公开(公告)号：US06566999B2

公开(公告)日：2003-05-20

申请号：US09956076

申请日：2001-09-20

申请人： Masahiko Iwasaki ,  Mitsuaki Hagino ,  Junichi Kasai

发明人： Masahiko Iwasaki ,  Mitsuaki Hagino ,  Junichi Kasai

IPC分类号： B60Q100

CPC分类号： B60T7/22 ,  B60W30/09 ,  B60W2050/143 ,  B60W2520/10 ,  B60W2530/10

摘要： In anti-collision support method and apparatus for an automotive vehicle, a deceleration magnitude adjustment manipulation distance which is another vehicular running distance required to carry out a manipulation of an adjustment for a magnitude of the vehicular deceleration which would ordinarily be carried out at a time immediately before the vehicle is stopped is calculated from the vehicular velocity and the relative distance, a vehicular occupant is informed of an approach of the vehicle to the stop target object while the relative distance is shorter than a distance of the vehicle to a deceleration start position which is determined with the calculated deceleration magnitude adjustment manipulation distance taken into consideration and is shorter than a distance of the vehicle to the stop target object.

公开(公告)号：US06476503B1

公开(公告)日：2002-11-05

申请号：US09606196

申请日：2000-06-29

申请人： Kazuyuki Imamura ,  Yasunori Fujimoto ,  Masaaki Seki ,  Tetsuya Fujisawa ,  Mitsutaka Sato ,  Ryuji Nomoto ,  Junichi Kasai ,  Yoshitaka Aiba ,  Noriaki Shiba

发明人： Kazuyuki Imamura ,  Yasunori Fujimoto ,  Masaaki Seki ,  Tetsuya Fujisawa ,  Mitsutaka Sato ,  Ryuji Nomoto ,  Junichi Kasai ,  Yoshitaka Aiba ,  Noriaki Shiba

IPC分类号： H01L2348

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/12105 ,  H01L2224/13011 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147

摘要： A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. Solder balls are arranged on the surface of the encapsulating resin and connected to the outer ends of the columnar electrodes. In another example, pin wires are formed by half-cutting bonding wires, bonding one end of each of the bonding wires, and cutting the bonding wires at the half-cut portions.

摘要翻译： 一种半导体器件，包括用封装树脂密封的半导体芯片。 柱状电极连接到半导体芯片的电极焊盘，并且延伸穿过封装树脂。 柱状电极由接合线制成，并且包括扩大的外端。 焊球布置在封装树脂的表面上并连接到柱状电极的外端。 在另一个例子中，通过半切割接合线，接合每个接合线的一端，以及在半切部分切割接合线来形成引线。

公开(公告)号：US5842628A

公开(公告)日：1998-12-01

申请号：US628936

申请日：1996-04-08

申请人： Ryuji Nomoto ,  Kazuto Tsuji ,  Mitsutaka Sato ,  Junichi Kasai

发明人： Ryuji Nomoto ,  Kazuto Tsuji ,  Mitsutaka Sato ,  Junichi Kasai

IPC分类号： B23K20/00 ,  H01L21/607 ,  B23K31/02

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  B23K2201/40 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/4945 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85009 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L24/45 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181

摘要： A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead so as to form a predetermined loop, and forming a second ball-shaped part in a predetermined position in the wire; and a second bonding process for bonding the second ball-shaped part to a semiconductor element pad that serves as a second connected member.

摘要翻译： 引线接合方法包括用于在线中形成第一球形部分并将第一球形部分接合到第一连接部件的第一接合工艺; 一种用于将线材从导线接合的位置引导到内部引线以形成预定环路的滚珠形部分形成工艺，并且在线材中的预定位置形成第二球形部分; 以及用于将第二球形部件接合到用作第二连接部件的半导体元件衬垫的第二接合工艺。

公开(公告)号：US5831332A

公开(公告)日：1998-11-03

申请号：US739218

申请日：1996-10-29

申请人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

发明人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

IPC分类号： H01L23/482 ,  H01L23/495 ,  H01L23/58 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K3/303 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01079 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

摘要： A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

公开(公告)号：US5519251A

公开(公告)日：1996-05-21

申请号：US136462

申请日：1993-10-15

申请人： Mitsutaka Sato ,  Junichi Kasai

发明人： Mitsutaka Sato ,  Junichi Kasai

IPC分类号： H01L21/56 ,  H01L21/48 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34

CPC分类号： H01L24/06 ,  H01L21/4835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L24/05 ,  H05K3/3426 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/18165 ,  H01L2924/19107 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T29/49121

