公开(公告)号：US09929128B1

公开(公告)日：2018-03-27

申请号：US15492617

申请日：2017-04-20

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Li-Hui Cheng ,  Po-Hao Tsai ,  Jing-Cheng Lin ,  Yi-Hang Lin

IPC分类号： H01L23/48 ,  H01L25/10 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

CPC分类号： H01L25/105 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0105 ,  H01L2924/14

摘要： A chip package structure is provided. The chip package structure includes a redistribution structure. The chip package structure includes a first chip over the redistribution structure. The first chip has a front surface and a back surface opposite to the front surface, and the front surface faces the redistribution structure. The chip package structure includes an adhesive layer on the back surface. The adhesive layer is in direct contact with the back surface, and a first maximum length of the adhesive layer is less than a second maximum length of the first chip. The chip package structure includes a molding compound layer over the redistribution structure and surrounding the first chip and the adhesive layer. A first top surface of the adhesive layer is substantially coplanar with a second top surface of the molding compound layer.

公开(公告)号：US12057432B2

公开(公告)日：2024-08-06

申请号：US16933593

申请日：2020-07-20

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Po-Hao Tsai ,  Li-Hui Cheng ,  Jui-Pin Hung ,  Jing-Cheng Lin

IPC分类号： H01L23/00 ,  H01L21/3105 ,  H01L21/311 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/31 ,  H01L23/538

CPC分类号： H01L24/96 ,  H01L21/31053 ,  H01L21/311 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/02205 ,  H01L2224/0231 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13026 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/0549 ,  H01L2924/07025 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/1032 ,  H01L2924/12042 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/3512 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00

摘要： A package includes a first die and a second die. The first die includes a first substrate and a first metal pad overlying the first substrate. The second die includes a second substrate and a second metal pad overlying the second substrate. A molding compound molds the first die and the second die therein. The molding compound has a first portion between the first die and the second die, and a second portion, which may form a ring encircles the first portion. The first portion and the second portion are on opposite sides of the first die. The first portion has a first top surface. The second portion has a second top surface higher than the first top surface.

公开(公告)号：US20240071847A1

公开(公告)日：2024-02-29

申请号：US17822470

申请日：2022-08-26

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yi-Huan Liao ,  Ping-Yin Hsieh ,  Chih-Hao Chen ,  Pu Wang ,  Li-Hui Cheng ,  Ying-Ching Shih

IPC分类号： H01L23/10 ,  H01L21/52 ,  H01L21/56 ,  H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538

CPC分类号： H01L23/10 ,  H01L21/52 ,  H01L21/56 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/562 ,  H01L24/32 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29172 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81466 ,  H01L2224/81484 ,  H01L2224/83447 ,  H01L2224/83455

摘要： A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

公开(公告)号：US11830821B2

公开(公告)日：2023-11-28

申请号：US17150300

申请日：2021-01-15

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-Hao Chen ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/214 ,  H01L2225/0651 ,  H01L2225/1035 ,  H01L2225/1058

摘要： Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.

公开(公告)号：US20230378017A1

公开(公告)日：2023-11-23

申请号：US17891634

申请日：2022-08-19

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Ying-Ching Shih ,  Hung-Yu Chen

IPC分类号： H01L23/367 ,  H01L25/065 ,  H01L23/42 ,  H01L23/373 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L23/367 ,  H01L25/0652 ,  H01L23/42 ,  H01L23/3736 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3157 ,  H01L2224/16145 ,  H01L24/16

摘要： An embodiment is a device including a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a first side of the package component. The device also includes a metal layer on a second side of the package component, the second side being opposite the first side. The device also includes a thermal interface material on the metal layer. The device also includes a lid on the thermal interface material. The device also includes a retaining structure on sidewalls of the package component and the thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.

公开(公告)号：US20230317552A1

公开(公告)日：2023-10-05

申请号：US18328387

申请日：2023-06-02

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-Hao Chen ,  Hung-Yu Chen ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L23/373 ,  H01L21/48 ,  H01L23/04 ,  H01L23/31 ,  H01L23/40

CPC分类号： H01L23/3737 ,  H01L21/4882 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/4006 ,  H01L2023/4087

摘要： A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

公开(公告)号：US20230052821A1

公开(公告)日：2023-02-16

申请号：US17980914

申请日：2022-11-04

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-Chien Pan ,  Li-Hui Cheng ,  Chin-Fu Kao ,  Szu-Wei Lu

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/306 ,  H01L21/304 ,  H01L21/78 ,  H01L21/56 ,  H01L25/065

摘要： In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.

公开(公告)号：US20220359339A1

公开(公告)日：2022-11-10

申请号：US17381952

申请日：2021-07-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L23/367 ,  H01L25/10 ,  H01L23/498 ,  H01L23/373 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00

摘要： A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.

公开(公告)号：US20220359331A1

公开(公告)日：2022-11-10

申请号：US17869003

申请日：2022-07-20

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-Chien Pan ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L23/31 ,  H01L25/065 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

摘要： A method of forming a semiconductor device includes attaching a first semiconductor device to a first surface of a substrate; forming a sacrificial structure on the first surface of the substrate around the first semiconductor device, the sacrificial structure encircling a first region of the first surface of the substrate; and forming an underfill material in the first region.

公开(公告)号：US11488843B2

公开(公告)日：2022-11-01

申请号：US17007679

申请日：2020-08-31

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Jing-Cheng Lin ,  Li-Hui Cheng ,  Po-Hao Tsai

IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L23/48 ,  H01L21/00 ,  H05K7/00 ,  H05K7/14 ,  H01L21/56 ,  H01L23/538 ,  H01L23/367 ,  H01L23/31 ,  H01L25/11 ,  H01L21/48 ,  H01L25/00 ,  H01L23/00 ,  H01L23/42 ,  H01L23/373 ,  H01L21/683

摘要： A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an encapsulating material, performing a planarization on the encapsulating material to expose the device, detaching the device and the encapsulating material from the carrier, etching the die-attach film to expose a back surface of the device, and applying a thermal conductive material on the back surface of the device.