公开(公告)号：US20090014503A1

公开(公告)日：2009-01-15

申请号：US12217862

申请日：2008-07-09

Applicant: Jae-Hoon Choi ,  Seong-Chan Han ,  Se-Hyung Ryu ,  Nam-Yong Oh

Inventor： Jae-Hoon Choi ,  Seong-Chan Han ,  Se-Hyung Ryu ,  Nam-Yong Oh

IPC: B23K1/005 ,  B23K3/04 ,  B23K1/00

CPC classification number: B23K1/008 ,  B23K2101/40

Abstract: There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate; and a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state.

Abstract translation: 提供回流装置及其方法。 在一些实施例中，回流装置包括第一加热单元，其能够在环境压力下在焊料的熔点之前将衬底上的焊料加热到刚刚下面，使得衬底上的焊料熔化并将电子部件安装在衬底上 然后被焊接到基材上; 以及连接到第一加热单元的第二加热单元，所述第二加热单元能够通过在真空状态下的焊料熔化温度范围的至少一部分来加热在第一加热单元中加热的基板上的焊料。

公开(公告)号：US20080116546A1

公开(公告)日：2008-05-22

申请号：US11984762

申请日：2007-11-21

Applicant: Hyo-Jae Bang ,  Heui-Seog Kim ,  Seong-Chan Han ,  Jung-Hyeon Kim ,  Sung-Hwan Kim

Inventor： Hyo-Jae Bang ,  Heui-Seog Kim ,  Seong-Chan Han ,  Jung-Hyeon Kim ,  Sung-Hwan Kim

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/3107 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49586 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A lead frame unit, a semiconductor package having a lead frame unit, a stacked semiconductor package having a semiconductor package, and methods of manufacturing the same are provided. The lead frame unit in a stacked semiconductor package may include a die pad supporting a semiconductor chip, an inner lead electrically connected to the semiconductor chip, an outer lead extending from the inner lead, and a heat-resistant insulation member surrounding the connection portion. The outer lead may include a connection portion connected to the inner lead and a junction portion connected to the connection portion and a circuit board. An external signal may be applied to the junction portion. If the lead frame unit is used in the stacked semiconductor package, the outer lead and a dummy outer lead in the stacked semiconductor package may have substantially the same shape.

Abstract translation: 提供引线框单元，具有引线框单元的半导体封装，具有半导体封装的堆叠半导体封装及其制造方法。 层叠半导体封装中的引线框架单元可以包括：支撑半导体芯片的管芯焊盘，与半导体芯片电连接的内部引线;从内部引线延伸的外部引线;以及围绕连接部分的耐热绝缘构件。 外引线可以包括连接到内引线的连接部分和连接到连接部分的接合部分和电路板。 外部信号可以施加到接合部分。 如果在叠层半导体封装中使用引线框架单元，则堆叠半导体封装中的外引线和虚外外引线可以具有基本相同的形状。

公开(公告)号：US20080079118A1

公开(公告)日：2008-04-03

申请号：US11862521

申请日：2007-09-27

Applicant: Hyo-jae BANG ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

Inventor： Hyo-jae BANG ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

IPC: H01L29/00 ,  H05K3/30

CPC classification number: H05K1/183 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/184 ,  H05K3/3442 ,  H05K2201/09981 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/0242 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2224/0401

Abstract: A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

Abstract translation: 一种可重复操作的无源元件嵌入式印刷电路板（PCB），其包括板构件，第一和第二填充物以及第一无源元件。 板构件具有彼此间隔开的第一和第二通孔。 第一和第二填充物分别埋在第一和第二通孔中，并由可回流的导电材料形成。 第一无源元件包括第一和第二电极。 第一插入槽形成在第一和第二通孔之间的板构件的表面的一部分中，以及第一和第二填充物的一部分。 第一无源元件安装在第一插入槽上。 第一电极包括底表面和接触第一填充物的一侧和暴露的上表面。 第二电极包括底表面和接触第二填充物的一侧和暴露的上表面。