摘要： A semiconductor device includes a semiconductor chip (11) having a top surface and a bottom surface, a plurality of leads (14) arranged under the bottom surface of the semiconductor chip (11), where the leads (14) have first ends (14a) electrically coupled to the semiconductor chip (11) and second ends which form external terminals (16) and each of the external terminals have a bottom surface, and a package (17, 31) encapsulating the semiconductor chip (11) and the leads (14) so that the bottom surface of each of the external terminals (16) is exposed at a bottom surface (17a, 31a) of the package (17, 31) and remaining portions of the leads (14) are embedded within the package (17, 31), where the package (17, 31) has a size which is approximately the same as that of the semiconductor chip (11) in a plan view viewed from above the top surface of the semiconductor chip (11).

摘要翻译： 半导体器件包括具有顶表面和底表面的半导体芯片（11），布置在半导体芯片（11）的底表面下方的多个引线（14），其中引线（14）具有第一端（14a ）和形成外部端子（16）的第二端，并且每个外部端子具有底表面，以及封装半导体芯片（11）和引线（21）的封装（17,31） 14），使得每个外部端子（16）的底表面暴露在封装（17,31）的底表面（17a，31a）处，并且引线（14）的剩余部分嵌入封装（ 17,21），其中，在从半导体芯片（11）的上表面观察的平面图中，封装（17,31）的尺寸与半导体芯片（11）的尺寸大致相同。

公开(公告)号：US5508565A

公开(公告)日：1996-04-16

申请号：US355985

申请日：1994-12-14

申请人： Atsushi Hatakeyama ,  Fumio Baba ,  Junichi Kasai ,  Mitsutaka Sato

发明人： Atsushi Hatakeyama ,  Fumio Baba ,  Junichi Kasai ,  Mitsutaka Sato

IPC分类号： H01L23/495 ,  H01L25/065 ,  H01L23/48

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107

摘要： A semiconductor device includes a first chip having a circuit arrangement, and a plurality of first terminals formed on a main surface of the first chip and substantially arranged into a line. The semiconductor device also includes a second chip having a circuit arrangement identical to that of the first chip, and a plurality of second terminals formed on a main surface of the second chip and substantially arranged into a line. The first and second chips are arranged in a predetermined direction perpendicular to the main surfaces of the first and second chips. The semiconductor device also includes a plurality of connecting members connected to the first terminals and the second terminals and provided for external connections.

摘要翻译： 半导体器件包括具有电路布置的第一芯片和形成在第一芯片的主表面上并且基本上布置成一条线的多个第一端子。 半导体器件还包括具有与第一芯片的电路布置相同的电路布置的第二芯片，以及形成在第二芯片的主表面上并且基本上布置成一条线的多个第二端子。 第一和第二芯片沿垂直于第一和第二芯片的主表面的预定方向布置。 半导体器件还包括连接到第一端子和第二端子并被设置用于外部连接的多个连接构件。

公开(公告)号：US5440170A

公开(公告)日：1995-08-08

申请号：US849378

申请日：1992-06-29

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Junichi Kasai

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L29/41

CPC分类号： H01L23/49548 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49558 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/181

摘要： A semiconductor device employs a lead frame including a die pad (24) and a plurality of leads (25) provided outside the die pad, and is manufactured by sealing the die pad and its periphery by a resin after the die pad is fitted with the semiconductor chip (11). The die pad (24) is formed separately from the main part of the lead frame provided with leads, and is rounded at an entire outermost edge thereof and includes a flat plate shape. This die pad can be either formed rounded with ceramic or resin, or formed in metal and given a rounded edge through honing.

摘要翻译： PCT No.PCT / JP91 / 01195 Sec。 371日期：1992年6月29日 102（e）日期1992年6月29日PCT 1991年9月9日PCT公布。 出版物WO92 / 04730 日期：1992年3月19日。半导体器件采用引线框架，该引线框架包括设置在管芯焊盘外部的管芯焊盘（24）和多个引线（25），并通过树脂封装管芯焊盘及其周边 芯片焊盘装配有半导体芯片（11）。 管芯焊盘（24）与设置有引线的引线框架的主要部分分开形成，并且在其整个最外边缘处成圆形，并且包括平板形状。 该模垫可以用陶瓷或树脂形成圆形，或者以金属形成，并通过珩磨赋予圆形边缘。

