公开(公告)号：US4493725A

公开(公告)日：1985-01-15

申请号：US495531

申请日：1983-05-17

申请人： Sang H. Moon ,  Jae M. Park ,  Sung S. Suh

发明人： Sang H. Moon ,  Jae M. Park ,  Sung S. Suh

IPC分类号： C05G3/00 ,  C05D9/00 ,  C05D9/02

CPC分类号： C05G3/0041

摘要： A fertilizer product in granular form with sustained action is provided by spraying a silicate-based solution on the surface of the fertilizer granules in a conventional coating machine which is maintained at temperatures ranging from 20.degree. to 100.degree. C. The coating solution comprises 1 to 50% by weight of a silicate and/or silicic acid ester based on the weight of the fertilizer material to be treated, 0.001 to 1.0 part by weight of a metal and/or non-aqueous metallic compound (first additives), 0.001 to 1.0 part by weight of an aqueous metallic compound (second additives), 0.001 to 1.0 part by weight of an inorganic mineral (third additives), and optionally high molecular weight organic compound, wherein all parts described above are based on the weight of the silicate and/or silicic acid ester used. The coated fertilizer granules are subject to heat-treatment for 10 seconds to 10 days under conditions that the relative humidity and the temperature be maintained at 5 to 95% and 10.degree. to 250.degree. C., respectively.

摘要翻译： 通过在保持在20℃至100℃的常规涂布机中将硅酸盐基溶液喷洒在肥料颗粒表面上来提供具有持续作用的颗粒形式的肥料产品。涂布溶液包含1至 50重量％的硅酸盐和/或硅酸酯，基于待处理的肥料的重量，0.001至1.0重量份的金属和/或非水性金属化合物（第一添加剂），0.001至1.0 水溶性金属化合物（第二添加剂）重量份，0.001〜1.0重量份的无机矿物（第三添加剂）和任选的高分子量有机化合物，其中所有上述部分均以硅酸盐的重量为基准， /或硅酸酯。 在相对湿度和温度分别保持在5至95％和10至250℃的条件下，将涂覆的肥料颗粒进行10秒至10天的热处理。

公开(公告)号：US07268304B2

公开(公告)日：2007-09-11

申请号：US11111145

申请日：2005-04-21

申请人： Masud Beroz ,  Jae M. Park ,  Belgacem Haba ,  Fion Tan ,  Philip R. Osborn

发明人： Masud Beroz ,  Jae M. Park ,  Belgacem Haba ,  Fion Tan ,  Philip R. Osborn

IPC分类号： H01R43/00 ,  H01R12/04 ,  H05K13/00 ,  H05K1/11

CPC分类号： H01L23/13 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/48471 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00

摘要： A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.

摘要翻译： 用于半导体芯片的连接部件包括具有间隙的基板，多个平行间隔开的​​引线延伸。 引线的端部通过结合到触点或嵌入基板中而粘附到基板上。 在一个实施例中，连接部件可以通过将导线穿过间隙缝合而形成。 在另一个实施例中，支撑间隔开的平行引线的预制引线组件并置并转移到衬底。 连接部件并置在半导体芯片上，由此在间隙上延伸的引线可以具有一端分离并结合到下面的芯片触点。

公开(公告)号：US5340451A

公开(公告)日：1994-08-23

申请号：US61815

申请日：1993-05-13

申请人： Leena P. Buchwalter ,  Stephen L. Buchwalter ,  Charles R. Davis ,  Ronald D. Goldblatt ,  John E. Heidenreich, III ,  Sharon L. Nunes ,  Jae M. Park ,  Richard R. Thomas ,  Domenico Tortorella ,  Luis M. Ferreiro, deceased

发明人： Leena P. Buchwalter ,  Stephen L. Buchwalter ,  Charles R. Davis ,  Ronald D. Goldblatt ,  John E. Heidenreich, III ,  Sharon L. Nunes ,  Jae M. Park ,  Richard R. Thomas ,  Domenico Tortorella ,  Luis M. Ferreiro, deceased

IPC分类号： C23C18/22 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  B01D3/00

CPC分类号： C23C18/22 ,  H05K1/034 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381

摘要： A process is disclosed for producing a metal-organic polymer combination by contacting the polymer with a plasma followed by an aqueous solution of a metal salt. In one embodiment a water or nitrous oxide plasma is used to treat a polyimide or a fluorinated polymer. The polymer is combined with a metal cation, the metal being a catalyst for a conventional electroless coating after which it is contacted with an electroless metal plating bath for the formation of electrical circuits and especially for plating high aspect ratio vias in microcircuits. Unlike the conventional electroless process, the cationic catalytic metal is not reduced to a zero valent metal catalyst prior to the application of the electroless metal coating solution.The process also improves the wettability of the polymer, especially the fluorinated polymer and is especially useful in improving the wettability of high aspect ratio vias.

