公开(公告)号：US4493725A

公开(公告)日：1985-01-15

申请号：US495531

申请日：1983-05-17

申请人： Sang H. Moon ,  Jae M. Park ,  Sung S. Suh

发明人： Sang H. Moon ,  Jae M. Park ,  Sung S. Suh

IPC分类号： C05G3/00 ,  C05D9/00 ,  C05D9/02

CPC分类号： C05G3/0041

摘要： A fertilizer product in granular form with sustained action is provided by spraying a silicate-based solution on the surface of the fertilizer granules in a conventional coating machine which is maintained at temperatures ranging from 20.degree. to 100.degree. C. The coating solution comprises 1 to 50% by weight of a silicate and/or silicic acid ester based on the weight of the fertilizer material to be treated, 0.001 to 1.0 part by weight of a metal and/or non-aqueous metallic compound (first additives), 0.001 to 1.0 part by weight of an aqueous metallic compound (second additives), 0.001 to 1.0 part by weight of an inorganic mineral (third additives), and optionally high molecular weight organic compound, wherein all parts described above are based on the weight of the silicate and/or silicic acid ester used. The coated fertilizer granules are subject to heat-treatment for 10 seconds to 10 days under conditions that the relative humidity and the temperature be maintained at 5 to 95% and 10.degree. to 250.degree. C., respectively.

摘要翻译： 通过在保持在20℃至100℃的常规涂布机中将硅酸盐基溶液喷洒在肥料颗粒表面上来提供具有持续作用的颗粒形式的肥料产品。涂布溶液包含1至 50重量％的硅酸盐和/或硅酸酯，基于待处理的肥料的重量，0.001至1.0重量份的金属和/或非水性金属化合物（第一添加剂），0.001至1.0 水溶性金属化合物（第二添加剂）重量份，0.001〜1.0重量份的无机矿物（第三添加剂）和任选的高分子量有机化合物，其中所有上述部分均以硅酸盐的重量为基准， /或硅酸酯。 在相对湿度和温度分别保持在5至95％和10至250℃的条件下，将涂覆的肥料颗粒进行10秒至10天的热处理。

公开(公告)号：US07763983B2

公开(公告)日：2010-07-27

申请号：US11825121

申请日：2007-07-02

申请人： Kenneth Allen Honer ,  Jae M. Park

发明人： Kenneth Allen Honer ,  Jae M. Park

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3121 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49805 ,  H01L23/49861 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/81191 ,  H01L2224/81805 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15313 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacturing a microelectronic package. The method includes the steps of attaching at least one microelectronic element to a tape having upper terminals projecting upwardly from an upper surface of a dielectric layer, so that top surfaces of the terminals are disposed coplanar with or above a top surface of the microelectronic element after the attaching step, electrically connecting the microelectronic element to at least some of the upper terminals; and further includes the step of applying an encapsulant to cover at least a portion of the upper surface of the dielectric layer, leaving the upper terminals surfaces of the terminals exposed.

摘要翻译： 一种制造微电子封装的方法。 该方法包括以下步骤：将至少一个微电子元件附接到具有从电介质层的上表面向上突出的上端子的带，使得端子的顶表面设置为与微电子元件的顶表面共面或上方，在 所述附接步骤将所述微电子元件电连接到所述上端子中的至少一些; 并且还包括施加密封剂以覆盖电介质层的上表面的至少一部分的步骤，使端子的上端子表面露出。

公开(公告)号：US5421507A

公开(公告)日：1995-06-06

申请号：US134994

申请日：1993-10-12

申请人： Charles R. Davis ,  Richard Hsiao ,  James R. Loomis ,  Jae M. Park ,  Jonathan D. Reid

发明人： Charles R. Davis ,  Richard Hsiao ,  James R. Loomis ,  Jae M. Park ,  Jonathan D. Reid

IPC分类号： H01R43/02 ,  B23K35/00 ,  B23K35/30 ,  H01R4/02 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  B23K1/00

CPC分类号： B23K35/3013 ,  B23K35/001 ,  H01R4/02 ,  H05K3/4614 ,  H01L2924/0132 ,  H05K2201/0305 ,  H05K3/28 ,  H05K3/328 ,  H05K3/4038 ,  Y10S428/901 ,  Y10T156/1056 ,  Y10T29/49126

摘要： A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au--Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, mulilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.