公开(公告)号：US20080042279A1

公开(公告)日：2008-02-21

申请号：US11842858

申请日：2007-08-21

Applicant: Hyo-Jae BANG ,  Wha-Su SIN ,  Sung-Yeol LEE ,  Yung-Hyun KIM ,  Seong-Chan HAN ,  Jung-Hyeon KIM

Inventor： Hyo-Jae BANG ,  Wha-Su SIN ,  Sung-Yeol LEE ,  Yung-Hyun KIM ,  Seong-Chan HAN ,  Jung-Hyeon KIM

IPC: H01L23/488 ,  H01L21/60 ,  H01L21/66

CPC classification number: H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1369 ,  H01L2224/16 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/4015 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A mounting structure of a semiconductor device and a method of mounting the semiconductor device are provided. The mounting structure includes a circuit substrate having a terminal pad. A device substrate is located over the circuit substrate having a ball pad facing the terminal pad of the circuit substrate. A conductive ball is formed between the circuit substrate and the device substrate in order to connect the terminal pad of the circuit substrate to the ball pad of the device substrate. A first soldering flux including an epoxy-based resin connects the conductive ball to the ball pad of the device substrate. An underfill layer is formed between the circuit substrate and the device substrate in order to bury the conductive ball and the first soldering flux. Using the epoxy-based resin, the first soldering flux can substantially prevent crack from being generated in a solder joint between the conductive ball and the ball pad even when the device substrate is thermally deformed due to temperature variations.

Abstract translation: 提供半导体器件的安装结构和安装半导体器件的方法。 安装结构包括具有终端焊盘的电路基板。 器件衬底位于电路衬底上方，该衬底具有面向电路衬底的端子焊盘的球垫。 在电路基板和器件基板之间形成导电球，以将电路基板的端子焊盘连接到器件基板的球垫。 包括环氧基树脂的第一助焊剂将导电球连接到器件基板的球垫。 在电路基板和器件基板之间形成底部填充层，以便埋入导电球和第一焊剂。 使用环氧树脂，即使当器件基板由于温度变化而发生热变形时，第一焊剂可以基本上防止在导电球和球垫之间的焊接接头中产生裂纹。

公开(公告)号：US20070230751A1

公开(公告)日：2007-10-04

申请号：US11639454

申请日：2006-12-14

Applicant: Hak Il Kim ,  Young Chan Han

Inventor： Hak Il Kim ,  Young Chan Han

IPC: G06K9/00

CPC classification number: G06K9/00067 ,  G06K9/3275

Abstract: A method of correcting distortion caused by fingerprint input sensors of heterogeneous fingerprint recognition systems. The method includes a first step of fabricating a measurement pattern for measuring resolutions of a fingerprint input sensor, a second step of measuring image resolutions of an image, acquired by the fingerprint input sensor, using the fabricated measurement pattern for predetermined locations and directions, a third step of designing control lines for compensating for the distortion caused by the fingerprint input sensor, based on the measured resolutions, a fourth step of obtaining average horizontal and vertical resolutions of the acquired image, a fifth step of modeling the control lines based on a ratio of the average horizontal resolution to the vertical average resolution, and a sixth step of compensating for the distortion of the acquired image based on results of the modeling.

Abstract translation: 一种校正由异质指纹识别系统的指纹输入传感器引起的失真的方法。 该方法包括：制造用于测量指纹输入传感器的分辨率的测量图案的第一步骤，使用所制造的测量图案预定位置和方向来测量由指纹输入传感器获取的图像的图像分辨率的第二步骤， 基于测量分辨率设计用于补偿由指纹输入传感器引起的失真的控制线的第三步骤，获得所获取的图像的平均水平和垂直分辨率的第四步骤，基于 平均水平分辨率与垂直平均分辨率的比率，以及基于建模结果补偿所获取图像的失真的第六步骤。

公开(公告)号：US20070189451A1

公开(公告)日：2007-08-16

申请号：US11703249

申请日：2007-02-07

Applicant: Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han

Inventor： Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han

IPC: G01N23/06 ,  G01F1/66

CPC classification number: G01N21/95607 ,  H01L2224/16225

Abstract: An apparatus for inspecting a semiconductor device may include an external image detector to acquire an exterior image of the semiconductor device, an internal image detector to acquire an interior image of the semiconductor device, and a controller to compare the acquired images with respective references. The apparatus may both inspect the exterior and the interior of the semiconductor device.

