，使得电阻器与外部连接导电图案间隔开。

公开(公告)号：US07626829B2

公开(公告)日：2009-12-01

申请号：US11250531

申请日：2005-10-17

Applicant: Yasuhiro Watanabe ,  Michimasa Takahashi ,  Masakazu Aoyama ,  Takenobu Nakamura ,  Hiroyuki Yanagisawa

Inventor： Yasuhiro Watanabe ,  Michimasa Takahashi ,  Masakazu Aoyama ,  Takenobu Nakamura ,  Hiroyuki Yanagisawa

IPC: H05K7/10

CPC classification number: H05K1/113 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/114 ,  H05K3/243 ,  H05K3/28 ,  H05K3/282 ,  H05K3/4614 ,  H05K2201/0391 ,  H05K2201/10674 ,  H05K2203/0574 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2224/0401

Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Abstract translation: 本发明提供了一种通过提高可靠性而获得电连接性和功能性的多层印刷线路板，特别是可提高落下试验的可靠性。 在要安装部件的焊料垫60B上没有形成耐腐蚀层，以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，也可能不形成耐腐蚀层的焊盘60A不会发生接触故障。

公开(公告)号：US20090290318A1

公开(公告)日：2009-11-26

申请号：US12453718

申请日：2009-05-20

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/183 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/10484 ,  H05K2203/049 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.

Abstract translation: 印刷布线板包括具有凹部和多个导体的第一基板，具有多个导体的第二基板，并插入在第一基板的凹部中，使得第一基板具有暴露出第一基板的表面的至少一部分的表面 第二基板。 第一衬底中的多个导体电连接到第二衬底中的多个导体，并且第二衬底具有比第一衬底的导体的密度高的导体的密度。

公开(公告)号：US20090038836A1

公开(公告)日：2009-02-12

申请号：US12146279

申请日：2008-06-25

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K1/11 ,  H05K3/36 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H05K1/0366 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A wiring board assembly and a method of making a wiring board assembly. The wiring board assembly includes a first wiring board having a first substrate, a non-pliable second substrate having a smaller mounting area than a mounting area of the first substrate and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. At least one via formed in at least one of the first substrate or the second substrate. A second wiring board includes a pliable member connecting the first wiring board to the second wiring board.

Abstract translation: 一种接线板组件及其制造方法。 布线基板组件包括：第一布线板，具有第一基板，非柔性第二基板，其安装面积小于第一基板的安装面积;以及基板基板，层压在第一基板和第二基板之间， 衬底延伸超过第二衬底的边缘。 至少一个通孔形成在第一基板或第二基板中的至少一个中。 第二布线板包括将第一布线板连接到第二布线板的柔性构件。