公开(公告)号：US20050227410A1

公开(公告)日：2005-10-13

申请号：US10950241

申请日：2004-09-27

申请人： Nicholas Colella ,  Giles Humpston

发明人： Nicholas Colella ,  Giles Humpston

IPC分类号： H01L21/60 ,  B65B9/06 ,  B65B15/04 ,  H01L21/00 ,  H01L21/44 ,  H01L23/498

CPC分类号： B65B49/04 ,  B65B9/06 ,  B65B15/04 ,  H01L23/4985 ,  H01L24/86 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： An elongated strip of a sheetlike substrate bearing microelectronic elements such as semiconductor chips is advanced in a downstream direction through one or more folding stations where successive portions of the substrate are folded so as to form a strip including a plurality of fold packages, each including confronting top and bottom runs and a fold region with one or more of the runs bearing one or more microelectronic elements. The strip incorporating the plural fold packages can be wound on a reel or otherwise handled, stored and shipped to a subsequent manufacturing operation, where individual fold packages can be severed from the strip.

摘要翻译： 带有诸如半导体芯片的微电子元件的片状基片的细长带沿下游方向前进通过一个或多个折叠站，其中基底的连续部分被折叠以形成包括多个折叠包装的条带，每个折叠包装件包括面对 顶部和底部运行以及具有一个或多个承载一个或多个微电子元件的运行的折叠区域。 包含多个折叠包装的条带可以卷绕在卷轴上或以其他方式处理，存储和运输到随后的制造操作，其中可以从带切断各个折叠包装。

公开(公告)号：US20050082654A1

公开(公告)日：2005-04-21

申请号：US10949575

申请日：2004-09-24

申请人： Giles Humpston ,  Belgacem Haba

发明人： Giles Humpston ,  Belgacem Haba

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L23/02

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making the lidded chip assembly are provided which includes the steps of: (a) aligning a lid member with a chip member including one or more chips so that electrically conductive elements projecting from a front surface of the chip-member extend into through-holes in the lid member and at least partially control location of the lid member relative to the chip member in one or more horizontal directions parallel to the front surface; and (b) forming interconnections extending through the lid member so that the interconnections include the conductive elements. A capped chip is provided in which the conductive interconnects extend from the chip through openings in a cap member, the openings being tapered to become smaller in a direction from the bottom or inner surface of the opening towards the top or outer surface.

摘要翻译： 提供了一种制造带盖芯片组件的方法，其包括以下步骤：（a）将盖构件与包括一个或多个芯片的芯片构件对准，使得从芯片构件的前表面突出的导电元件延伸穿过 并且在平行于前表面的一个或多个水平方向上至少部分地控制盖构件相对于芯片构件的位置; 和（b）形成延伸穿过盖构件的互连，使得互连包括导电元件。 提供了一种封盖芯片，其中导电互连件从芯片通过盖构件中的开口延伸，开口在从开口的底部或内表面朝向顶部或外表面的方向上逐渐变细。

公开(公告)号：US06493231B2

公开(公告)日：2002-12-10

申请号：US09308684

申请日：1999-07-29

申请人： Brian Frederick Nicholson ,  David Michael Jacobson ,  Surinder Pal Singh Sangha ,  Giles Humpston ,  James Hugh Vincent ,  William Martin Lovell

发明人： Brian Frederick Nicholson ,  David Michael Jacobson ,  Surinder Pal Singh Sangha ,  Giles Humpston ,  James Hugh Vincent ,  William Martin Lovell

IPC分类号： H05K900

CPC分类号： H01L23/057 ,  H01L23/06 ,  H01L23/66 ,  H01L2924/0002 ,  H05K9/0022 ,  Y10T403/4602 ,  H01L2924/00

摘要： A housing for a microwave circuit is formed from a base made of metal matrix composite material and walls made of sheet metal. The base and the walls are joined together by diffusion soldering. Some holes to receive feedthroughs are formed at the junction of the base and a wall.

