公开(公告)号：US20160307700A1

公开(公告)日：2016-10-20

申请号：US15096571

申请日：2016-04-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK

IPC: H01G2/06 ,  H05K1/18 ,  H01G4/012 ,  H01G4/248 ,  H01G4/30 ,  H01G4/12

CPC classification number: H01G2/065 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0271 ,  H05K3/301 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A capacitor component includes a capacitor including a plurality of internal electrodes, a capacitor body containing a piezoelectric material formed in a region between adjacent electrodes among the plurality of internal electrodes, and external electrodes connected to the plurality of internal electrodes; and support parts formed of a metal and disposed to be coupled to the capacitor and having an annular shape to alleviate vibrations generated by the capacitor.

Abstract translation: 电容器部件包括：电容器，包括多个内部电极;电容器主体，包含形成在所述多个内部电极中的相邻电极之间的区域中的压电材料;以及外部电极，连接到所述多个内部电极; 以及由金属形成并被设置成耦合到电容器并且具有环形形状以支持由电容器产生的振动的支撑部分。

公开(公告)号：US20140317896A1

公开(公告)日：2014-10-30

申请号：US14204455

申请日：2014-03-11

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Rikihiro MARUYAMA ,  Kenshi KAI ,  Nobuyuki KANZAWA ,  Mitsutoshi SAWANO

IPC: H05K3/30

CPC classification number: H05K3/301 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/303 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.

Abstract translation: 半导体器件的制造方法使用具有绝缘电路板定位夹具的安装夹具，具有形成在预定位置上的多个定位孔的管状接触元件定位夹具，以插入管状接触元件，以及管状接触元件压入 夹具 通过绝缘电路板定位夹具和管状接触元件定位夹具，绝缘电路板和管状接触元件被定位，并且管状接触元件被焊接到绝缘电路板，​​同时被管状接触元件压下 夹具

公开(公告)号：US07273380B2

公开(公告)日：2007-09-25

申请号：US11657995

申请日：2007-01-25

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环都焊接到基板和设备。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US20040048498A1

公开(公告)日：2004-03-11

申请号：US10634332

申请日：2003-08-04

Inventor： Hong Huang ,  Allan Mark

IPC: H05K001/00

CPC classification number: H01R12/57 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/10257 ,  Y02P70/613

Abstract: The present invention provides a metallic power connector for PCB-to-PCB attachment using surface mount technology. The connector has a cross section that is in the shape of a hollow trapezoid. Parallel sides of the trapezoid are adapted for connecting to contact pads on the PCBs with differently shaped footprints. The non-parallel sides of the trapezoid provide structural stability and rigidity not found in prior art SMT connectors. The inventive metallic SMT power connector allows for power and heat flow from a first PCB to a second PCB, and is compatible with automated SMT processes.

Abstract translation: 本发明提供一种使用表面贴装技术的用于PCB到PCB连接的金属电源连接器。 连接器具有中空梯形形状的横截面。 梯形的平行侧适用于连接到具有不同形状印迹的PCB上的接触焊盘。 梯形的非平行边提供了现有技术的SMT连接器中没有发现的结构稳定性和刚性。 本发明的金属SMT电源连接器允许从第一PCB到第二PCB的功率和热量流动，并且与自动化SMT工艺兼容。

公开(公告)号：US20030051909A1

公开(公告)日：2003-03-20

申请号：US10032478

申请日：2002-01-02

Inventor： Sang-Young Kim ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Seung-Kon Mok

IPC: H01L023/48

CPC classification number: H01L24/10 ,  B23K1/0008 ,  B23K35/0222 ,  B23K35/0244 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12014 ,  Y10T428/12222 ,  H01L2224/29099 ,  H01L2924/00

Abstract: An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an array of annular conductive pads and the other planar element having either a corresponding array of annular or circular conductive pads, separated by an array of spherical solder balls comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

Abstract translation: 一种焊料结构的阵列，包括多个径向弯曲的外表面，每个包围预定尺寸的空腔，其可以用于在预定的导电接触点处将两个具有不同特性的平面元件柔性地接合在一起。 通过以分层布置组装两个平面元件，一个平面元件具有环形导电焊盘的阵列，另一个平面元件具有相应的环形或圆形导电焊盘阵列，由阵列的球形焊球组成，焊球包括焊料和 可以在焊料化合物的熔化和随后的冷却期间产生助熔剂，中空焊料结构。 所得中空焊料结构的可塑性/弹性特性吸收两个平面元件相对于彼此的横向移动，而不会降低焊接接头。

公开(公告)号：US06307159B1

公开(公告)日：2001-10-23

申请号：US09188203

申请日：1998-11-09

Applicant: Koji Soejima ,  Naoji Senba

Inventor： Koji Soejima ,  Naoji Senba

IPC: H01R909

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1111 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.

