公开(公告)号：US06362557B1

公开(公告)日：2002-03-26

申请号：US09649486

申请日：2000-08-28

申请人： Peter A. Gruber ,  Frederic Maurer ,  George F. Walker

发明人： Peter A. Gruber ,  Frederic Maurer ,  George F. Walker

IPC分类号： H01L4108

CPC分类号： H01L41/0906

摘要： An actuator scaled to macroscopic or microscopic sizes, uses ultrasonic energy to induce motion of an object in a desired direction. The actuator includes one or more pair of piezoelectric transducers connected with a transducer tip. Supplying the piezoelectric transducers with alternating current electrical power causes the tip to vibrate at ultrasonic frequencies. Urging the vibrating tip into contact with a surface on the object at a selected angle of inclination induces the object to move in the desired direction at a rate determined by the inclination angle. Multiple actuators can be used to induce a fall range of movements of variously shaped objects. In microscopic form, the actuator can be used to create a MEMS device. The optional application of a compliant material either on the transducer tip or on the object's surface enhances the movement induced by the actuator.

摘要翻译： 按照宏观或微观尺寸的致动器，使用超声波能量来诱导物体沿所需方向的运动。 致动器包括与换能器尖端连接的一对或多对压电换能器。 为具有交流电功率的压电换能器提供使尖端以超声频率振动。 将振动尖端以选定的倾斜角度与物体上的表面接触，使得物体以由倾斜角确定的速率在所需方向上移动。 可以使用多个致动器来引起各种形状物体的运动的下降范围。 在微观形式中，致动器可用于创建MEMS装置。 在换能器尖端或物体表面上可选地应用柔性材料增强了由致动器引起的运动。

公开(公告)号：US06276596B1

公开(公告)日：2001-08-21

申请号：US09649487

申请日：2000-08-28

申请人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

发明人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

IPC分类号： B23K3102

CPC分类号： H05K3/3468 ,  B23K3/0638 ,  B23K35/0222 ,  B23K2101/40 ,  H01L21/4846 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K2203/074 ,  H05K2203/128

摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.

摘要翻译： 公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。 在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。 然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。 传递板中的多个空腔各具有直的开口和扩口的开口。 然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。 然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。

公开(公告)号：US09082754B2

公开(公告)日：2015-07-14

申请号：US13565982

申请日：2012-08-03

申请人： Peter A. Gruber ,  Jae-Woong Nah

发明人： Peter A. Gruber ,  Jae-Woong Nah

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/00 ,  B23K3/06 ,  H01L23/498 ,  H01L21/48 ,  B23K1/00 ,  B23K26/38 ,  B23K26/40

CPC分类号： H01L23/48 ,  B23K1/0016 ,  B23K3/0607 ,  B23K3/0623 ,  B23K26/384 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  H01L21/4853 ,  H01L23/14 ,  H01L23/147 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11436 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13551 ,  H01L2224/13561 ,  H01L2224/136 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A method and system of producing metal cored solder structures on a substrate which includes: providing a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface; positioning a carrier beneath the bottom of the decal, the carrier having cavities located in alignment with the apertures of the decal; positioning the decal on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities; positioning a plurality of metal elements in the feature cavities; filling the feature cavities with molten solder and cooling the solder; separating the decal from the carrier to partially expose metal core solder contacts; positioning the metal core solder contacts on receiving elements of a substrate; and exposing the metal core solder contacts on the substrate.

摘要翻译： 一种在衬底上制造金属芯焊料结构的方法和系统，包括：提供具有多个孔的贴花，所述孔从顶表面到底表面渐缩; 将载体定位在贴花底部的下方，载体具有与贴花的孔对准的空腔; 将贴花定位在具有贴花底表面的载体上，与载体顶表面接触以形成由贴花孔和载体空腔限定的特征空腔; 将多个金属元件定位在特征腔中; 用熔融焊料填充特征腔并冷却焊料; 将贴花从载体分离以部分地暴露金属芯焊料触点; 将金属芯焊料触点定位在基板的接收元件上; 并将金属芯焊料触点暴露在基板上。

公开(公告)号：US20140035150A1

公开(公告)日：2014-02-06

申请号：US13565982

申请日：2012-08-03

申请人： Peter A. Gruber ,  Jae-Woong Nah

发明人： Peter A. Gruber ,  Jae-Woong Nah

IPC分类号： H01L23/48 ,  H01L21/28

CPC分类号： H01L23/48 ,  B23K1/0016 ,  B23K3/0607 ,  B23K3/0623 ,  B23K26/384 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  H01L21/4853 ,  H01L23/14 ,  H01L23/147 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11436 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13551 ,  H01L2224/13561 ,  H01L2224/136 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A method and system of producing metal cored solder structures on a substrate which includes: providing a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface; positioning a carrier beneath the bottom of the decal, the carrier having cavities located in alignment with the apertures of the decal; positioning the decal on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities; positioning a plurality of metal elements in the feature cavities; filling the feature cavities with molten solder and cooling the solder; separating the decal from the carrier to partially expose metal core solder contacts; positioning the metal core solder contacts on receiving elements of a substrate; and exposing the metal core solder contacts on the substrate.