摘要翻译： 用于微波电路的壳体由金属基复合材料制成的基底和由金属片制成的壁形成。 底座和墙壁通过扩散焊接连接在一起。 在基座和墙壁的接合处形成一些用于接收馈通孔的孔。

公开(公告)号：US08551815B2

公开(公告)日：2013-10-08

申请号：US12671993

申请日：2008-08-01

申请人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

发明人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/00 ,  H01L21/50 ,  H01L21/568 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.

摘要翻译： 提供堆叠的微电子单元，其具有远离顶表面的顶表面和底表面以及其中的多个垂直堆叠的微电子元件，包括至少一个微电子元件，其具有与顶表面相邻的前表面和朝向后表面 朝向底面。 每个微电子元件具有从前面的触点延伸超过微电子元件的边缘的迹线。 电介质层接触微电子元件的边缘并且位于至少一个微电子元件的后表面的下方。 引线连接到沿着介电层延伸的迹线。 在顶表面暴露的单元触点连接到引线。

公开(公告)号：US08461672B2

公开(公告)日：2013-06-11

申请号：US12670952

申请日：2008-07-25

申请人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

发明人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

IPC分类号： H01L23/02

CPC分类号： H01L21/50 ,  H01L24/24 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.

摘要翻译： 提供堆叠的微电子单元，其可以包括多个垂直堆叠的微电子元件（12,12A），每个微电子元件具有前表面（117），在前表面暴露的触点（22），后表面（118）和边缘（18 ，20）在前表面和后表面之间延伸。 与触点连接的轨迹（24）可以沿着前表面朝着微电子元件的边缘延伸，其中至少一个堆叠的微电子元件的后表面与微电子单元的顶面（90）相邻。 多个导体（66）可以沿着微电子元件的边缘从迹线（24）延伸到顶面（90）。 导体可以与单元触点（76）导电连接，使得单元触点覆盖邻近顶面的至少一个微电子元件（12A）的后表面（118）。

公开(公告)号：US20120103196A1

公开(公告)日：2012-05-03

申请号：US12914786

申请日：2010-10-28

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： B03C3/36 ,  H01B5/02 ,  B05D5/12 ,  B05D3/02 ,  C23C28/02 ,  C23C14/34 ,  G03G15/02 ,  C25D5/10 ,  B03C3/40

CPC分类号： G03G21/206 ,  B03C3/06 ,  B03C3/60 ,  B03C2201/14 ,  C23C10/28 ,  C23C14/16 ,  C23C14/5806 ,  C25D7/00

摘要： A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. One of the electrodes includes a solid solution formed of a solvent metal having a first performance characteristic and a solute material having a second performance characteristic. The first and second performance characteristics are exhibited substantially independently in the electrode as the solvent metal and solute material remain substantially pure within the solid solution. A method of making an EHD product includes providing an electrode with such a solid solution and positioning the electrode relative to another electrode to motivate fluid flow when energized.

摘要翻译： 热管理装置包括电动液体加速器，其中发射电极和另一电极通电以激励流体流动。 电极之一包括由具有第一性能特性的溶剂金属和具有第二性能特性的溶质材料形成的固溶体。 第一和第二性能特征在电极中基本独立地表现，因为溶剂金属和溶质材料在固溶体中保持基本上纯的。 制造EHD产品的方法包括向电极提供这样的固溶体，并且相对于另一电极定位电极以在通电时激励流体流动。

公开(公告)号：US20110248410A1

公开(公告)日：2011-10-13

申请号：US12671993

申请日：2008-08-01

申请人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

发明人： Osher Avsian ,  Andrey Grinman ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L25/00 ,  H01L21/77 ,  H01L21/58

CPC分类号： H01L25/00 ,  H01L21/50 ,  H01L21/568 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which has a top surface and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements therein, including at least one microelectronic element having a front face adjacent to the top surface and a rear face oriented towards the bottom surface. Each of the microelectronic elements has traces extending from contacts at the front face beyond edges of the microelectronic element. A dielectric layer contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces extending along the dielectric layer. Unit contacts, exposed at the top surface, are connected to the leads.