公开(公告)号：US4720867A

公开(公告)日：1988-01-19

申请号：US628604

申请日：1984-07-06

申请人： Hiroshi Imai ,  Takayuki Yanagishima ,  Junichi Kasai

发明人： Hiroshi Imai ,  Takayuki Yanagishima ,  Junichi Kasai

IPC分类号： H04R1/00 ,  B60R11/00 ,  B60R11/02 ,  H04R1/02 ,  H04R9/06 ,  H04R7/04

CPC分类号： H04R1/023 ,  B60R11/0217 ,  H04R9/066 ,  B60R2011/0024 ,  B60R2011/0043 ,  H04R2499/13

摘要： A woofer system for an automotive audio system is provided with a protective cover extending over a section of a vehicle panel which both forms part of a vehicle body and serves as a speaker diaphragm producing acoustic vibrations at audio frequencies. The cover is in a spaced-apart relationship with said section so as not to interfere with oscillation of the section of the vehicle panel while it is oscillating at audio frequencies. The cover has a support extending toward the vehicle panel and surrounding the section. The support is formed with at least one opening for transmitting acoustic vibrations produced by oscillation of the section of the vehicle panel.

摘要翻译： 一种用于汽车音响系统的低音扬声器系统设置有保护罩，该保护盖延伸在车辆面板的一部分上，两者都形成车体的一部分，并且用作产生音频频率的声振动的扬声器隔膜。 所述盖与所述部分间隔开关系，以便在音频频率振荡时不干扰车辆面板部分的振荡。 盖具有朝向车辆面板延伸并围绕该部分的支撑。 支撑件形成有用于传递由车辆面板的部分的振动产生的声音振动的至少一个开口。

公开(公告)号：US08039943B2

公开(公告)日：2011-10-18

申请号：US12239566

申请日：2008-09-26

申请人： Masahiko Harayama ,  Kouichi Meguro ,  Junichi Kasai

发明人： Masahiko Harayama ,  Kouichi Meguro ,  Junichi Kasai

IPC分类号： H01L23/48

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L21/566 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is provided that includes a semiconductor chip and a resin section that molds the semiconductor chip and has a first through-hole. A through electrode that is electrically coupled to the semiconductor chip, extends through the resin section, and extends between a top edge and a bottom edge of an inner surface of the first through-hole. A cavity which extends between planes corresponding to an upper surface and a lower surface of the resin section is formed inside the first through-hole.

摘要翻译： 提供一种半导体器件，其包括半导体芯片和模制半导体芯片并具有第一通孔的树脂部分。 电耦合到半导体芯片的通孔延伸穿过树脂部分，并且在第一通孔的内表面的顶边缘和底边之间延伸。 在第一通孔的内部形成有在与树脂部的上表面和下表面对应的面之间延伸的空腔。

公开(公告)号：US20070261556A1

公开(公告)日：2007-11-15

申请号：US11662876

申请日：2005-09-21

申请人： Junichi Kasai ,  Yoshinobu Tamura ,  Masashi Gabe ,  Akira Mizuno ,  Kenta Naito ,  Satoru Senbayashi

发明人： Junichi Kasai ,  Yoshinobu Tamura ,  Masashi Gabe ,  Akira Mizuno ,  Kenta Naito ,  Satoru Senbayashi

IPC分类号： B03C3/017

CPC分类号： F01N3/0275 ,  B01D53/32 ,  B01D53/944 ,  B01D2259/818 ,  B03C3/06 ,  B03C3/49 ,  B03C2201/30 ,  F01N3/01 ,  F01N3/021 ,  F01N3/027 ,  F01N3/035 ,  F01N2240/28

摘要： A gas treatment device (1), comprising a charging agglomeration part (10) which charges and agglomerates components targeted for collection in gas by utilizing corona discharge, and a filter part (20) which collects the agglomerated components. The charging agglomeration part (10) is disposed on the upstream side, and the filter part (20) is disposed on the downstream side. By this configuration, using the agglomerating functions and precipitating functions of corona discharge and the precipitating functions of filters, ultra-fine particulates can be agglomerated and enlarged. Moreover, the present invention is a gas treatment device that has high performance and low pressure-loss and that is capable of being configured in a compact form factor such that it can also be used as an exhaust gas purification device mounted onboard an automobile.

摘要翻译： 一种气体处理装置（1），其包括通过利用电晕放电而使用于收集气体的成分进行装填和附聚的装料团聚部（10），以及收集凝聚成分的过滤部（20）。 充电团聚部（10）设置在上游侧，过滤部（20）配置在下游侧。 通过这种结构，使用电晕放电的附聚功能和沉淀功能以及过滤器的沉淀功能，可以使超细微粒团聚和扩大。 此外，本发明是一种气体处理装置，其具有高性能和低压力损失，并且能够以紧凑的形状因子构造，使得其也可以用作安装在汽车上的排气净化装置。