公开(公告)号：US20050158527A1

公开(公告)日：2005-07-21

申请号：US11017778

申请日：2004-12-22

申请人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

发明人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

IPC分类号： G03G9/08 ,  B32B3/00 ,  G03G9/087 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L23/12 ,  H01L23/498 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  H05K3/24 ,  H05K3/46

CPC分类号： H05K3/246 ,  G03G15/6585 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2203/0517 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T428/12097 ,  Y10T428/12104 ,  Y10T428/12111 ,  Y10T428/24917 ,  H01L2924/00

摘要： According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided.

摘要翻译： 根据本发明的一种模式，含有含有50重量％以上的热固性树脂的树脂含水率为500〜14500ppm的含金属的树脂粒子和树脂中含有的微细金属粒子是 提供。

公开(公告)号：US20050153220A1

公开(公告)日：2005-07-14

申请号：US11017922

申请日：2004-12-22

申请人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

发明人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

IPC分类号： G03G15/22 ,  G03G15/20 ,  H01L21/00 ,  H05K1/16 ,  H05K3/10 ,  H05K3/12 ,  H05K3/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/46

CPC分类号： H05K3/207 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H05K3/1266 ,  H05K3/246 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0347 ,  H05K2203/0517

摘要： According to one mode of the present invention, a method of producing an electronic circuit, comprising forming an integrated resin layer having a prescribed thickness by repeating a resin layer forming process a number of times so that resin layers are layered to be integrated with all the resin layers on a substrate, wherein the resin forming process comprises charging the surface of a photoconductor; forming an electrostatic latent image having a prescribed pattern on the surface of the charged photoconductor; forming a visible image by electrostatically attaching charged particles composed of resin on the surface of the photoconductor on which the electrostatic latent image is formed; transferring the visible image formed on the surface of the photoconductor and composed of the charged particles onto the substrate; and fixing said visible image transferred onto said substrate on said substrate to form the resin layer on said substrate, is provided.

摘要翻译： 根据本发明的一个方式，一种电子电路的制造方法，其特征在于，通过重复树脂层形成工序多次来形成具有规定厚度的一体化树脂层，使树脂层层叠成与所有的 树脂层，其中所述树脂形成工艺包括对光电导体的表面进行充电; 在带电的感光体的表面上形成具有规定图案的静电潜像; 通过在其上形成有静电潜像的感光体的表面上静电附着由树脂构成的带电粒子来形成可见图像; 将形成在感光体的表面上的由带电粒子构成的可见图像转印到基板上; 并且将所述转印到所述基板上的所述可见图像固定在所述基板上，以在所述基板上形成树脂层。

公开(公告)号：US5394010A

公开(公告)日：1995-02-28

申请号：US849630

申请日：1992-03-12

申请人： Hiroshi Tazawa ,  Chiaki Takubo ,  Yoshiharu Tsuboi ,  Mamoru Sasaki

发明人： Hiroshi Tazawa ,  Chiaki Takubo ,  Yoshiharu Tsuboi ,  Mamoru Sasaki

IPC分类号： H01L23/34 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/00 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/18 ,  H05K3/34 ,  H01L23/02 ,  H01L23/12

CPC分类号： H01L23/3107 ,  H01L21/4842 ,  H01L23/49541 ,  H01L23/49555 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/181 ,  H05K3/3421

摘要： A semiconductor assembly comprises first and second containers which contain respective semiconductor chips and are stacked one over another. First and second external leads extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other. The first and the second containers may be provided at corresponding positions with a recess and a projection to be engaged each other for positional alignment. There may be provided first and second heat radiating plates extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other.

摘要翻译： 半导体组件包括第一和第二容器，其包含相应的半导体芯片并且彼此层叠。 从各个容器的内部延伸到其外部的第一和第二外部引线被弯曲以彼此连接。 第一和第二容器可以设置在相应的位置处，其中凹部和凸起彼此接合以进行位置对准。 可以提供从各个容器的内部延伸到其外侧的第一和第二散热板被弯曲以彼此连接。

公开(公告)号：US5220486A

公开(公告)日：1993-06-15

申请号：US757523

申请日：1991-09-11

申请人： Chiaki Takubo ,  Hiroshi Tazawa ,  Yoshiharu Tsuboi

发明人： Chiaki Takubo ,  Hiroshi Tazawa ,  Yoshiharu Tsuboi

IPC分类号： H01L21/60 ,  H01L23/433 ,  H01L23/495

CPC分类号： H01L24/50 ,  H01L23/4334 ,  H01L23/49524 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011

摘要： An IC packing device comprises a semiconductor device, a piece of flexible resin film provided with an opening for receiving the semiconductor, wires arranged on the piece of flexible resin film and slits cut into the piece of film from the edges of the opening. The slits cut into the flexible resin film allow the film to be flexed downward toward the semiconductor, along with the wires which to establish electrical connection with the semiconductor. In this manner, the downwardly bent flexible film provides reduction in the possibility of a wire breaking due to excessive bending of the wire in order to make contact with the semiconductor.