Abstract translation: 公开了一种凸块结构，其具有中空体，用于电连接第一构件和第二构件。 还公开了一种制造凸块结构的方法，其具有以下步骤：制备具有凹模的模制板以模制凸块形成构件; 形成导电薄膜，以在模板的凹模中形成预定的空腔; 准备要传输导电薄膜的基板; 以及将形成在所述成型板上的导电性薄膜转移到所述基板。

公开(公告)号：US06298551B1

公开(公告)日：2001-10-09

申请号：US09459586

申请日：1999-12-13

Applicant: Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

Inventor： Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

IPC: H05K336

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10S438/94 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

Abstract translation: 界面包括具有导电垫的表面; 表面上的柔顺涂层具有延伸到垫的通孔; 金属化图案化在柔性涂层上并延伸到通孔中; 覆盖顺应性涂层并具有延伸到金属化的界面的低模量介电界面层; 以及浮动衬垫结构，其包括在电介质界面层上图案化的浮动衬垫金属化，第一部分形成中心焊盘，第二部分形成从延伸到接口通孔的中心焊盘的延伸部分。 另一个界面包括一个衬底，该衬底包括一个具有至少部分贯穿其中延伸的孔的低模量介电界面材料，以及一个浮动接触结构，其包括导电材料，该导电材料涂覆孔，浮动金属化中的至少一些从孔形成延伸。 导电接触区界面可以包括导电的第一接触区域; 面向并基本上与第一接触区域对准的导电的第二接触区域; 以及耦合在所述第一和第二接触区域之间的至少一个接口结构，并且包括具有部分敞开的内部的电导体，以在所述第一和第二接触区域之间形成柔性接头。

公开(公告)号：US6059579A

公开(公告)日：2000-05-09

申请号：US936240

申请日：1997-09-24

Applicant: John S. Kresge ,  Scott P. Moore ,  Robin A. Susko ,  James W. Wilson

Inventor： John S. Kresge ,  Scott P. Moore ,  Robin A. Susko ,  James W. Wilson

IPC: H01R13/24 ,  H05K3/34 ,  H01R9/09

CPC classification number: H01R13/2414 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10257 ,  H05K2201/10378 ,  Y02P70/613

Abstract: An assembly and process for connecting opposed semiconductor structures (12,14) comprising at least two structures. An interconnect (16) between the structures (12,14) connects the structures in opposed spaced relation to each other. The interconnect comprises a first material (18) and a second material (20). The first material comprises a resiliently flexible center portion. The second material comprises an electrically conductive outer portion surrounding the first material. The second material and the first material provide the interconnect with a flexibly compliant characteristic for maintaining an electrically conductive relationship between the structures.

Abstract translation: 一种用于连接包括至少两个结构的相对的半导体结构（12,14）的组件和工艺。 结构（12,14）之间的互连（16）将结构以相互间隔开的关系彼此连接。 互连件包括第一材料（18）和第二材料（20）。 第一材料包括弹性柔性中心部分。 第二材料包括围绕第一材料的导电外部部分。 第二材料和第一材料为互连提供了柔性柔顺特性，用于维持结构之间的导电关系。

公开(公告)号：US20180084636A1

公开(公告)日：2018-03-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. PAKULA ,  Daniel W. JARVIS ,  Gregory N. STEPHENS ,  Ian A. SPRAGGS ,  Vu Thanh VO ,  Amir SALEHI ,  Dennis R. PYPER ,  Alex J. CRUMLIN ,  Corey S. PROVENCHER ,  Derek J. WALTERS ,  Michael V. YEH

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K7/20481 ,  B32B2307/302 ,  B32B2457/20 ,  G06F1/1637 ,  G06F1/1643 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04112 ,  H01M2/08 ,  H01M2/1016 ,  H01M2/1022 ,  H01M2220/30 ,  H02J7/0042 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/148 ,  H05K7/20963 ,  H05K9/0033 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10257

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

公开(公告)号：US20180042111A1

公开(公告)日：2018-02-08

申请号：US15231438

申请日：2016-08-08

Applicant: BAKER HUGHES INCORPORATED

Inventor： Rocco DIFOGGIO ,  Otto N. FANINI ,  Paul G. CAIRNS ,  Brian D. BREAUX ,  Benjamin TODD

IPC: H05K1/18 ,  G01V3/18 ,  E21B49/00 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K1/0056 ,  B23K26/18 ,  B33Y10/00 ,  E21B47/011 ,  E21B49/00 ,  G01V3/18 ,  H05K1/113 ,  H05K3/325 ,  H05K3/341 ,  H05K2201/10151 ,  H05K2201/10257 ,  H05K2201/10295 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10628 ,  H05K2203/107

Abstract: Methods, systems, devices, and products for manufacturing an electrical assembly, such as a completed downhole circuit board, for use in well logging. Methods include attaching an electrical component to a printed circuit board by mechanically fastening the electrical component to the printed circuit board. Methods may include using a laser to attach a plurality of legs to contact surfaces. Methods may include applying light from the laser to a material of the printed circuit board to produce heat, including mitigating reflection of the light from the material. Methods include forming a connection between a first electrical component of the electrical assembly and a second electrical component of the electrical assembly by causing heating of an additive manufacturing material by applying light from a laser. The connection may be at least one of: i) an electrical connection; ii) a structural connection; iii) an electrical insulation.