公开(公告)号：US20090242245A1

公开(公告)日：2009-10-01

申请号：US12412693

申请日：2009-03-27

Applicant: Toshiya Asano

Inventor： Toshiya Asano

IPC: H05K1/03 ,  H05K13/00

CPC classification number: H05K3/303 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/0064 ,  H05K3/025 ,  H05K3/3436 ,  H05K3/4644 ,  H05K2201/10318 ,  H05K2201/10424 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2224/05599

Abstract: A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; a solder resist which covers the rear surface and which has solder resist openings formed at positions corresponding to the second terminals; a reinforcing plate which is made of a non-metal material and which has reinforcing plate openings formed at positions corresponding to the second terminals; and an adhesive layer interposed between the solder resist and the reinforcing plate to fix the reinforcing plate to the solder resist and which includes adhesive layer openings formed at positions corresponding to the second terminals. A diameter of the solder resist openings and a diameter of the reinforcing plate openings are smaller than that of the adhesive layer openings.

Abstract translation: 没有芯基板的多层布线板包括：多层层叠结构; 设置在所述多层层叠结构的前表面上的第一端子; 设置在所述多层层叠结构的后表面上的第二端子; 覆盖后表面的阻焊剂，并且在与第二端子对应的位置上形成阻焊剂开口; 加强板，其由非金属材料制成，并且在对应于第二端子的位置处形成有加强板开口; 以及插入在阻焊剂和加强板之间的粘合剂层，以将加强板固定到阻焊剂上，并且包括形成在对应于第二端子的位置处的粘合剂层开口。 阻焊剂开口的直径和加强板开口的直径小于粘合剂层开口的直径。

公开(公告)号：US20090135571A1

公开(公告)日：2009-05-28

申请号：US12037289

申请日：2008-02-26

Applicant: Chih-Hung Chiang ,  Kai-Hung Huang

Inventor： Chih-Hung Chiang ,  Kai-Hung Huang

IPC: H05K1/11 ,  H01R12/00

CPC classification number: H01R12/57 ,  H01R12/7082 ,  H01R12/718 ,  H05K1/141 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/1084 ,  H05K2201/2036 ,  H05K2203/1178 ,  Y02P70/613

Abstract: The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first end part and a second end part. The first end part is bonded onto the first circuit board. The second end part has a sidewall and a receptacle defined within the sidewall for receiving a solder bump therein. The solder bump is partially protruded from the sidewall and bonded onto the second circuit board such that the first circuit board and the second circuit board are electrically connected to each other.

Abstract translation: 本发明涉及一种用于电连接第一电路板和第二电路板的表面安装连接器。 表面安装连接器包括第一端部和第二端部。 第一端部被接合到第一电路板上。 第二端部具有侧壁和限定在侧壁内的容器，用于在其中容纳焊料凸块。 焊料凸起部分地从侧壁突出并且接合到第二电路板上，使得第一电路板和第二电路板彼此电连接。

公开(公告)号：US20090095518A1

公开(公告)日：2009-04-16

申请号：US12245025

申请日：2008-10-03

Applicant: Yoshitaka Matsushita ,  Kazuhiro Oshima ,  Akio Horiuchi

Inventor： Yoshitaka Matsushita ,  Kazuhiro Oshima ,  Akio Horiuchi

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/284 ,  H01L21/481 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49861 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K2201/09136 ,  H05K2201/10318 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y10T29/49124

Abstract: A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.

Abstract translation: 布线板具有布线构件，第一加强构件和第二加强构件。 布线构件具有层叠的布线层和绝缘层，并且布线层包括形成在布线构件的表面上的第一连接电极和形成在布线构件的背面上的第二连接电极。 销形成在第二连接电极上。 第二加强构件由树脂形成，用于加强布线构件。 除了设置在第二连接电极上的销之外，第一加强构件形成在布线构件的整个背面上。

公开(公告)号：US20090086455A1

公开(公告)日：2009-04-02

申请号：US12239407

申请日：2008-09-26

Applicant: Hideyuki SAKAMOTO ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

Inventor： Hideyuki SAKAMOTO ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC: H05K7/06 ,  H05K3/36

CPC classification number: H05K1/144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K7/1432 ,  H05K2201/042 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10689 ,  H05K2201/2018 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.