摘要翻译： IC封装装置包括：半导体器件，设置有用于接收半导体的开口的柔性树脂膜，布置在柔性树脂膜片上的布线和从开口边缘切入薄膜的狭缝。 切入柔性树脂膜的狭缝允许膜向与半导体建立电连接的导线朝向半导体向下弯曲。 以这种方式，向下弯曲的柔性膜提供了由于导线的过度弯曲导致线断裂的可能性，以便与半导体接触。

公开(公告)号：US08426977B2

公开(公告)日：2013-04-23

申请号：US12539037

申请日：2009-08-11

申请人： Kazumasa Tanida ,  Hideko Mukaida ,  Susumu Harada ,  Chiaki Takubo

发明人： Kazumasa Tanida ,  Hideko Mukaida ,  Susumu Harada ,  Chiaki Takubo

IPC分类号： H01L23/48

CPC分类号： H01L27/14618 ,  H01L23/481 ,  H01L24/13 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor apparatus includes, a semiconductor substrate having first and second main surfaces and a through hole connecting the first and second main surfaces; a first insulation layer arranged on the first main surface, and having an opening corresponding to the through hole; a first conductive layer arranged on the first insulation layer, and covering the through hole; a second insulation layer arranged on an inner wall of the through hole and the second surface; a second conductive layer arranged in the through hole and on the second insulation layer, the second conductive layer contacting the first conductive layer; and a filling member arranged on the second conductive layer in the through hole, and having a gap between the second conductive layer on the first main surface side.

摘要翻译： 半导体装置包括具有第一和第二主表面的半导体衬底和连接第一和第二主表面的通孔; 布置在所述第一主表面上并具有与所述通孔对应的开口的第一绝缘层; 布置在所述第一绝缘层上并覆盖所述通孔的第一导电层; 布置在所述通孔的内壁和所述第二表面上的第二绝缘层; 布置在所述通孔中和所述第二绝缘层上的第二导电层，所述第二导电层与所述第一导电层接触; 以及填充构件，其布置在所述通孔中的所述第二导电层上，并且在所述第一主表面侧上的所述第二导电层之间具有间隙。

公开(公告)号：US20090007426A1

公开(公告)日：2009-01-08

申请号：US12230280

申请日：2008-08-27

申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

IPC分类号： H05K3/10

CPC分类号： H05K3/207 ,  G03G15/6591 ,  G03G2215/00523 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/09781 ,  H05K2203/0517 ,  H05K2203/105 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An image forming apparatus comprises an exposure unit forming an electrostatic latent image on a photo conductor based on image information, a developing unit developing the electrostatic latent image by toner made of formation material of a circuitry layer, and an electrostatic transferring unit transferring a toner image on the photo conductor onto a substrate. The toner image is transferred so as to cover at least a part of a conductor layer formed on the substrate. At this time, excessive charges caused in the conductor layer accompanying the start of the transfer of the toner image are removed. Alternatively, charges of which polarity is reverse to that of the toner are added to the conductor layer. These allow the circuitry layer to be formed to have a desired pattern favorably and securely on the conductor layer.

摘要翻译： 图像形成装置包括基于图像信息在光导体上形成静电潜像的曝光单元，通过电路层的形成材料制成的调色剂来显影静电潜像的显影单元和转印调色剂图像的静电转印单元 在光导体上的基片上。 转印调色剂图像以覆盖形成在基板上的导体层的至少一部分。 此时，伴随着调色剂图像的转印开始导致的导体层中引起的过多的电荷被去除。 或者，将与该调色剂相反极性的电荷加到导体层中。 这些允许电路层形成为在导体层上有利地并且牢固地具有期望的图案。

公开(公告)号：US07469941B2

公开(公告)日：2008-12-30

申请号：US11580849

申请日：2006-10-16

申请人： Hideo Aoki ,  Chiaki Takubo ,  Naoko Yamaguchi

发明人： Hideo Aoki ,  Chiaki Takubo ,  Naoko Yamaguchi

IPC分类号： H05K3/02 ,  B05D5/12

CPC分类号： H05K3/246 ,  H05K1/095 ,  H05K3/102 ,  H05K3/4661 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0347 ,  H05K2203/121 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917

摘要： A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.

摘要翻译： 布线板包括基板; 树脂层，其被选择性地形成在基板的一个主表面上，并且具有包含或粘附到其表面的细金属颗粒; 以及形成在树脂层上的导电金属层，其间插入有金属微粒。

公开(公告)号：US20070196956A1

公开(公告)日：2007-08-23

申请号：US11712373

申请日：2007-03-01

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L21/00 ,  H01L21/302

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US07202563B2

公开(公告)日：2007-04-10

申请号：US11088879

申请日：2005-03-25

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L23/34 ,  H01L23/31

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US20050191511A1

公开(公告)日：2005-09-01

申请号：US11018473

申请日：2004-12-22

申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo

发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo

IPC分类号： H01L21/288 ,  B32B15/08 ,  H05K1/09 ,  H05K3/10 ,  H05K3/20

CPC分类号： H05K3/207 ,  H05K1/095 ,  H05K3/1266 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2203/0517 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/256 ,  Y10T428/2991 ,  Y10T428/2998

摘要： Provided is metal-containing resin particle for forming a conductor pattern in which the metal particles are dispersed in a resin matrix, and the content of the metal particles is 70 wt % or less.

摘要翻译： 本发明提供用于形成金属颗粒分散在树脂基体中的金属的树脂颗粒，并且金属颗粒的含量为70重量％以下。