摘要翻译： 公开了一种同时层压电路化电介质层以形成多层高性能电路板并制造层间电连接的方法。 该方法选择将在一个低温下形成共晶体的两种元素，并将固化形成合金，该合金将仅在任何后续层压所要求的第二温度下再熔化。 使用瞬态液体粘合技术和足够的Au和Sn制成接头，以在低温下产生Au-Sn20wt％共晶。 一旦固化，形成的合金在随后的叠片中保持固体。 结果，制造复合的，多层的高性能电路板，通过固体合金在选定的焊盘处电连接。

公开(公告)号：US5337475A

公开(公告)日：1994-08-16

申请号：US992091

申请日：1992-12-17

申请人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

发明人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

IPC分类号： H01B1/16 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K1/092 ,  H01B1/16 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/12472 ,  Y10T428/12556 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/2982 ,  Y10T428/2991

摘要： Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

摘要翻译： 用于在电路化陶瓷衬底，特别是多层衬底中产生导电通孔的改进的充填组合物，而不会破裂和/或损失气密密封。 通孔填充组合物包含含有（a）在约0.5至6μm之间具有基本均匀直径的陶瓷和/或玻璃球的混合物的浆料，（b）具有约1至约6μm的最大尺寸或直径的导电金属颗粒或球体 / 3和1/4的陶瓷和/或玻璃球的直径，和（c）粘合剂载体。 形成的导电通孔体包括致密地包裹在共烧结陶瓷和/或玻璃球的均匀基质内的烧结金属颗粒的均匀导电骨架网络，该基质被气密地融合并与形成通孔壁的陶瓷层成一体 陶瓷电路基板。

公开(公告)号：US5055342A

公开(公告)日：1991-10-08

申请号：US484173

申请日：1990-02-16

申请人： Voya Markovich ,  Ashit Mehta ,  Jae M. Park ,  Eugene Skarvinko ,  David W. Wang

发明人： Voya Markovich ,  Ashit Mehta ,  Jae M. Park ,  Eugene Skarvinko ,  David W. Wang

IPC分类号： B32B27/30 ,  C08K3/00 ,  C08K3/36 ,  C08K7/00 ,  C08K7/22 ,  C08L27/12 ,  C09D127/12 ,  H01B3/44 ,  H01L23/14 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K3/00

CPC分类号： H05K1/0373 ,  C08K3/36 ,  C08K7/22 ,  H01B3/445 ,  H05K1/034 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K3/0032 ,  Y10S428/901 ,  Y10S525/935 ,  Y10S525/936 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/3154 ,  Y10T428/31544

摘要： Fluorinated polymeric composition exhibiting low dielectric constant and a low coefficient of thermal expansion containing a fluorinated polymeric material and a silica and/or quartz filler having a mean particle size of no greater than 7 microns, and use thereof to form a substrate having vias therein. Layers of the above composition are obtained by applying the composition to a substrate and then heating the composition to a temperature sufficient to cause the composition to fuse.

摘要翻译： 显示低介电常数和含有氟化聚合物材料的低热膨胀系数和平均粒径不大于7微米的二氧化硅和/或石英填料的氟化聚合物组合物及其在其中形成具有通孔的基材的用途。 通过将组合物施加到基底上，然后将组合物加热到足以使组合物熔合的温度来获得上述组合物的层。

公开(公告)号：US4868253A

公开(公告)日：1989-09-19

申请号：US183101

申请日：1988-04-19

申请人： Susan A. Hodgson ,  Jae M. Park ,  Richard R. Thomas

发明人： Susan A. Hodgson ,  Jae M. Park ,  Richard R. Thomas

IPC分类号： C08G69/48 ,  C08G59/14 ,  C08G59/40 ,  C08G59/42 ,  C08G59/44 ,  C08G73/10 ,  C08G85/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  H05K1/03 ,  H05K3/18

CPC分类号： C08G59/14 ,  C08G59/4007 ,  C08G59/4207 ,  C08G59/44 ,  C08G85/002 ,  C23C18/30 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/181

摘要： A reaction product of a .beta.-diketone and a polymer having groups that are reactive with the .beta.-diketone can be complexed with a metal. The reaction product having the complex metal can be activated to provide a substrate suitable for plating from an electroless metal plating bath.