摘要翻译： 提供堆叠的微电子单元，其具有远离顶表面的顶表面和底表面以及其中的多个垂直堆叠的微电子元件，包括至少一个微电子元件，其具有与顶表面相邻的前表面和朝向后表面 朝向底面。 每个微电子元件具有从前面的触点延伸超过微电子元件的边缘的迹线。 电介质层接触微电子元件的边缘并且位于至少一个微电子元件的后表面的下方。 引线连接到沿着介电层延伸的迹线。 在顶表面暴露的单元触点连接到引线。

公开(公告)号：US07935568B2

公开(公告)日：2011-05-03

申请号：US11590616

申请日：2006-10-31

申请人： Vage Oganesian ,  David Ovrutsky ,  Charles Rosenstein ,  Belgacem Haba ,  Giles Humpston

发明人： Vage Oganesian ,  David Ovrutsky ,  Charles Rosenstein ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L24/06 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/274 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and rear surfaces. At least some of the conductive features are insulated from the exposed semiconductive or conductive material. By electrodeposition, an insulative layer is formed to overlie the at least one of exposed semiconductive material or conductive material. Subsequently, a plurality of conductive contacts and a plurality of conductive traces are formed overlying the electrodeposited insulative layer, the conductive traces connecting the conductive features to the conductive contacts. The unit can be incorporated in a camera module having an optical element in registration with an imaging area of the semiconductor element.

摘要翻译： 提供了一种用于制造包括诸如传感器单元的半导体元件的单元的方法，例如用于光学成像。 半导体元件具有在前表面处暴露的多个导电特征，并且暴露在前表面和后表面中的至少一个上的半导体或导电材料。 至少一些导电特征与暴露的半导电材料或导电材料绝缘。 通过电沉积，形成绝缘层以覆盖暴露的半导体材料或导电材料中的至少一种。 随后，多个导电触点和多个导电迹线形成在电沉积绝缘层上，导电迹线将导电特征连接到导电触点。 该单元可以结合在具有与半导体元件的成像区域对准的光学元件的相机模块中。

公开(公告)号：US20100270679A1

公开(公告)日：2010-10-28

申请号：US12829709

申请日：2010-07-02

申请人： Belgacem Haba ,  Giles Humpston

发明人： Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

摘要翻译： 制造微电子封装的方法包括通过提供具有顶表面，底表面和在顶表面和底表面之间延伸的开口的板来制造子组件，将柔性层附接到板的顶表面，顺应层具有开口， 与延伸穿过板的开口对齐，并且在柔性层上提供导电特征。 在制造子组件之后，板的底表面与半导体晶片的顶表面相连，使得延伸穿过该板的开口与晶片上的触点对准。 柔性层上的至少一些导电特征与半导体晶片上的触点电互连。

公开(公告)号：US20090065907A1

公开(公告)日：2009-03-12

申请号：US12221204

申请日：2008-07-31

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L23/538 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 410 extending from the rear surface through the semiconductor element 401 and through the contacts 403. A dielectric layer 411 can line the through holes 410. A conductive layer 412 may overlie the dielectric layer 411 within the through holes 410. The conductive layer 412 can conductively interconnect the contacts 403 with unit contacts.

摘要翻译： 微电子单元400可以包括具有前表面的半导体元件401，与前表面相邻的微电子半导体器件，在前表面处的触点403和远离前表面的后表面。 半导体元件401可以具有从后表面延伸通过半导体元件401并通过触点403的通孔410.电介质层411可以使通孔410线化。导电层412可覆盖通孔内的电介质层411 导电层412可以将触点403与单元触点导电地互连。