摘要翻译： 一种在衬底上制造金属芯焊料结构的方法和系统，包括：提供具有多个孔的贴花，所述孔从顶表面到底表面渐缩; 将载体定位在贴花底部的下方，载体具有与贴花的孔对准的空腔; 将贴花定位在具有贴花底表面的载体上，与载体顶表面接触以形成由贴花孔和载体空腔限定的特征空腔; 将多个金属元件定位在特征腔中; 用熔融焊料填充特征腔并冷却焊料; 将贴花从载体分离以部分地暴露金属芯焊料触点; 将金属芯焊料触点定位在基板的接收元件上; 并将金属芯焊料触点暴露在基板上。

公开(公告)号：US08551816B2

公开(公告)日：2013-10-08

申请号：US13439198

申请日：2012-04-04

申请人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

发明人： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC分类号： H01L21/44 ,  H01L23/48

CPC分类号： H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06183 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16137 ,  H01L2224/16238 ,  H01L2224/17183 ,  H01L2224/81005 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/81

摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

公开(公告)号：US08492262B2

公开(公告)日：2013-07-23

申请号：US12706212

申请日：2010-02-16

申请人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

发明人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC分类号： H01L21/44

CPC分类号： H05K3/3452 ,  H01L21/4853 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/10145 ,  H01L2224/1131 ,  H01L2224/11472 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/742 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3468 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/0594 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An assembly is obtained; it includes a substrate; a plurality of wet-able pads formed on a surface of the substrate; and a solder resist layer deposited on the surface of the substrate and having an outer surface. At least the solder resist layer is formed with recessed regions defining volumes adjacent the wet-able pads. Molten solder is directly injected into the volumes adjacent the wet-able pads, such that the volumes adjacent the wet-able pads are filled with solder. The solder is allowed to solidify. It forms a plurality of solder structures adhered to the wet-able pads. The substrate and the solder are re-heated after the solidification, to re-flow the solder into generally spherical balls extending above the outer surface of the solder resist layer. The volumes adjacent the wet-able pads are configured and dimensioned to receive sufficient solder in the injecting step such that the generally spherical balls extend above the outer surface of the solder resist layer as a result of the re-heating step. In an alternative approach, solder injection and solidification are carried out in a nitrogen environment or a forming gas environment, and the reflow step may be omitted.

摘要翻译： 获得组装; 它包括一个基片; 形成在所述基板的表面上的多个可湿式焊盘; 以及沉积在基板的表面上并具有外表面的阻焊层。 至少阻焊层形成有限定与湿润垫相邻的体积的凹陷区域。 将熔融的焊料直接注入到与湿式焊盘相邻的体积中，使得与可湿性焊盘相邻的体积填充有焊料。 使焊料固化。 它形成粘附到湿润垫的多个焊料结构。 在固化之后，将基板和焊料重新加热，以将焊料重新流入延伸到阻焊层的外表面之上的大致球形的球体。 配置和设置相邻于湿式焊盘的体积，以便在注入步骤中接收足够的焊料，使得大致球形球由于再加热步骤而在阻焊层的外表面上方延伸。 在替代方法中，焊料注入和凝固在氮气环境或形成气体环境中进行，并且可以省略回流步骤。

公开(公告)号：US20120205425A1

公开(公告)日：2012-08-16

申请号：US13447906

申请日：2012-04-16

申请人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

发明人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

IPC分类号： B23K1/20

CPC分类号： B23K35/262 ,  H05K3/3463 ,  Y10T403/479 ,  Y10T428/12708

摘要： A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.

摘要翻译： 一种焊接接头，包括在具有电路的基板上的焊料捕获垫; 以及从包含Sn-Ag-Cu焊料，Sn-Cu焊料和Sn-Ag焊料的组中选择的含铅或无铅焊料，其粘附到焊料捕获垫上; 选自包含0.1至6.0重量％Zn的组的焊料。 一种焊接接头，包括在具有电路的基板上的焊料捕获垫; 并且Sn-Cu无铅焊料粘附到焊料捕获垫，焊料包含0.1至6.0重量％的Zn。 阻止在焊料和焊料捕获垫之间的界面处形成空隙。 一种使用焊料形成焊点的方法。

公开(公告)号：US20120201596A1

公开(公告)日：2012-08-09

申请号：US13447888

申请日：2012-04-16

申请人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

发明人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

IPC分类号： H01L23/14

CPC分类号： B23K35/262 ,  H05K3/3463 ,  Y10T403/479 ,  Y10T428/12708

摘要： A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.

公开(公告)号：US20120132694A1

公开(公告)日：2012-05-31

申请号：US13367466

申请日：2012-02-07

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC分类号： B23K3/06

CPC分类号： B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09472 ,  H05K2203/0126 ,  Y10T29/49826 ,  Y10T156/1062 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

摘要翻译： 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。

公开(公告)号：US20120052263A1

公开(公告)日：2012-03-01

申请号：US13292260

申请日：2011-11-09

申请人： Peter A. Gruber ,  Philip Charles Danby Hobbs

发明人： Peter A. Gruber ,  Philip Charles Danby Hobbs

IPC分类号： B32B7/14 ,  B23K1/00

CPC分类号： B32B7/045 ,  B23K3/0623 ,  B23K2101/40 ,  B32B7/14 ,  B32B15/01 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  Y10T428/12347 ,  Y10T428/24562 ,  Y10T428/24826 ,  Y10T428/249921 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。