Abstract translation: 提供了一种电路装置，其中并入的电路元件经由引线彼此电连接，以便实现增强的功能和小型化两者。 在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式结合到壳体构件中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 在混合集成电路装置中提供的引线包括仅连接到安装在第一电路板上的第一电路元件的引线，仅连接到安装在第二电路板上的第二电路元件的引线，以及连接到第一 电路元件和第二电路元件。

公开(公告)号：US20090053459A1

公开(公告)日：2009-02-26

申请号：US12257501

申请日：2008-10-24

Applicant: Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

Inventor： Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

IPC: B32B1/04

CPC classification number: H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K1/111 ,  H05K1/112 ,  H05K3/28 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T428/239

Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

公开(公告)号：US20090047027A1

公开(公告)日：2009-02-19

申请号：US12188132

申请日：2008-08-07

Applicant: Jinxiang Liu ,  Tat Ming Teo

Inventor： Jinxiang Liu ,  Tat Ming Teo

IPC: H04B10/00

CPC classification number: H05K1/141 ,  H05K1/0219 ,  H05K1/0237 ,  H05K2201/042 ,  H05K2201/10318

Abstract: Systems and method for using a direct connect RF pin configuration for an ONU transceiver module to connect directly to an external component. The ONU module communicates with an optical network. The ONU module further includes an RF interface and a direct connect RF pin configuration to communicate using RF signals. In one embodiment, the direct connect RF pin configuration includes two ground pins and a data pin which are spaced apart and directly connected to a PCB of the ONU. The opposing ends of the pins are directly connected to a PCB of an external component, such as an ONU host box. The pins are thus spaced apart such that they do not impede each others' function and available for direct connection to the external component.

Abstract translation: 使用直接连接RF引脚配置的ONU收发器模块直接连接到外部组件的系统和方法。 ONU模块与光网络通信。 ONU模块还包括RF接口和直接连接RF引脚配置以使用RF信号进行通信。 在一个实施例中，直接连接RF引脚配置包括间隔开并直接连接到ONU的PCB的两个接地引脚和数据引脚。 引脚的相对端直接连接到诸如ONU主机盒的外部组件的PCB。 因此，引脚间隔开，使得它们不会妨碍彼此的功能并且可用于直接连接到外部部件。

公开(公告)号：US20080272481A1

公开(公告)日：2008-11-06

申请号：US11800223

申请日：2007-05-04

Applicant: Rajendra Dias ,  Xinyan Zhao

Inventor： Rajendra Dias ,  Xinyan Zhao

IPC: H01L23/48

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/1084 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrically conductive pin comprising a pin stem and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head defines at least one slot therein, the at least one slot being configured to allow gases to escape therethrough from a region at an underside of the pin head.

Abstract translation: 导电销，其包括销杆和连接到销杆的销头。 针头适于安装在微电子衬底的表面上以支撑销杆。 销头在其中限定至少一个狭槽，所述至少一个狭槽被构造成允许气体从销头的下侧的区域从其中排出。

公开(公告)号：US07422449B2

公开(公告)日：2008-09-09

申请号：US11351028

申请日：2006-02-09

Applicant: Kazuhiko Ide ,  Hiroyuki Motoda ,  Yoshinori Furihata

Inventor： Kazuhiko Ide ,  Hiroyuki Motoda ,  Yoshinori Furihata

IPC: H01R12/00

CPC classification number: H01R43/0256 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring board with lead pins having high reliability is provided. When the lead pins are attached to electrode pads, the lead pins are attached to the electrode pads without leaving voids in a conductive agent, and bonding strength of the lead pins are improved. When the wiring board to which the lead pins are attached is reheated, the lead pins are prevented from being inclined or shifted from their normal positions. In the wiring board with lead pins formed by attaching head portions of the lead pins to the electrode pads formed on the wiring board through the conductive agent, the lead pin has notch portions are formed in cut-out shapes in peripheral edge portion of the disk shaped head portion.

公开(公告)号：US20080180121A1

公开(公告)日：2008-07-31

申请号：US12060753

申请日：2008-04-01

Applicant: Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldrdge

Inventor： Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldrdge

IPC: G01R1/073

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以非常紧的间距以与半导体器件的间距相当的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触头适于直接连接带状电缆，带状电缆又可连接以提供与每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

公开(公告)号：US07393217B2

公开(公告)日：2008-07-01

申请号：US11006067

申请日：2004-12-07

Applicant: Kai-Hung Huang ,  Chin-Chi Kuo ,  Tscn-En Li

Inventor： Kai-Hung Huang ,  Chin-Chi Kuo ,  Tscn-En Li

IPC: H01R12/00

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

Abstract: A circuit board assembly includes a first circuit board, at least one surface mount connector, and a second circuit board. The first circuit board has at least a first contact. The surface mount connector is substantially a solid rod and includes a first conducting part coupled to the contact of the first circuit board and a second conducting part having a curvy raised portion at the top surface thereof. The second circuit board has at least a second contact coupled to the second conducting part of the surface mount connector.

Abstract translation: 电路板组件包括第一电路板，至少一个表面安装连接器和第二电路板。 第一电路板至少具有第一接触。 表面安装连接器基本上是实心杆，并且包括耦合到第一电路板的触点的第一导电部分和在其顶表面处具有弯曲的凸起部分的第二导电部分。 第二电路板具有耦合到表面安装连接器的第二导电部分的至少第二触点。