摘要翻译： 公开了通过使聚合物与等离子体接触，然后与金属盐水溶液接触来制备金属 - 有机聚合物组合的方法。 在一个实施方案中，使用水或一氧化二氮等离子体来处理聚酰亚胺或含氟聚合物。 聚合物与金属阳离子结合，金属是用于常规化学镀的催化剂，之后与用于形成电路的无电金属电镀浴接触，特别是用于在微电路中电镀高纵横比通孔。 与常规的无电镀方法不同，在施加无电镀金属溶液之前，阳离子催化金属不会还原为零价金属催化剂。 该方法还提高聚合物，特别是氟化聚合物的润湿性，并且特别可用于改善高纵横比通孔的润湿性。

公开(公告)号：US5283104A

公开(公告)日：1994-02-01

申请号：US672272

申请日：1991-03-20

申请人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

发明人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

IPC分类号： H01B1/16 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K1/092 ,  H01B1/16 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/12472 ,  Y10T428/12556 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/2982 ,  Y10T428/2991

摘要： Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

摘要翻译： 用于在电路化陶瓷衬底，特别是多层衬底中产生导电通孔的改进的通孔填充组合物，不会破裂和/或失去气密密封。 通孔填充组合物包含含有（a）在约0.5和6（my）m之间的基本均匀直径的陶瓷和/或玻璃球的混合物的浆料，（b）具有最大尺寸或直径在 约为陶瓷和/或玻璃球直径的1/3和1/4，和（c）粘合剂载体。 形成的导电通孔体包括致密地包裹在共烧结陶瓷和/或玻璃球的均匀基质内的烧结金属颗粒的均匀导电骨架网络，该基质被气密地融合并与形成通孔壁的陶瓷层成一体 陶瓷电路基板。

公开(公告)号：US5173392A

公开(公告)日：1992-12-22

申请号：US863114

申请日：1992-04-03

申请人： Ekkehard F. Miersch ,  Jae M. Park

发明人： Ekkehard F. Miersch ,  Jae M. Park

IPC分类号： H01L21/48 ,  H05K3/04 ,  H05K3/06 ,  H05K3/10

CPC分类号： H05K3/045 ,  H01L21/4846 ,  H05K2201/0317 ,  H05K2203/0195 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K3/06 ,  H05K3/107

摘要： A pattern is formed on a substrate by providing on the substrate a dielectric composition; defining a pattern in said dielectric; depositing metal and then micromachining the metal to provide the desired pattern on the substrate.

摘要翻译： 通过在基板上设置电介质组合物，在基板上形成图案; 限定所述电介质中的图案; 沉积金属，然后微加工金属以在衬底上提供所需的图案。

公开(公告)号：US4869930A

公开(公告)日：1989-09-26

申请号：US218416

申请日：1988-07-12

申请人： Thomas C. Clarke ,  Caroline A. Kovac ,  Dae Y. Jung ,  Jae M. Park ,  Richard R. Thomas

发明人： Thomas C. Clarke ,  Caroline A. Kovac ,  Dae Y. Jung ,  Jae M. Park ,  Richard R. Thomas

IPC分类号： C23C16/04 ,  C23C16/18 ,  C23C18/16 ,  C23C18/30 ,  H05K3/14 ,  H05K3/18

CPC分类号： C23C16/04 ,  C23C16/18 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1865 ,  C23C18/1879 ,  C23C18/1893 ,  C23C18/2006 ,  C23C18/2033 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  H05K3/181 ,  H05K3/146 ,  H05K3/184

摘要： A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer. Volatile organopalladium compounds, such as (cyclopentadienyl)(allyl)palladium and bis(allyl)pallidium, are particularly effective for depositing a palladium seed which is particularly effective for electroless deposition of copper.