Abstract translation: 用于检查半导体器件的装置可以包括：外部图像检测器，用于获取半导体器件的外部图像;内部图像检测器，用于获取半导体器件的内部图像;以及控制器，用于将获取的图像与各自的参考值进行比较。 该装置可以检查半导体器件的外部和内部。

公开(公告)号：US20060091079A1

公开(公告)日：2006-05-04

申请号：US11181681

申请日：2005-07-14

Applicant: Xiaoguang Meng ,  Mazakhir Dadachov ,  Goerge Korfiatis ,  Christos Christodoulatos ,  David Moll ,  Geofrey Onifer ,  Daniel Rice ,  Robert Reim ,  Fredrick Vance ,  Harlan Goltz ,  Chan Han ,  William Harris

Inventor： Xiaoguang Meng ,  Mazakhir Dadachov ,  Goerge Korfiatis ,  Christos Christodoulatos ,  David Moll ,  Geofrey Onifer ,  Daniel Rice ,  Robert Reim ,  Fredrick Vance ,  Harlan Goltz ,  Chan Han ,  William Harris

IPC: C02F1/28

CPC classification number: B01J20/06 ,  B01J20/0211 ,  B01J20/2803 ,  B01J2220/56 ,  B01J2220/58 ,  B82Y30/00 ,  C01G23/053 ,  C01G23/0532 ,  C01P2002/72 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/14 ,  C01P2006/16 ,  C02F1/281 ,  C02F1/283 ,  C02F2101/006 ,  C02F2101/103 ,  C02F2101/20 ,  C02F2101/203 ,  C02F2101/206 ,  C02F2101/22 ,  C02F2307/04 ,  C02F2307/06

Abstract: A method for removing dissolved contaminants from solution using a surface-activated crystalline titanium oxide product having a high adsorptive capacity and a high rate of adsorption with respect to dissolved contaminants, in particular, arsenate and arsenite. Preferably, the titanium oxide product includes crystalline anatase having primary crystallite diameters in the range of 1-30 nm. The surface-activated titanium oxide is combined with other filter media to further improve the removal of dissolved contaminants.

公开(公告)号：US06449156B1

公开(公告)日：2002-09-10

申请号：US09952303

申请日：2001-09-12

Applicant: Seong-Chan Han ,  Dong-Woo Shin ,  Dong-Chun Lee ,  Wang-Jae Lee

Inventor： Seong-Chan Han ,  Dong-Woo Shin ,  Dong-Chun Lee ,  Wang-Jae Lee

IPC: H05K720

CPC classification number: G11C5/04

Abstract: A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.

Abstract translation: 公开了一种新颖的散热器结构，用于安装到模块板，半导体芯片被附着到模块板上，并用于散发或扩散从半导体芯片产生的热量。 散热器包括散热器基座和用于将散热器基座耦合到模块板的耦合装置。 联接装置通过散热器底座。 联接装置包括一体形成的上主体部分和至少穿过下主体部分的孔口，以及与下主体部分一体形成的凸缘基部。 带凸缘的底座将联接装置固定在散热器底座上。 上身部的外部尺寸小于下主体部的内部尺寸。 结果，许多散热器可以稳定堆叠。

公开(公告)号：US5900277A

公开(公告)日：1999-05-04

申请号：US762467

申请日：1996-12-09

Applicant: Richard T. Fox ,  Chan Han ,  Aleksander J. Pyzik ,  Robert T. Nilsson

Inventor： Richard T. Fox ,  Chan Han ,  Aleksander J. Pyzik ,  Robert T. Nilsson

IPC: B22D19/00 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C1/10 ,  G11B5/73 ,  G11B5/84 ,  B05D1/06 ,  B05D1/32

