公开(公告)号：US4562131A

公开(公告)日：1985-12-31

申请号：US607200

申请日：1984-05-04

申请人： Osamu Sasaki ,  Naohiro Hirose ,  Kiyoshi Sawada

发明人： Osamu Sasaki ,  Naohiro Hirose ,  Kiyoshi Sawada

IPC分类号： C09B33/24 ,  C09B35/378 ,  G03G5/06

CPC分类号： G03G5/06 ,  C09B35/378 ,  G03G5/069 ,  G03G5/0692

摘要： A photoreceptor is disclosed which comprises a photosensitive layer and an electrically conductive support. Said photosensitive layer contains a carrier generation material and a carrier transport material, said carrier generation material being a trisazo compound of the present invention, or said photosensitive layer may consist of a carrier generation layer containing said trisazo compound and a carrier transport layer containing said carrier transport material with or without an intermediate layer being provided between said support and said photosensitive layer.

摘要翻译： 公开了一种感光体，其包含感光层和导电支撑体。 所述感光层含有载体生成材料和载流子传输材料，所述载体产生材料是本发明的三偶氮化合物，或所述感光层可以由含有所述三偶氮化合物的载体产生层和含有所述载体的载流子传输层组成 具有或不具有中间层的运输材料设置在所述支撑件和所述感光层之间。

公开(公告)号：US08282720B2

公开(公告)日：2012-10-09

申请号：US12647644

申请日：2009-12-28

申请人： Natsuko Kusaka ,  Naohiro Hirose ,  Hiroyuki Yasukawa

发明人： Natsuko Kusaka ,  Naohiro Hirose ,  Hiroyuki Yasukawa

IPC分类号： C09D11/02 ,  C09B47/04

CPC分类号： C09B69/008 ,  C09D11/322

摘要： A cyan ink for inkjet recording comprising at least one of a phthalocyanine compound represented by Formula (1) and a phthalocyanine compound represented by Formula (2), Z being represented by Formula (3):

摘要翻译： 一种用于喷墨记录的青色油墨，其包含由式（1）表示的酞菁化合物和由式（2）表示的酞菁化合物中的至少一种，Z由式（3）表示：

公开(公告)号：US20120125680A1

公开(公告)日：2012-05-24

申请号：US13357663

申请日：2012-01-25

申请人： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

发明人： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC分类号： H05K1/02 ,  C25D5/02 ,  B23K1/20 ,  B23K31/02 ,  H05K3/46 ,  C25D7/00

CPC分类号： H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

摘要翻译： 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以防止通孔的连接的可靠性。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US08035214B1

公开(公告)日：2011-10-11

申请号：US09830949

申请日：1999-11-17

申请人： Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

发明人： Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K1/111 ,  H05K1/112 ,  H05K3/28 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T428/239

摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

摘要翻译： 一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。 导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

公开(公告)号：US07827680B2

公开(公告)日：2010-11-09

申请号：US10751428

申请日：2004-01-06

申请人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

发明人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

IPC分类号： H05K3/20

CPC分类号： H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10-12 seconds.

摘要翻译： 描述了对导电基板进行电镀的电镀工艺。 该工艺包括通过在阴极和阳极之间重复施加电压并使阴极和阳极之间的电压中断，在阳极和阴极之间以恒定电压将衬底表面作为阴极和电镀金属作为阳极间歇地电镀到预定的镀层厚度 交替应用。 描述了电压时间/中断时间比为0.1至1.0，电压时间不长于10秒，并且中断时间不小于1×10-12秒。

公开(公告)号：US07691189B2

公开(公告)日：2010-04-06

申请号：US11736495

申请日：2007-04-17

申请人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

发明人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

IPC分类号： C23C18/40 ,  B05D1/18

CPC分类号： H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

摘要翻译： 本发明涉及一种制造多层印刷电路板的方法，该印刷电路板能够同时通孔填充和形成导体电路和具有良好结晶度的通孔，并且可以在基板和高密度布线上构造均匀的沉积 并且可以实现高可靠性的导体连接而不退火。

公开(公告)号：US20090285531A1

公开(公告)日：2009-11-19

申请号：US12494790

申请日：2009-06-30

申请人： Naohiro Hirose

发明人： Naohiro Hirose

IPC分类号： G02B6/30 ,  G02B6/26

CPC分类号： G02B6/3636 ,  C03C25/105 ,  C03C25/68 ,  G02B6/138 ,  G02B6/241 ,  G02B6/3652 ,  G02B6/4202

摘要： An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide.The optical transmission structural body of the present invention is constituted so that at least an optical wiring and an optical waveguide are connected to each other and an optical signal can be transmitted between a core of the optical wiring and a core part of the optical waveguide, wherein a portion of the optical wiring, the portion being connected to the core part of the optical waveguide, is not specially subjected to a planarization processing or has a surface roughness Ra based on JIS B 0601 of 0.1 μm or more.

摘要翻译： 本发明的目的是提供一种光传输结构体，其能够优选地在光布线和光波导之间传输光信号，而与光布线的一部分的形状无关，该部分连接到光布线的核心部分 光波导。 本发明的光传输结构体构成为至少使光配线和光波导彼此连接，并且可以在光布线的芯和光波导的芯部之间传输光信号， 其中，所述光布线的与所述光波导的芯部连接的部分没有特别地进行平坦化处理，或者基于JIS B 0601的表面粗糙度Ra为0.1μm以上。

公开(公告)号：US20070266886A1

公开(公告)日：2007-11-22

申请号：US11736495

申请日：2007-04-17

申请人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

发明人： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

IPC分类号： C09D5/00

CPC分类号： H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.

摘要翻译： 本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔 并且可以实现高可靠性的导体连接而不退火。 本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属 层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀 以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。

公开(公告)号：US06613986B1

公开(公告)日：2003-09-02

申请号：US09787321

申请日：2001-05-17

申请人： Naohiro Hirose ,  Honjin En

发明人： Naohiro Hirose ,  Honjin En

IPC分类号： H05K103

CPC分类号： H01L29/40 ,  H01L21/4763 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/03 ,  H05K3/064 ,  H05K3/244 ,  H05K3/382 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/09681 ,  H05K2203/1178

摘要： Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 &mgr;m. The reason is as follows. If the diameter of the mesh hole is less than 75 &mgr;m, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 &mgr;m, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 &mgr;m. The reason is as follows. If the distance is less than 100 &mgr;m, the solid layer cannot function. If the distance exceeds 2000 &mgr;m, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

公开(公告)号：US06609297B1

公开(公告)日：2003-08-26

申请号：US09581298

申请日：2000-06-12

申请人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

发明人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

IPC分类号： H01K310

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10S430/146 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the position of the board 30 is determined. A laser beam is directed to the approximate position of the opening 30a, so that the opening 26a through which the via hole is drilled is formed. The accuracy of the position of the opening of the via hole depends on the accuracy of the position of the opening 30a in the Cu film 30 as the conformal mask. Therefore, the via hole can be formed at an adequate position despite the low accuracy of the position for laser irradiation.

摘要翻译： 板20设置有作为保形掩模的Cu膜30，其中形成有对准标记30b和形成通孔的开口3a。 摄像机感测该对准标记30b，从而确定板30的位置。 激光束被引导到开口30a的近似位置，从而形成通孔穿过的开口26a。 通孔的开口的位置的精度取决于作为保形掩模的Cu膜30中的开口30a的位置的精度。 因此，尽管激光照射位置的精度低，但是通孔可以形成在适当的位置。