摘要翻译： 一种用于制备用于后续金属化的基底例如环氧印刷电路板的方法。 活性化学位点形成为粘附于基材表面。 然后将底物暴露于挥发性有机金属化合物的蒸气中，该挥发性有机金属化合物与活性位点发生化学反应并分解成化合物的至少一种金属成分。 该物质粘附到基底上并且可以转化成可用作种子的游离金属，用于随后在其上金属沉积金属。 如果需要选择性沉积，则在形成种子层之前使用抗蚀剂掩模层。 挥发性有机钯化合物，例如（环戊二烯基）（烯丙基）钯和双（烯丙基）吡喃）对于沉积对于无电沉积铜特别有效的钯种子是特别有效的。

公开(公告)号：US07659617B2

公开(公告)日：2010-02-09

申请号：US11606771

申请日：2006-11-30

申请人： Teck-Gyu Kang ,  Jae M. Park ,  Yoichi Kubota

发明人： Teck-Gyu Kang ,  Jae M. Park ,  Yoichi Kubota

IPC分类号： H01L23/34

CPC分类号： H01L23/4985 ,  B81B7/007 ,  B81B2207/097 ,  H01L23/057 ,  H01L23/49861 ,  H01L24/48 ,  H01L27/14678 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2201/2009 ,  H05K2203/0169 ,  H05K2203/1327 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Substrates having integrated rigid and flexible regions and methods of fabricating such substrates are disclosed. The substrates may advantageously be used for mounting semiconductor chips used in flexible microelectronic assemblies.

摘要翻译： 公开了具有集成的刚性和柔性区域的基板以及制造这种基板的方法。 衬底可以有利地用于安装用于柔性微电子组件中的半导体芯片。

公开(公告)号：US20090133254A1

公开(公告)日：2009-05-28

申请号：US12321210

申请日：2009-01-16

申请人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

发明人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

IPC分类号： H05K3/02

CPC分类号： H05K1/0366 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/06 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。

公开(公告)号：US20090008795A1

公开(公告)日：2009-01-08

申请号：US11825121

申请日：2007-07-02

申请人： Kenneth Allen Honer ,  Jae M. Park

发明人： Kenneth Allen Honer ,  Jae M. Park

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/3121 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49805 ,  H01L23/49861 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/81191 ,  H01L2224/81805 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15313 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacturing a microelectronic package. The method includes the steps of attaching at least one microelectronic element to a tape having upper terminals projecting upwardly from an upper surface of a dielectric layer, so that top surfaces of the terminals are disposed coplanar with or above a top surface of the microelectronic element after the attaching step, electrically connecting the microelectronic element to at least some of the upper terminals; and further includes the step of applying an encapsulant to cover at least a portion of the upper surface of the dielectric layer, leaving the upper terminals surfaces of the terminals exposed.

摘要翻译： 一种制造微电子封装的方法。 该方法包括以下步骤：将至少一个微电子元件附接到具有从电介质层的上表面向上突出的上端子的带，使得端子的顶表面设置为与微电子元件的顶表面共面或上方，在 所述附接步骤将所述微电子元件电连接到所述上端子中的至少一些; 并且还包括施加密封剂以覆盖电介质层的上表面的至少一部分的步骤，使端子的上端子表面露出。

公开(公告)号：US07053485B2

公开(公告)日：2006-05-30

申请号：US10640177

申请日：2003-08-13

申请人： Kyong-Mo Bang ,  Teck-Gyu Kang ,  Jae M. Park

发明人： Kyong-Mo Bang ,  Teck-Gyu Kang ,  Jae M. Park

IPC分类号： H01L23/04 ,  H01L23/544 ,  H01L23/34 ,  H05K1/00

CPC分类号： H01L23/3121 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/48 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package is made by a process which includes folding a substrate. Alignment elements on different parts of the substrate engage one another during the folding process to position the parts of the substrate precisely relative to one another. One or more of the alignment elements may be a mass of an overmolding encapsulant covering a chip.

摘要翻译： 微电子封装通过包括折叠衬底的工艺制成。 在折叠过程中，衬底的不同部分上的对准元件彼此接合，以便相对于彼此精确地定位衬底的部分。 一个或多个对准元件可以是覆盖芯片的包覆成型密封剂的质量。