CPC classification number: G11B5/7315 ,  C04B41/5155 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C1/1036 ,  G11B5/8404 ,  C22C2001/1021 ,  C22C2001/1057

Abstract: A process for preparing complex-shaped, ceramic-metal composite articles, comprising:a) contacting a non-wettable powder that is non-wetting to a metal to be used for infiltration with a shaped ceramic body to form a layer(s) of the non-wettable powder on one or more surface(s) of the shaped ceramic body wherein the shaped ceramic body has a region(s) where there is no layer of the non-wettable powder;b) infiltrating the shaped ceramic body with the metal through the region(s) where there is no layer of the non-wettable powder such that a complex-shaped ceramic-metal composite comprising one or more metal phases and one or more ceramic phases is formed, wherein the article has substantially the net shape of the shaped ceramic body and the undesirable regions of excess metal on the surface and undesirable phases within the complex-shaped ceramic-metal composite article near the surface are located only in the region(s) where there is no layer of the non-wettable powder.A complex-shaped ceramic-metal composite article with undesirable regions of excess metal and undesirable phases on the surface(s) of or within the article only where there is or was no layer of non-wettable powder.The process of the invention allows the preparation of complex-shaped ceramic-metal composite articles with undesirable regions of excess metal and undesirable phases on the surface(s) of or within the article only in the regions where there is or was no layer of non-wettable powder. The process of the invention allows the preparation of a complex-shaped ceramic-metal composite article which requires little or no machining of the surface(s) to achieve a finished article. A complex-shaped ceramic-metal composite article is prepared which contains few undesirable regions of excess metal and undesirable phases.

Abstract translation: 一种制备复杂形状的陶瓷 - 金属复合制品的方法，包括：a）将不湿润的非可润湿粉末与用于渗透的金属与成形陶瓷体接触，形成一层 成形陶瓷体的一个或多个表面上的不可湿性粉末，其中成形陶瓷体具有不存在不可湿性粉末层的区域; b）通过不具有不可湿性粉末层的区域将金属渗入成形陶瓷体，使得包含一个或多个金属相和一个或多个陶瓷相的复合形状的陶瓷 - 金属复合材料为 形成，其中制品具有基本上成形陶瓷体的净形状，并且表面上的不需要的过量金属的区域和复合形陶瓷 - 金属复合制品附近的不期望的相位仅位于该区域中， 那里没有一层不可湿润的粉末。 一种复合形状的陶瓷 - 金属复合制品，其中仅在没有或不存在不可湿性粉末层的情况下，在制品的表面或物品的表面上具有不需要的过量金属和不期望的相的区域。 本发明的方法允许制备复合形状的陶瓷 - 金属复合制品，其中在不存在或不存在非层的区域内，在制品表面或制品内表面具有不需要的过量金属和不期望的相的区域， 可润滑的粉末。 本发明的方法允许制备复杂形状的陶瓷 - 金属复合制品，其需要很少或不需要加工表面以实现最终制品。 制备复杂形状的陶瓷 - 金属复合制品，其包含少量不需要的过量金属和不期望的相的区域。

公开(公告)号：US09056377B2

公开(公告)日：2015-06-16

申请号：US13241339

申请日：2011-09-23

Applicant: Chan-Hyung Yun ,  Hyun-Jong Oh ,  Seong-Chan Han ,  Hun Han

Inventor： Chan-Hyung Yun ,  Hyun-Jong Oh ,  Seong-Chan Han ,  Hun Han

IPC: B23C3/00 ,  B23C1/08 ,  B23Q9/00 ,  H05K3/00

CPC classification number: B23Q9/0042 ,  B23C1/08 ,  B23C3/00 ,  H05K3/0052 ,  Y10T409/307728 ,  Y10T409/308568 ,  Y10T409/30924

Abstract: A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.

Abstract translation: 提供路由器设备。 路由器设备包括垂直堆叠的多个面板; 同时切割面板的路由器位; 连接到路由器位的一端的第一支持单元和连接到路由器位的另一端的第二支持单元。 在第二支撑单元中形成导轨，以引导路线钻头的移动。